Device and Network Based Communications for Input/Output (I/O) Operative Touch Sensor Device (TSD)

ABSTRACT

A touch sensor device (TSD) includes TSD electrodes associated with a surface of the TSD. Also, an overlay that includes marker electrode(s) is also associated with at least a portion of the surface of the TSD. The TSD also includes drive-sense circuits (DSCs) operably coupled to the plurality of TSD electrodes. A DSC is configured to provide a TSD electrode signal to a TSD electrode and simultaneously to sense a change of the TSD electrode signal based on a change of impedance of the TSD electrode caused by capacitive coupling between the TSD electrode and the marker electrode(s) of the overlay. Processing module(s) is configured to process a digital signal generated by the DSC to determine characteristic(s) of the overlay that is associated with the at least a portion of the surface of the TSD.

CROSS REFERENCE TO RELATED PATENTS/PATENT APPLICATIONS

The present U.S. Utility Patent application claims priority pursuant to35 U.S.C. § 120 as a continuation of U.S. Utility application Ser. No.16/793,043, entitled “Input/Output (I/O) Operative Touch Sensor Device(TSD),” filed Feb. 18, 2020, pending, which is hereby incorporatedherein by reference in its entirety and made part of the present U.S.Utility patent application for all purposes.

INCORPORATION BY REFERENCE

The U.S. Utility application Ser. No. 16/793,078, entitled “SensitivityRegion of Interest Processing (ROIP) for Input/Output (I/O) OperativeTouch Sensor Device (TSD),” filed on Feb. 18, 2020 and now issued asU.S. Pat. No. 11,079,888 on Aug. 3, 2021 which is hereby incorporatedherein by reference in their entirety and made part of the present U.S.Utility Patent application for all purposes.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT DISC

Not Applicable.

BACKGROUND OF THE INVENTION Technical Field of the Invention

This invention relates generally to data communication systems and moreparticularly to sensed data collection and/or communication.

Description of Related Art

Sensors are used in a wide variety of applications ranging from in-homeautomation, to industrial systems, to health care, to transportation,and so on. For example, sensors are placed in bodies, automobiles,airplanes, boats, ships, trucks, motorcycles, cell phones, televisions,touch-screens, industrial plants, appliances, motors, checkout counters,etc. for the variety of applications.

In general, a sensor converts a physical quantity into an electrical oroptical signal. For example, a sensor converts a physical phenomenon,such as a biological condition, a chemical condition, an electriccondition, an electromagnetic condition, a temperature, a magneticcondition, mechanical motion (position, velocity, acceleration, force,pressure), an optical condition, and/or a radioactivity condition, intoan electrical signal.

A sensor includes a transducer, which functions to convert one form ofenergy (e.g., force) into another form of energy (e.g., electricalsignal). There are a variety of transducers to support the variousapplications of sensors. For example, a transducer is capacitor, apiezoelectric transducer, a piezoresistive transducer, a thermaltransducer, a thermal-couple, a photoconductive transducer such as aphotoresistor, a photodiode, and/or phototransistor.

A sensor circuit is coupled to a sensor to provide the sensor with powerand to receive the signal representing the physical phenomenon from thesensor. The sensor circuit includes at least three electricalconnections to the sensor: one for a power supply; another for a commonvoltage reference (e.g., ground); and a third for receiving the signalrepresenting the physical phenomenon. The signal representing thephysical phenomenon will vary from the power supply voltage to ground asthe physical phenomenon changes from one extreme to another (for therange of sensing the physical phenomenon).

The sensor circuits provide the received sensor signals to one or morecomputing devices for processing. A computing device is known tocommunicate data, process data, and/or store data. The computing devicemay be a cellular phone, a laptop, a tablet, a personal computer (PC), awork station, a video game device, a server, and/or a data center thatsupport millions of web searches, stock trades, or on-line purchasesevery hour.

The computing device processes the sensor signals for a variety ofapplications. For example, the computing device processes sensor signalsto determine temperatures of a variety of items in a refrigerated truckduring transit. As another example, the computing device processes thesensor signals to determine a touch on a touchscreen. As yet anotherexample, the computing device processes the sensor signals to determinevarious data points in a production line of a product.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem in accordance with the present invention;

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice in accordance with the present invention;

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present invention;

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present invention;

FIG. 5A is a schematic plot diagram of a computing subsystem inaccordance with the present invention;

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 6 is a schematic block diagram of a drive center circuit inaccordance with the present invention;

FIG. 6A is a schematic block diagram of another embodiment of a drivesense circuit in accordance with the present invention;

FIG. 7 is an example of a power signal graph in accordance with thepresent invention;

FIG. 8 is an example of a sensor graph in accordance with the presentinvention;

FIG. 9 is a schematic block diagram of another example of a power signalgraph in accordance with the present invention;

FIG. 10 is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 11 is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 11A is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit in accordance with the present invention;

FIG. 13 is a schematic block diagram of another embodiment of adrive-sense circuit in accordance with the present invention;

FIG. 14 is a schematic block diagram of an embodiment of a touch sensordevice (TSD) in accordance with the present invention;

FIG. 15 is a schematic block diagram of another embodiment of a touchsensor device (TSD) in accordance with the present invention;

FIG. 16 is a schematic block diagram of various embodiments of electrodepatterns that may be used on a touch sensor device (TSD) in accordancewith the present invention;

FIG. 17 is a schematic block diagram of another embodiment of a touchsensor device (TSD) that is similar to FIG. 15 with the option of usingany desired electrode pattern in accordance with the present invention;

FIG. 18 is a schematic block diagram of another embodiment of a touchsensor device (TSD) in accordance with the present invention;

FIG. 19 is a schematic block diagram of an embodiment of a touch sensordevice (TSD) in accordance with the present invention;

FIG. 20 is a schematic block diagram of another embodiment of a touchsensor device (TSD) in accordance with the present invention;

FIG. 21 is a schematic block diagram of another embodiment of a touchsensor device (TSD) in accordance with the present invention;

FIG. 22 is a schematic block diagram of another embodiment of multipletouch sensor devices (TSDs) in accordance with the present invention;

FIG. 23A is a logic diagram of an embodiment of a method for sensing atouch on a touch sensor device (TSD)(with or without displayfunctionality) in accordance with the present invention;

FIG. 23B is a schematic block diagram of an embodiment of a drive sensecircuit in accordance with the present invention;

FIG. 24 is a schematic block diagram of another embodiment of a drivesense circuit in accordance with the present invention;

FIG. 25 is a schematic block diagram of an embodiment of a DSC that isinteractive with an electrode in accordance with the present invention;

FIG. 26 is a schematic block diagram of another embodiment of a DSC thatis interactive with an electrode in accordance with the presentinvention;

FIG. 27 is a schematic block diagram of various embodiments of touchsensor devices (TSDs), which may or may not include displayfunctionality via a touchscreen display, an liquid crystal display (LCD)operable display, a light emitting diode (LED) operable display, and/orother visual output component, in accordance with the present invention.

FIG. 28A is a schematic block diagram of other various embodiments ofTSDs which may or may not include display functionality via atouchscreen display, an liquid crystal display (LCD) operable display, alight emitting diode (LED) operable display, and/or other visual outputcomponent, as well as 3-D geometric objects, which may or may notinclude TSD functionality, in accordance with the present invention;

FIG. 28B is a schematic block diagram of other various embodiments ofTSDs which may or may not include display functionality via atouchscreen display, an liquid crystal display (LCD) operable display, alight emitting diode (LED) operable display, and/or other visual outputcomponent in accordance with the present invention;

FIG. 29 is a schematic block diagram of various embodiments of a 3-Dgeometric objects, which may or may not include TSD functionality, thatis operative with a TSD in accordance with the present invention;

FIG. 30 is a schematic block diagram of an embodiment of an overlay thatis operative with a TSD in accordance with the present invention;

FIG. 31 is a schematic block diagram of another embodiment of an overlaythat is operative with a TSD in accordance with the present invention;

FIG. 32 is a schematic block diagram of an embodiment of an overlay anda 3-D geometric object, which may or may not include TSD functionality,that are both operative with a TSD in accordance with the presentinvention;

FIG. 33 is a schematic block diagram of various embodiments of overlaysincluding marker electrodes that facilitate identification, locationdetermination, and mapping of the overlays by a TSD in accordance withthe present invention;

FIG. 34 is a schematic block diagram of various embodiments of 3-Dgeometric objects, which may or may not include TSD functionality,including marker electrodes that facilitate identification, locationdetermination, and mapping of the overlays by a TSD in accordance withthe present invention;

FIG. 35A is a schematic block diagram of other various embodiments ofoverlays including marker electrodes that facilitate identification,location determination, and mapping of the overlays by a TSD inaccordance with the present invention;

FIG. 35B is a schematic block diagram of other various embodiments ofoverlays including marker electrodes that facilitate identification,location determination, and mapping of the overlays by a TSD inaccordance with the present invention;

FIG. 36 is a schematic block diagram of various embodiments of TSDsincluding communication functionality, power sourcing, and/or controllerfunctionality in accordance with the present invention;

FIG. 37A is a schematic block diagram of an embodiment of acommunication system including a TSD in accordance with the presentinvention;

FIG. 37B is a schematic block diagram of another embodiment of acommunication system including a TSD in accordance with the presentinvention;

FIG. 38 is a schematic block diagram of another embodiment of acommunication system including a TSD in accordance with the presentinvention;

FIG. 39A is a schematic block diagram of another embodiment of acommunication system including a TSD in accordance with the presentinvention;

FIG. 39B is a schematic block diagram of another embodiment of acommunication system including a TSD in accordance with the presentinvention;

FIG. 40 is a schematic block diagram of various embodiments of TSDs thatare configurable in accordance with the present invention;

FIG. 41 is a schematic block diagram of various embodiments of TSDs thatare configurable and operative with TSDs in accordance with the presentinvention;

FIG. 42 is a schematic block diagram of other various embodiments of 3-Dgeometric objects or TSDs that are configurable and operative with TSDsin accordance with the present invention

FIG. 43A is a schematic block diagram of other various embodiments of3-D geometric objects or TSDs that are configurable and operative withTSDs in accordance with the present invention;

FIG. 43B is a schematic block diagram of other various embodiments of3-D geometric objects or TSDs that are configurable and operative withTSDs in accordance with the present invention;

FIG. 44 is a schematic block diagram of other various embodiments of 3-Dgeometric objects or TSDs that are configurable and operative with TSDsin accordance with the present invention;

FIG. 45 is a schematic block diagram of an embodiment of an overlay thatis operative with a TSD that is configured to perform sensitivity basedregion of interest processing (ROIP) in accordance with the presentinvention;

FIG. 46 is a schematic block diagram of another embodiment of an overlaythat is operative with a TSD that is configured to perform sensitivitybased ROIP in accordance with the present invention;

FIG. 47 is a schematic block diagram of an embodiment of an overlay anda 3-D geometric object, which may or may not include TSD functionality,that are both operative with a TSD that is configured to performsensitivity based ROIP in accordance with the present invention;

FIG. 48 is a schematic block diagram of an embodiment of an overlay thatis operative with a TSD that is configured to perform enable/disablebased ROIP in accordance with the present invention;

FIG. 49 is a schematic block diagram of another embodiment of an overlaythat is operative with a TSD that is configured to performenable/disable based ROIP in accordance with the present invention;

FIG. 50 is a schematic block diagram of an embodiment of an overlay anda 3-D geometric object, which may or may not include TSD functionality,that are both operative with a TSD that is configured to performenable/disable based ROIP in accordance with the present invention;

FIG. 51 is a schematic block diagram of another embodiment of an overlayand a 3-D geometric object, which may or may not include TSDfunctionality, that are both operative with a TSD that is configured toperform enable/disable based ROP in accordance with the presentinvention;

FIG. 52 is a schematic block diagram of various embodiments of TSDs thatare configured to interface with one or more other TSD and/or one ormore other devices that include one or more electrodes in accordancewith the present invention;

FIG. 53A is a schematic block diagram of an embodiment of TSDs that areinterfaced in accordance with the present invention;

FIG. 53B is a schematic block diagram of an embodiment of TSDs that areinterfaced in accordance with the present invention;

FIG. 54A is a schematic block diagram of another embodiment of TSDs thatare interfaced in accordance with the present invention;

FIG. 54B is a schematic block diagram of another embodiment of TSDs thatare interfaced in accordance with the present invention;

FIG. 55 is a schematic block diagram of various embodiments of TSDs thatare interfaced in accordance with the present invention;

FIG. 56 is a schematic block diagram of other various embodiments ofTSDs that are configured to interface with one or more other TSD and/orone or more other devices that include one or more electrodes inaccordance with the present invention; and

FIG. 57 is a schematic block diagram of various embodiments of TSDsand/or one or more other devices that include one or more electrodesthat are interfaced in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem 10 that includes a plurality of computing devices 12-10, one ormore servers 22, one or more databases 24, one or more networks 26, aplurality of drive-sense circuits 28, a plurality of sensors 30, and aplurality of actuators 32. Computing devices 14 include a touchscreen 16with sensors and drive-sensor circuits and computing devices 18 includea touch & tactic screen 20 that includes sensors, actuators, anddrive-sense circuits.

A sensor 30 functions to convert a physical input into an electricaloutput and/or an optical output. The physical input of a sensor may beone of a variety of physical input conditions. For example, the physicalcondition includes one or more of, but is not limited to, acoustic waves(e.g., amplitude, phase, polarization, spectrum, and/or wave velocity);a biological and/or chemical condition (e.g., fluid concentration,level, composition, etc.); an electric condition (e.g., charge, voltage,current, conductivity, permittivity, eclectic field, which includesamplitude, phase, and/or polarization); a magnetic condition (e.g.,flux, permeability, magnetic field, which amplitude, phase, and/orpolarization); an optical condition (e.g., refractive index,reflectivity, absorption, etc.); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). For example, piezoelectric sensorconverts force or pressure into an eclectic signal. As another example,a microphone converts audible acoustic waves into electrical signals.

There are a variety of types of sensors to sense the various types ofphysical conditions. Sensor types include, but are not limited to,capacitor sensors, inductive sensors, accelerometers, piezoelectricsensors, light sensors, magnetic field sensors, ultrasonic sensors,temperature sensors, infrared (IR) sensors, touch sensors, proximitysensors, pressure sensors, level sensors, smoke sensors, and gassensors. In many ways, sensors function as the interface between thephysical world and the digital world by converting real world conditionsinto digital signals that are then processed by computing devices for avast number of applications including, but not limited to, medicalapplications, production automation applications, home environmentcontrol, public safety, and so on.

The various types of sensors have a variety of sensor characteristicsthat are factors in providing power to the sensors, receiving signalsfrom the sensors, and/or interpreting the signals from the sensors. Thesensor characteristics include resistance, reactance, powerrequirements, sensitivity, range, stability, repeatability, linearity,error, response time, and/or frequency response. For example, theresistance, reactance, and/or power requirements are factors indetermining drive circuit requirements. As another example, sensitivity,stability, and/or linear are factors for interpreting the measure of thephysical condition based on the received electrical and/or opticalsignal (e.g., measure of temperature, pressure, etc.).

An actuator 32 converts an electrical input into a physical output. Thephysical output of an actuator may be one of a variety of physicaloutput conditions. For example, the physical output condition includesone or more of, but is not limited to, acoustic waves (e.g., amplitude,phase, polarization, spectrum, and/or wave velocity); a magneticcondition (e.g., flux, permeability, magnetic field, which amplitude,phase, and/or polarization); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). As an example, a piezoelectric actuatorconverts voltage into force or pressure. As another example, a speakerconverts electrical signals into audible acoustic waves.

An actuator 32 may be one of a variety of actuators. For example, anactuator 32 is one of a comb drive, a digital micro-mirror device, anelectric motor, an electroactive polymer, a hydraulic cylinder, apiezoelectric actuator, a pneumatic actuator, a screw jack, aservomechanism, a solenoid, a stepper motor, a shape-memory allow, athermal bimorph, and a hydraulic actuator.

The various types of actuators have a variety of actuatorscharacteristics that are factors in providing power to the actuator andsending signals to the actuators for desired performance. The actuatorcharacteristics include resistance, reactance, power requirements,sensitivity, range, stability, repeatability, linearity, error, responsetime, and/or frequency response. For example, the resistance, reactance,and power requirements are factors in determining drive circuitrequirements. As another example, sensitivity, stability, and/or linearare factors for generating the signaling to send to the actuator toobtain the desired physical output condition.

The computing devices 12, 14, and 18 may each be a portable computingdevice and/or a fixed computing device. A portable computing device maybe a social networking device, a gaming device, a cell phone, a smartphone, a digital assistant, a digital music player, a digital videoplayer, a laptop computer, a handheld computer, a tablet, a video gamecontroller, and/or any other portable device that includes a computingcore. A fixed computing device may be a computer (PC), a computerserver, a cable set-top box, a satellite receiver, a television set, aprinter, a fax machine, home entertainment equipment, a video gameconsole, and/or any type of home or office computing equipment. Thecomputing devices 12, 14, and 18 will be discussed in greater detailwith reference to one or more of FIGS. 2-4 .

A server 22 is a special type of computing device that is optimized forprocessing large amounts of data requests in parallel. A server 22includes similar components to that of the computing devices 12, 14,and/or 18 with more robust processing modules, more main memory, and/ormore hard drive memory (e.g., solid state, hard drives, etc.). Further,a server 22 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a server may be a standalone separate computing device and/ormay be a cloud computing device.

A database 24 is a special type of computing device that is optimizedfor large scale data storage and retrieval. A database 24 includessimilar components to that of the computing devices 12, 14, and/or 18with more hard drive memory (e.g., solid state, hard drives, etc.) andpotentially with more processing modules and/or main memory. Further, adatabase 24 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a database 24 may be a standalone separate computing deviceand/or may be a cloud computing device.

The network 26 includes one more local area networks (LAN) and/or one ormore wide area networks WAN), which may be a public network and/or aprivate network. A LAN may be a wireless-LAN (e.g., Wi-Fi access point,Bluetooth, ZigBee, etc.) and/or a wired network (e.g., Firewire,Ethernet, etc.). A WAN may be a wired and/or wireless WAN. For example,a LAN may be a personal home or business's wireless network and a WAN isthe Internet, cellular telephone infrastructure, and/or satellitecommunication infrastructure.

In an example of operation, computing device 12-1 communicates with aplurality of drive-sense circuits 28, which, in turn, communicate with aplurality of sensors 30. The sensors 30 and/or the drive-sense circuits28 are within the computing device 12-1 and/or external to it. Forexample, the sensors 30 may be external to the computing device 12-1 andthe drive-sense circuits are within the computing device 12-1. Asanother example, both the sensors 30 and the drive-sense circuits 28 areexternal to the computing device 12-1. When the drive-sense circuits 28are external to the computing device, they are coupled to the computingdevice 12-1 via wired and/or wireless communication links as will bediscussed in greater detail with reference to one or more of FIGS.5A-5C.

The computing device 12-1 communicates with the drive-sense circuits 28to; (a) turn them on, (b) obtain data from the sensors (individuallyand/or collectively), (c) instruct the drive sense circuit on how tocommunicate the sensed data to the computing device 12-1, (d) providesignaling attributes (e.g., DC level, AC level, frequency, power level,regulated current signal, regulated voltage signal, regulation of animpedance, frequency patterns for various sensors, different frequenciesfor different sensing applications, etc.) to use with the sensors,and/or (e) provide other commands and/or instructions.

As a specific example, the sensors 30 are distributed along a pipelineto measure flow rate and/or pressure within a section of the pipeline.The drive-sense circuits 28 have their own power source (e.g., battery,power supply, etc.) and are proximally located to their respectivesensors 30. At desired time intervals (milliseconds, seconds, minutes,hours, etc.), the drive-sense circuits 28 provide a regulated sourcesignal or a power signal to the sensors 30. An electrical characteristicof the sensor 30 affects the regulated source signal or power signal,which is reflective of the condition (e.g., the flow rate and/or thepressure) that sensor is sensing.

The drive-sense circuits 28 detect the effects on the regulated sourcesignal or power signals as a result of the electrical characteristics ofthe sensors. The drive-sense circuits 28 then generate signalsrepresentative of change to the regulated source signal or power signalbased on the detected effects on the power signals. The changes to theregulated source signals or power signals are representative of theconditions being sensed by the sensors 30.

The drive-sense circuits 28 provide the representative signals of theconditions to the computing device 12-1. A representative signal may bean analog signal or a digital signal. In either case, the computingdevice 12-1 interprets the representative signals to determine thepressure and/or flow rate at each sensor location along the pipeline.The computing device may then provide this information to the server 22,the database 24, and/or to another computing device for storing and/orfurther processing.

As another example of operation, computing device 12-2 is coupled to adrive-sense circuit 28, which is, in turn, coupled to a senor 30. Thesensor 30 and/or the drive-sense circuit 28 may be internal and/orexternal to the computing device 12-2. In this example, the sensor 30 issensing a condition that is particular to the computing device 12-2. Forexample, the sensor 30 may be a temperature sensor, an ambient lightsensor, an ambient noise sensor, etc. As described above, wheninstructed by the computing device 12-2 (which may be a default settingfor continuous sensing or at regular intervals), the drive-sense circuit28 provides the regulated source signal or power signal to the sensor 30and detects an effect to the regulated source signal or power signalbased on an electrical characteristic of the sensor. The drive-sensecircuit generates a representative signal of the affect and sends it tothe computing device 12-2.

In another example of operation, computing device 12-3 is coupled to aplurality of drive-sense circuits 28 that are coupled to a plurality ofsensors 30 and is coupled to a plurality of drive-sense circuits 28 thatare coupled to a plurality of actuators 32. The generally functionalityof the drive-sense circuits 28 coupled to the sensors 30 in accordancewith the above description.

Since an actuator 32 is essentially an inverse of a sensor in that anactuator converts an electrical signal into a physical condition, whilea sensor converts a physical condition into an electrical signal, thedrive-sense circuits 28 can be used to power actuators 32. Thus, in thisexample, the computing device 12-3 provides actuation signals to thedrive-sense circuits 28 for the actuators 32. The drive-sense circuitsmodulate the actuation signals on to power signals or regulated controlsignals, which are provided to the actuators 32. The actuators 32 arepowered from the power signals or regulated control signals and producethe desired physical condition from the modulated actuation signals.

As another example of operation, computing device 12-x is coupled to adrive-sense circuit 28 that is coupled to a sensor 30 and is coupled toa drive-sense circuit 28 that is coupled to an actuator 32. In thisexample, the sensor 30 and the actuator 32 are for use by the computingdevice 12-x. For example, the sensor 30 may be a piezoelectricmicrophone and the actuator 32 may be a piezoelectric speaker.

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice 12 (e.g., any one of 12-1 through 12-x). The computing device 12includes a core control module 40, one or more processing modules 42,one or more main memories 44, cache memory 46, a video graphicsprocessing module 48, a display 50, an Input-Output (I/O) peripheralcontrol module 52, one or more input interface modules 56, one or moreoutput interface modules 58, one or more network interface modules 60,and one or more memory interface modules 62. A processing module 42 isdescribed in greater detail at the end of the detailed description ofthe invention section and, in an alternative embodiment, has a directionconnection to the main memory 44. In an alternate embodiment, the corecontrol module 40 and the I/O and/or peripheral control module 52 areone module, such as a chipset, a quick path interconnect (QPI), and/oran ultra-path interconnect (UPI).

Each of the main memories 44 includes one or more Random Access Memory(RAM) integrated circuits, or chips. For example, a main memory 44includes four DDR4 (4^(th) generation of double data rate) RAM chips,each running at a rate of 2,400 MHz. In general, the main memory 44stores data and operational instructions most relevant for theprocessing module 42. For example, the core control module 40coordinates the transfer of data and/or operational instructions fromthe main memory 44 and the memory 64-66. The data and/or operationalinstructions retrieve from memory 64-66 are the data and/or operationalinstructions requested by the processing module or will most likely beneeded by the processing module. When the processing module is done withthe data and/or operational instructions in main memory, the corecontrol module 40 coordinates sending updated data to the memory 64-66for storage.

The memory 64-66 includes one or more hard drives, one or more solidstate memory chips, and/or one or more other large capacity storagedevices that, in comparison to cache memory and main memory devices,is/are relatively inexpensive with respect to cost per amount of datastored. The memory 64-66 is coupled to the core control module 40 viathe I/O and/or peripheral control module 52 and via one or more memoryinterface modules 62. In an embodiment, the I/O and/or peripheralcontrol module 52 includes one or more Peripheral Component Interface(PCI) buses to which peripheral components connect to the core controlmodule 40. A memory interface module 62 includes a software driver and ahardware connector for coupling a memory device to the I/O and/orperipheral control module 52. For example, a memory interface 62 is inaccordance with a Serial Advanced Technology Attachment (SATA) port.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and the network(s) 26 via the I/O and/orperipheral control module 52, the network interface module(s) 60, and anetwork card 68 or 70. A network card 68 or 70 includes a wirelesscommunication unit or a wired communication unit. A wirelesscommunication unit includes a wireless local area network (WLAN)communication device, a cellular communication device, a Bluetoothdevice, and/or a ZigBee communication device. A wired communication unitincludes a Gigabit LAN connection, a Firewire connection, and/or aproprietary computer wired connection. A network interface module 60includes a software driver and a hardware connector for coupling thenetwork card to the I/O and/or peripheral control module 52. Forexample, the network interface module 60 is in accordance with one ormore versions of IEEE 802.11, cellular telephone protocols, 10/100/1000Gigabit LAN protocols, etc.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and input device(s) 72 via the input interfacemodule(s) 56 and the I/O and/or peripheral control module 52. An inputdevice 72 includes a keypad, a keyboard, control switches, a touchpad, amicrophone, a camera, etc. An input interface module 56 includes asoftware driver and a hardware connector for coupling an input device tothe I/O and/or peripheral control module 52. In an embodiment, an inputinterface module 56 is in accordance with one or more Universal SerialBus (USB) protocols.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and output device(s) 74 via the output interfacemodule(s) 58 and the I/O and/or peripheral control module 52. An outputdevice 74 includes a speaker, etc. An output interface module 58includes a software driver and a hardware connector for coupling anoutput device to the I/O and/or peripheral control module 52. In anembodiment, an output interface module 56 is in accordance with one ormore audio codec protocols.

The processing module 42 communicates directly with a video graphicsprocessing module 48 to display data on the display 50. The display 50includes an LED (light emitting diode) display, an LCD (liquid crystaldisplay), and/or other type of display technology. The display has aresolution, an aspect ratio, and other features that affect the qualityof the display. The video graphics processing module 48 receives datafrom the processing module 42, processes the data to produce rendereddata in accordance with the characteristics of the display, and providesthe rendered data to the display 50.

FIG. 2 further illustrates sensors 30 and actuators 32 coupled todrive-sense circuits 28, which are coupled to the input interface module56 (e.g., USB port). Alternatively, one or more of the drive-sensecircuits 28 is coupled to the computing device via a wireless networkcard (e.g., WLAN) or a wired network card (e.g., Gigabit LAN). While notshown, the computing device 12 further includes a BIOS (Basic InputOutput System) memory coupled to the core control module 40.

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice 14 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touchscreen 16, an Input-Output (I/O)peripheral control module 52, one or more input interface modules 56,one or more output interface modules 58, one or more network interfacemodules 60, and one or more memory interface modules 62. The touchscreen16 includes a touchscreen display 80, a plurality of sensors 30, aplurality of drive-sense circuits (DSC), and a touchscreen processingmodule 82.

Computing device 14 operates similarly to computing device 12 of FIG. 2with the addition of a touchscreen as an input device. The touchscreenincludes a plurality of sensors (e.g., electrodes, capacitor sensingcells, capacitor sensors, inductive sensor, etc.) to detect a proximaltouch of the screen. For example, when one or more fingers touches thescreen, capacitance of sensors proximal to the touch(es) are affected(e.g., impedance changes). The drive-sense circuits (DSC) coupled to theaffected sensors detect the change and provide a representation of thechange to the touchscreen processing module 82, which may be a separateprocessing module or integrated into the processing module 42.

The touchscreen processing module 82 processes the representativesignals from the drive-sense circuits (DSC) to determine the location ofthe touch(es). This information is inputted to the processing module 42for processing as an input. For example, a touch represents a selectionof a button on screen, a scroll function, a zoom in-out function, etc.

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice 18 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touch and tactile screen 20, anInput-Output (I/O) peripheral control module 52, one or more inputinterface modules 56, one or more output interface modules 58, one ormore network interface modules 60, and one or more memory interfacemodules 62. The touch and tactile screen 20 includes a touch and tactilescreen display 90, a plurality of sensors 30, a plurality of actuators32, a plurality of drive-sense circuits (DSC), a touchscreen processingmodule 82, and a tactile screen processing module 92.

Computing device 18 operates similarly to computing device 14 of FIG. 3with the addition of a tactile aspect to the screen 20 as an outputdevice. The tactile portion of the screen 20 includes the plurality ofactuators (e.g., piezoelectric transducers to create vibrations,solenoids to create movement, etc.) to provide a tactile feel to thescreen 20. To do so, the processing module creates tactile data, whichis provided to the appropriate drive-sense circuits (DSC) via thetactile screen processing module 92, which may be a stand-aloneprocessing module or integrated into processing module 42. Thedrive-sense circuits (DSC) convert the tactile data into drive-actuatesignals and provide them to the appropriate actuators to create thedesired tactile feel on the screen 20.

FIG. 5A is a schematic plot diagram of a computing subsystem 25 thatincludes a sensed data processing module 65, a plurality ofcommunication modules 61A-x, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1 . The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing devices in which processing modules 42A—xreside.

A drive-sense circuit 28 (or multiple drive-sense circuits), aprocessing module (e.g., 41A), and a communication module (e.g., 61A)are within a common computing device. Each grouping of a drive-sensecircuit(s), processing module, and communication module is in a separatecomputing device. A communication module 61A-x is constructed inaccordance with one or more wired communication protocol and/or one ormore wireless communication protocols that is/are in accordance with theone or more of the Open System Interconnection (OSI) model, theTransmission Control Protocol/Internet Protocol (TCP/IP) model, andother communication protocol module.

In an example of operation, a processing module (e.g., 42A) provides acontrol signal to its corresponding drive-sense circuit 28. Theprocessing module 42 A may generate the control signal, receive it fromthe sensed data processing module 65, or receive an indication from thesensed data processing module 65 to generate the control signal. Thecontrol signal enables the drive-sense circuit 28 to provide a drivesignal to its corresponding sensor. The control signal may furtherinclude a reference signal having one or more frequency components tofacilitate creation of the drive signal and/or interpreting a sensedsignal received from the sensor.

Based on the control signal, the drive-sense circuit 28 provides thedrive signal to its corresponding sensor (e.g., 1) on a drive & senseline. While receiving the drive signal (e.g., a power signal, aregulated source signal, etc.), the sensor senses a physical condition1-x (e.g., acoustic waves, a biological condition, a chemical condition,an electric condition, a magnetic condition, an optical condition, athermal condition, and/or a mechanical condition). As a result of thephysical condition, an electrical characteristic (e.g., impedance,voltage, current, capacitance, inductance, resistance, reactance, etc.)of the sensor changes, which affects the drive signal. Note that if thesensor is an optical sensor, it converts a sensed optical condition intoan electrical characteristic.

The drive-sense circuit 28 detects the effect on the drive signal viathe drive & sense line and processes the affect to produce a signalrepresentative of power change, which may be an analog or digitalsignal. The processing module 42A receives the signal representative ofpower change, interprets it, and generates a value representing thesensed physical condition. For example, if the sensor is sensingpressure, the value representing the sensed physical condition is ameasure of pressure (e.g., x PSI (pounds per square inch)).

In accordance with a sensed data process function (e.g., algorithm,application, etc.), the sensed data processing module 65 gathers thevalues representing the sensed physical conditions from the processingmodules. Since the sensors 1-x may be the same type of sensor (e.g., apressure sensor), may each be different sensors, or a combinationthereof; the sensed physical conditions may be the same, may each bedifferent, or a combination thereof. The sensed data processing module65 processes the gathered values to produce one or more desired results.For example, if the computing subsystem 25 is monitoring pressure alonga pipeline, the processing of the gathered values indicates that thepressures are all within normal limits or that one or more of the sensedpressures is not within normal limits.

As another example, if the computing subsystem 25 is used in amanufacturing facility, the sensors are sensing a variety of physicalconditions, such as acoustic waves (e.g., for sound proofing, soundgeneration, ultrasound monitoring, etc.), a biological condition (e.g.,a bacterial contamination, etc.) a chemical condition (e.g.,composition, gas concentration, etc.), an electric condition (e.g.,current levels, voltage levels, electro-magnetic interference, etc.), amagnetic condition (e.g., induced current, magnetic field strength,magnetic field orientation, etc.), an optical condition (e.g., ambientlight, infrared, etc.), a thermal condition (e.g., temperature, etc.),and/or a mechanical condition (e.g., physical position, force, pressure,acceleration, etc.).

The computing subsystem 25 may further include one or more actuators inplace of one or more of the sensors and/or in addition to the sensors.When the computing subsystem 25 includes an actuator, the correspondingprocessing module provides an actuation control signal to thecorresponding drive-sense circuit 28. The actuation control signalenables the drive-sense circuit 28 to provide a drive signal to theactuator via a drive & actuate line (e.g., similar to the drive & senseline, but for the actuator). The drive signal includes one or morefrequency components and/or amplitude components to facilitate a desiredactuation of the actuator.

In addition, the computing subsystem 25 may include an actuator andsensor working in concert. For example, the sensor is sensing thephysical condition of the actuator. In this example, a drive-sensecircuit provides a drive signal to the actuator and another drive sensesignal provides the same drive signal, or a scaled version of it, to thesensor. This allows the sensor to provide near immediate and continuoussensing of the actuator's physical condition. This further allows forthe sensor to operate at a first frequency and the actuator to operateat a second frequency.

In an embodiment, the computing subsystem is a stand-alone system for awide variety of applications (e.g., manufacturing, pipelines, testing,monitoring, security, etc.). In another embodiment, the computingsubsystem 25 is one subsystem of a plurality of subsystems forming alarger system. For example, different subsystems are employed based ongeographic location. As a specific example, the computing subsystem 25is deployed in one section of a factory and another computing subsystemis deployed in another part of the factory. As another example,different subsystems are employed based function of the subsystems. As aspecific example, one subsystem monitors a city's traffic lightoperation and another subsystem monitors the city's sewage treatmentplants.

Regardless of the use and/or deployment of the computing system, thephysical conditions it is sensing, and/or the physical conditions it isactuating, each sensor and each actuator (if included) is driven andsensed by a single line as opposed to separate drive and sense lines.This provides many advantages including, but not limited to, lower powerrequirements, better ability to drive high impedance sensors, lower lineto line interference, and/or concurrent sensing functions.

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1 . The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing device, devices, in which processingmodules 42A−x reside.

In an embodiment, the drive-sense circuits 28, the processing modules,and the communication module are within a common computing device. Forexample, the computing device includes a central processing unit thatincludes a plurality of processing modules. The functionality andoperation of the sensed data processing module 65, the communicationmodule 61, the processing modules 42A-x, the drive sense circuits 28,and the sensors 1-x are as discussed with reference to FIG. 5A.

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a processing module 42, a plurality of drivesense circuits 28, and a plurality of sensors 1-x, which may be sensors30 of FIG. 1 . The sensed data processing module 65 is one or moreprocessing modules within one or more servers 22 and/or one moreprocessing modules in one or more computing devices that are differentthan the computing device in which the processing module 42 resides.

In an embodiment, the drive-sense circuits 28, the processing module,and the communication module are within a common computing device. Thefunctionality and operation of the sensed data processing module 65, thecommunication module 61, the processing module 42, the drive sensecircuits 28, and the sensors 1-x are as discussed with reference to FIG.5A.

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a referencesignal circuit 100, a plurality of drive sense circuits 28, and aplurality of sensors 30. The processing module 42 includes a drive-senseprocessing block 104, a drive-sense control block 102, and a referencecontrol block 106. Each block 102-106 of the processing module 42 may beimplemented via separate modules of the processing module, may be acombination of software and hardware within the processing module,and/or may be field programmable modules within the processing module42.

In an example of operation, the drive-sense control block 104 generatesone or more control signals to activate one or more of the drive-sensecircuits 28. For example, the drive-sense control block 102 generates acontrol signal that enables of the drive-sense circuits 28 for a givenperiod of time (e.g., 1 second, 1 minute, etc.). As another example, thedrive-sense control block 102 generates control signals to sequentiallyenable the drive-sense circuits 28. As yet another example, thedrive-sense control block 102 generates a series of control signals toperiodically enable the drive-sense circuits 28 (e.g., enabled onceevery second, every minute, every hour, etc.).

Continuing with the example of operation, the reference control block106 generates a reference control signal that it provides to thereference signal circuit 100. The reference signal circuit 100generates, in accordance with the control signal, one or more referencesignals for the drive-sense circuits 28. For example, the control signalis an enable signal, which, in response, the reference signal circuit100 generates a pre-programmed reference signal that it provides to thedrive-sense circuits 28. In another example, the reference signalcircuit 100 generates a unique reference signal for each of thedrive-sense circuits 28. In yet another example, the reference signalcircuit 100 generates a first unique reference signal for each of thedrive-sense circuits 28 in a first group and generates a second uniquereference signal for each of the drive-sense circuits 28 in a secondgroup.

The reference signal circuit 100 may be implemented in a variety ofways. For example, the reference signal circuit 100 includes a DC(direct current) voltage generator, an AC voltage generator, and avoltage combining circuit. The DC voltage generator generates a DCvoltage at a first level and the AC voltage generator generates an ACvoltage at a second level, which is less than or equal to the firstlevel. The voltage combining circuit combines the DC and AC voltages toproduce the reference signal. As examples, the reference signal circuit100 generates a reference signal similar to the signals shown in FIG. 7, which will be subsequently discussed.

As another example, the reference signal circuit 100 includes a DCcurrent generator, an AC current generator, and a current combiningcircuit. The DC current generator generates a DC current a first currentlevel and the AC current generator generates an AC current at a secondcurrent level, which is less than or equal to the first current level.The current combining circuit combines the DC and AC currents to producethe reference signal.

Returning to the example of operation, the reference signal circuit 100provides the reference signal, or signals, to the drive-sense circuits28. When a drive-sense circuit 28 is enabled via a control signal fromthe drive sense control block 102, it provides a drive signal to itscorresponding sensor 30. As a result of a physical condition, anelectrical characteristic of the sensor is changed, which affects thedrive signal. Based on the detected effect on the drive signal and thereference signal, the drive-sense circuit 28 generates a signalrepresentative of the effect on the drive signal.

The drive-sense circuit provides the signal representative of the effecton the drive signal to the drive-sense processing block 104. Thedrive-sense processing block 104 processes the representative signal toproduce a sensed value 97 of the physical condition (e.g., a digitalvalue that represents a specific temperature, a specific pressure level,etc.). The processing module 42 provides the sensed value 97 to anotherapplication running on the computing device, to another computingdevice, and/or to a server 22.

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a pluralityof drive sense circuits 28, and a plurality of sensors 30. Thisembodiment is similar to the embodiment of FIG. 5D with thefunctionality of the drive-sense processing block 104, a drive-sensecontrol block 102, and a reference control block 106 shown in greaterdetail. For instance, the drive-sense control block 102 includesindividual enable/disable blocks 102-1 through 102-y. An enable/disableblock functions to enable or disable a corresponding drive-sense circuitin a manner as discussed above with reference to FIG. 5D.

The drive-sense processing block 104 includes variance determiningmodules 104-1 a through y and variance interpreting modules 104-2 athrough y. For example, variance determining module 104-1 a receives,from the corresponding drive-sense circuit 28, a signal representativeof a physical condition sensed by a sensor. The variance determiningmodule 104-1 a functions to determine a difference from the signalrepresenting the sensed physical condition with a signal representing aknown, or reference, physical condition. The variance interpretingmodule 104-1 b interprets the difference to determine a specific valuefor the sensed physical condition.

As a specific example, the variance determining module 104-1 a receivesa digital signal of 1001 0110 (150 in decimal) that is representative ofa sensed physical condition (e.g., temperature) sensed by a sensor fromthe corresponding drive-sense circuit 28. With 8-bits, there are 2⁸(256) possible signals representing the sensed physical condition.Assume that the units for temperature is Celsius and a digital value of0100 0000 (64 in decimal) represents the known value for 25 degreeCelsius. The variance determining module 104-b 1 determines thedifference between the digital signal representing the sensed value(e.g., 1001 0110, 150 in decimal) and the known signal value of (e.g.,0100 0000, 64 in decimal), which is 0011 0000 (86 in decimal). Thevariance determining module 104-b 1 then determines the sensed valuebased on the difference and the known value. In this example, the sensedvalue equals 25+86*(100/256)=25+33.6=58.6 degrees Celsius.

FIG. 6 is a schematic block diagram of a drive center circuit 28-acoupled to a sensor 30. The drive sense-sense circuit 28 includes apower source circuit 110 and a power signal change detection circuit112. The sensor 30 includes one or more transducers that have varyingelectrical characteristics (e.g., capacitance, inductance, impedance,current, voltage, etc.) based on varying physical conditions 114 (e.g.,pressure, temperature, biological, chemical, etc.), or vice versa (e.g.,an actuator).

The power source circuit 110 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 116 to the sensor 30. The power sourcecircuit 110 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal, a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The power source circuit 110 generates the power signal 116 to include aDC (direct current) component and/or an oscillating component.

When receiving the power signal 116 and when exposed to a condition 114,an electrical characteristic of the sensor affects 118 the power signal.When the power signal change detection circuit 112 is enabled, itdetects the affect 118 on the power signal as a result of the electricalcharacteristic of the sensor. For example, the power signal is a 1.5voltage signal and, under a first condition, the sensor draws 1 milliampof current, which corresponds to an impedance of 1.5 K Ohms. Under asecond conditions, the power signal remains at 1.5 volts and the currentincreases to 1.5 milliamps. As such, from condition 1 to condition 2,the impedance of the sensor changed from 1.5 K Ohms to 1 K Ohms. Thepower signal change detection circuit 112 determines this change andgenerates a representative signal 120 of the change to the power signal.

As another example, the power signal is a 1.5 voltage signal and, undera first condition, the sensor draws 1 milliamp of current, whichcorresponds to an impedance of 1.5 K Ohms. Under a second conditions,the power signal drops to 1.3 volts and the current increases to 1.3milliamps. As such, from condition 1 to condition 2, the impedance ofthe sensor changed from 1.5 K Ohms to 1 K Ohms. The power signal changedetection circuit 112 determines this change and generates arepresentative signal 120 of the change to the power signal.

The power signal 116 includes a DC component 122 and/or an oscillatingcomponent 124 as shown in FIG. 7 . The oscillating component 124includes a sinusoidal signal, a square wave signal, a triangular wavesignal, a multiple level signal (e.g., has varying magnitude over timewith respect to the DC component), and/or a polygonal signal (e.g., hasa symmetrical or asymmetrical polygonal shape with respect to the DCcomponent). Note that the power signal is shown without affect from thesensor as the result of a condition or changing condition.

In an embodiment, power generating circuit 110 varies frequency of theoscillating component 124 of the power signal 116 so that it can betuned to the impedance of the sensor and/or to be off-set in frequencyfrom other power signals in a system. For example, a capacitancesensor's impedance decreases with frequency. As such, if the frequencyof the oscillating component is too high with respect to thecapacitance, the capacitor looks like a short and variances incapacitances will be missed. Similarly, if the frequency of theoscillating component is too low with respect to the capacitance, thecapacitor looks like an open and variances in capacitances will bemissed.

In an embodiment, the power generating circuit 110 varies magnitude ofthe DC component 122 and/or the oscillating component 124 to improveresolution of sensing and/or to adjust power consumption of sensing. Inaddition, the power generating circuit 110 generates the drive signal110 such that the magnitude of the oscillating component 124 is lessthan magnitude of the DC component 122.

FIG. 6A is a schematic block diagram of a drive center circuit 28-a 1coupled to a sensor 30. The drive sense-sense circuit 28-a 1 includes asignal source circuit 111, a signal change detection circuit 113, and apower source 115. The power source 115 (e.g., a battery, a power supply,a current source, etc.) generates a voltage and/or current that iscombined with a signal 117, which is produced by the signal sourcecircuit 111. The combined signal is supplied to the sensor 30.

The signal source circuit 111 may be a voltage supply circuit (e.g., abattery, a linear regulator, an unregulated DC-to-DC converter, etc.) toproduce a voltage-based signal 117, a current supply circuit (e.g., acurrent source circuit, a current mirror circuit, etc.) to produce acurrent-based signal 117, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The signal source circuit 111 generates the signal 117 to include a DC(direct current) component and/or an oscillating component.

When receiving the combined signal (e.g., signal 117 and power from thepower source) and when exposed to a condition 114, an electricalcharacteristic of the sensor affects 119 the signal. When the signalchange detection circuit 113 is enabled, it detects the affect 119 onthe signal as a result of the electrical characteristic of the sensor.

FIG. 8 is an example of a sensor graph that plots an electricalcharacteristic versus a condition. The sensor has a substantially linearregion in which an incremental change in a condition produces acorresponding incremental change in the electrical characteristic. Thegraph shows two types of electrical characteristics: one that increasesas the condition increases and the other that decreases and thecondition increases. As an example of the first type, impedance of atemperature sensor increases and the temperature increases. As anexample of a second type, a capacitance touch sensor decreases incapacitance as a touch is sensed.

FIG. 9 is a schematic block diagram of another example of a power signalgraph in which the electrical characteristic or change in electricalcharacteristic of the sensor is affecting the power signal. In thisexample, the effect of the electrical characteristic or change inelectrical characteristic of the sensor reduced the DC component but hadlittle to no effect on the oscillating component. For example, theelectrical characteristic is resistance. In this example, the resistanceor change in resistance of the sensor decreased the power signal,inferring an increase in resistance for a relatively constant current.

FIG. 10 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor reduced magnitude of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is impedance of a capacitorand/or an inductor. In this example, the impedance or change inimpedance of the sensor decreased the magnitude of the oscillatingsignal component, inferring an increase in impedance for a relativelyconstant current.

FIG. 11 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor shifted frequency of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is reactance of a capacitorand/or an inductor. In this example, the reactance or change inreactance of the sensor shifted frequency of the oscillating signalcomponent, inferring an increase in reactance (e.g., sensor isfunctioning as an integrator or phase shift circuit).

FIG. 11A is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor changes the frequency of theoscillating component but had little to no effect on the DC component.For example, the sensor includes two transducers that oscillate atdifferent frequencies. The first transducer receives the power signal ata frequency of f₁ and converts it into a first physical condition. Thesecond transducer is stimulated by the first physical condition tocreate an electrical signal at a different frequency f₂. In thisexample, the first and second transducers of the sensor change thefrequency of the oscillating signal component, which allows for moregranular sensing and/or a broader range of sensing.

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit 112 receiving the affected power signal 118 andthe power signal 116 as generated to produce, therefrom, the signalrepresentative 120 of the power signal change. The affect 118 on thepower signal is the result of an electrical characteristic and/or changein the electrical characteristic of a sensor; a few examples of theaffects are shown in FIGS. 8-11A.

In an embodiment, the power signal change detection circuit 112 detect achange in the DC component 122 and/or the oscillating component 124 ofthe power signal 116. The power signal change detection circuit 112 thengenerates the signal representative 120 of the change to the powersignal based on the change to the power signal. For example, the changeto the power signal results from the impedance of the sensor and/or achange in impedance of the sensor. The representative signal 120 isreflective of the change in the power signal and/or in the change in thesensor's impedance.

In an embodiment, the power signal change detection circuit 112 isoperable to detect a change to the oscillating component at a frequency,which may be a phase shift, frequency change, and/or change in magnitudeof the oscillating component. The power signal change detection circuit112 is also operable to generate the signal representative of the changeto the power signal based on the change to the oscillating component atthe frequency. The power signal change detection circuit 112 is furtheroperable to provide feedback to the power source circuit 110 regardingthe oscillating component. The feedback allows the power source circuit110 to regulate the oscillating component at the desired frequency,phase, and/or magnitude.

FIG. 13 is a schematic block diagram of another embodiment of a drivesense circuit 28-b includes a change detection circuit 150, a regulationcircuit 152, and a power source circuit 154. The drive-sense circuit28-b is coupled to the sensor 30, which includes a transducer that hasvarying electrical characteristics (e.g., capacitance, inductance,impedance, current, voltage, etc.) based on varying physical conditions114 (e.g., pressure, temperature, biological, chemical, etc.).

The power source circuit 154 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 158 to the sensor 30. The power sourcecircuit 154 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal or a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal. The power source circuit 154 generates thepower signal 158 to include a DC (direct current) component and anoscillating component.

When receiving the power signal 158 and when exposed to a condition 114,an electrical characteristic of the sensor affects 160 the power signal.When the change detection circuit 150 is enabled, it detects the affect160 on the power signal as a result of the electrical characteristic ofthe sensor 30. The change detection circuit 150 is further operable togenerate a signal 120 that is representative of change to the powersignal based on the detected effect on the power signal.

The regulation circuit 152, when its enabled, generates regulationsignal 156 to regulate the DC component to a desired DC level and/orregulate the oscillating component to a desired oscillating level (e.g.,magnitude, phase, and/or frequency) based on the signal 120 that isrepresentative of the change to the power signal. The power sourcecircuit 154 utilizes the regulation signal 156 to keep the power signalat a desired setting 158 regardless of the electrical characteristic ofthe sensor. In this manner, the amount of regulation is indicative ofthe affect the electrical characteristic had on the power signal.

In an example, the power source circuit 158 is a DC-DC converteroperable to provide a regulated power signal having DC and ACcomponents. The change detection circuit 150 is a comparator and theregulation circuit 152 is a pulse width modulator to produce theregulation signal 156. The comparator compares the power signal 158,which is affected by the sensor, with a reference signal that includesDC and AC components. When the electrical characteristics is at a firstlevel (e.g., a first impedance), the power signal is regulated toprovide a voltage and current such that the power signal substantiallyresembles the reference signal.

When the electrical characteristics changes to a second level (e.g., asecond impedance), the change detection circuit 150 detects a change inthe DC and/or AC component of the power signal 158 and generates therepresentative signal 120, which indicates the changes. The regulationcircuit 152 detects the change in the representative signal 120 andcreates the regulation signal to substantially remove the effect on thepower signal. The regulation of the power signal 158 may be done byregulating the magnitude of the DC and/or AC components, by adjustingthe frequency of AC component, and/or by adjusting the phase of the ACcomponent.

With respect to the operation of various drive-sense circuits asdescribed herein and/or their equivalents, note that the operation ofsuch a drive-sense circuit is operable simultaneously to drive and sensea signal via a single line. In comparison to switched, time-divided,time-multiplexed, etc. operation in which there is switching betweendriving and sensing (e.g., driving at first time, sensing at secondtime, etc.) of different respective signals at separate and distincttimes, the drive-sense circuit is operable simultaneously to performboth driving and sensing of a signal. In some examples, suchsimultaneous driving and sensing is performed via a single line using adrive-sense circuit.

In addition, other alternative implementations of various drive-sensecircuits (DSCs) are described in U.S. Utility patent application Ser.No. 16/113,379, entitled “DRIVE SENSE CIRCUIT WITH DRIVE-SENSE LINE,”(Attorney Docket No. SGS00009), filed Aug. 27, 2018, pending. Anyinstantiation of a drive-sense circuit as described herein may also beimplemented using any of the various implementations of variousdrive-sense circuits (DSCs) described in U.S. Utility patent applicationSer. No. 16/113,379.

In addition, note that the one or more signals provided from adrive-sense circuit (DSC) may be of any of a variety of types. Forexample, such a signal may be based on encoding of one or more bits togenerate one or more coded bits used to generate modulation data (orgenerally, data). For example, a device is configured to perform forwarderror correction (FEC) and/or error checking and correction (ECC) codeof one or more bits to generate one or more coded bits. Examples of FECand/or ECC may include turbo code, convolutional code, trellis codedmodulation (TCM), turbo trellis coded modulation (TTCM), low densityparity check (LDPC) code, Reed-Solomon (RS) code, BCH (Bose andRay-Chaudhuri, and Hocquenghem) code, binary convolutional code (BCC),Cyclic Redundancy Check (CRC), and/or any other type of ECC and/or FECcode and/or combination thereof, etc. Note that more than one type ofECC and/or FEC code may be used in any of various implementationsincluding concatenation (e.g., first ECC and/or FEC code followed bysecond ECC and/or FEC code, etc. such as based on an inner code/outercode architecture, etc.), parallel architecture (e.g., such that firstECC and/or FEC code operates on first bits while second ECC and/or FECcode operates on second bits, etc.), and/or any combination thereof.

Also, the one or more coded bits may then undergo modulation or symbolmapping to generate modulation symbols (e.g., the modulation symbols mayinclude data intended for one or more recipient devices, components,elements, etc.). Note that such modulation symbols may be generatedusing any of various types of modulation coding techniques. Examples ofsuch modulation coding techniques may include binary phase shift keying(BPSK), quadrature phase shift keying (QPSK), 8-phase shift keying(PSK), 16 quadrature amplitude modulation (QAM), 32 amplitude and phaseshift keying (APSK), etc., uncoded modulation, and/or any other desiredtypes of modulation including higher ordered modulations that mayinclude even greater number of constellation points (e.g., 1024 QAM,etc.).

In addition, note that a signal provided from a DSC may be of a uniquefrequency that is different from signals provided from other DSCs. Also,a signal provided from a DSC may include multiple frequenciesindependently or simultaneously. The frequency of the signal can behopped on a pre-arranged pattern. In some examples, a handshake isestablished between one or more DSCs and one or more processing modules(e.g., one or more controllers) such that the one or more DSC is/aredirected by the one or more processing modules regarding which frequencyor frequencies and/or which other one or more characteristics of the oneor more signals to use at one or more respective times and/or in one ormore particular situations.

With respect to any signal that is driven and simultaneously detected bya DSC, note that any additional signal that is coupled into a line, anelectrode, a touch sensor, a bus, a communication link, a battery, aload, an electrical coupling or connection, etc. associated with thatDSC is also detectable. For example, a DSC that is associated with sucha line, an electrode, a touch sensor, a bus, a communication link, abattery, a load, an electrical coupling or connection, etc. isconfigured to detect any signal from one or more other lines,electrodes, touch sensors, buses, communication links, loads, electricalcouplings or connections, etc. that get coupled into that line,electrode, touch sensor, bus, communication link, battery, load,electrical coupling or connection, etc.

Note that the different respective signals that are driven andsimultaneously sensed by one or more DSCs may be differentiated from oneanother. Appropriate filtering and processing can identify the varioussignals given their differentiation, orthogonality to one another,difference in frequency, etc. Other examples described herein and theirequivalents operate using any of a number of different characteristicsother than or in addition to frequency.

Moreover, with respect to any embodiment, diagram, example, etc. thatincludes more than one DSC, note that the DSCs may be implemented in avariety of manners. For example, all of the DSCs may be of the sametype, implementation, configuration, etc. In another example, the firstDSC may be of a first type, implementation, configuration, etc., and asecond DSC may be of a second type, implementation, configuration, etc.that is different than the first DSC. Considering a specific example, afirst DSC may be implemented to detect change of impedance associatedwith a line, an electrode, a touch sensor, a bus, a communication link,an electrical coupling or connection, etc. associated with that firstDSC, while a second DSC may be implemented to detect change of voltageassociated with a line, an electrode, a touch sensor, a bus, acommunication link, an electrical coupling or connection, etc.associated with that second DSC. In addition, note that a third DSC maybe implemented to detect change of a current associated with a line, anelectrode, a touch sensor, a bus, a communication link, an electricalcoupling or connection, etc. associated with that DSC. In general, whilea common reference may be used generally to show a DSC or multipleinstantiations of a DSC within a given embodiment, diagram, example,etc., note that any particular DSC may be implemented in accordance withany manner as described herein, such as described in U.S. Utility patentapplication Ser. No. 16/113,379, etc. and/or their equivalents.

Note that certain of the following diagrams show a computing device(e.g., alternatively referred to as device; the terms computing deviceand device may be used interchangeably) that may include or be coupledto one or more processing modules. In certain instances, the one or moreprocessing modules is configured to communicate with and interact withone or more other devices including one or more of DSCs, one or morecomponents associated with a DSC, one or more components associated witha display, a touch sensor device that may or may not include displayfunctionality (e.g., a touchscreen display with sensors, a panel withoutdisplay functionality that includes one or more sensors, etc., one ormore other components associated with a display, a touchscreen displaywith sensors, or generally a touch sensor device that may or may notinclude display functionality, etc.) Note that any such implementationof one or more processing modules may include integrated memory and/orbe coupled to other memory. At least some of the memory storesoperational instructions to be executed by the one or more processingmodules. In addition, note that the one or more processing modules mayinterface with one or more other computing devices, components,elements, etc. via one or more communication links, networks,communication pathways, channels, etc. (e.g., such as via one or morecommunication interfaces of the computing device, such as may beintegrated into the one or more processing modules or be implemented asa separate component, circuitry, etc.).

In addition, when a DSC is implemented to communicate with and interactwith another element, the DSC is configured simultaneously to transmitand receive one or more signals with the element. For example, a DSC isconfigured simultaneously to sense and to drive one or more signals tothe one element. During transmission of a signal from a DSC, that sameDSC is configured simultaneously to sense the signal being transmittedfrom the DSC and any other signal may be coupled into the signal that isbeing transmitted from the DSC.

In addition, while many examples, embodiments, diagrams, etc. hereininclude one or more DSCs (e.g., coupled to one or more processingmodules and one or more electrodes), note that any instantiation of aDSC may alternatively be implemented using a channel drive circuitry, anAnalog Front End (AFE) that includes analog to digital and/or digital toanalog conversion capability, etc. within alternative embodiments.

FIG. 14 is a schematic block diagram of an embodiment 1400 of a touchsensor device (TSD) in accordance with the present invention. Thisdiagram includes a schematic block diagram of an embodiment of a TSD1410 that is implemented to include a touchscreen display with sensors80 that also includes a plurality of drive-sense circuits (DSCs), atouchscreen processing module 82, a display 83, and a plurality ofelectrodes 85 (e.g., the electrodes operate as the sensors or sensorcomponents into which touch and/or proximity may be detected in thetouchscreen display with sensors 80). The touchscreen display withsensors 80 is coupled to a processing module 42, a video graphicsprocessing module 48, and a display interface 93, which are componentsof a computing device (e.g., one or more of computing devices 14-18), aninteractive display, or other device that includes a touchscreendisplay. An interactive display functions to provide users with aninteractive experience (e.g., touch the screen to obtain information, beentertained, etc.). For example, a store provides interactive displaysfor customers to find certain products, to obtain coupons, to entercontests, etc.

In some examples, note that display functionality and touchscreenfunctionality are both provided by a combined device that may bereferred to as a touchscreen display with sensors 80. However, in otherexamples, note that touchscreen functionality and display functionalityare provided by separate devices, namely, the display 83 and atouchscreen that is implemented separately from the display 83.Generally speaking, different implementations may include displayfunctionality and touchscreen functionality within a combined devicesuch as a touchscreen display with sensors 80, or separately using adisplay 83 and a touchscreen.

There are a variety of other devices that may be implemented to includea touchscreen display. For example, a vending machine includes atouchscreen display to select and/or pay for an item. Another example ofa device having a touchscreen display is an Automated Teller Machine(ATM). As yet another example, an automobile includes a touchscreendisplay for entertainment media control, navigation, climate control,etc.

The touchscreen display with sensors 80 includes a large display 83 thathas a resolution equal to or greater than full high-definition (HD), anaspect ratio of a set of aspect ratios, and a screen size equal to orgreater than thirty-two inches. The following table lists variouscombinations of resolution, aspect ratio, and screen size for thedisplay 83, but it's not an exhaustive list. Other screen sizes,resolutions, aspect ratios, etc. may be implemented within other variousdisplays.

pixel screen screen Width Height aspect aspect size Resolution (lines)(lines) ratio ratio (inches) HD (high 1280 720 1:1 16:9 32, 40, 43,definition) 50, 55, 60, 65, 70, 75, &/or >80 Full HD 1920 1080 1:1 16:932, 40, 43, 50, 55, 60, 65, 70, 75, &/or >80 HD 960 720 4:3 16:9 32, 40,43, 50, 55, 60, 65, 70, 75, &/or >80 HD 1440 1080 4:3 16:9 32, 40, 43,50, 55, 60, 65, 70, 75, &/or >80 HD 1280 1080 3:2 16:9 32, 40, 43, 50,55, 60, 65, 70, 75, &/or >80 QHD 2560 1440 1:1 16:9 32, 40, 43, (quadHD) 50, 55, 60, 65, 70, 75, &/or >80 UHD 3840 2160 1:1 16:9 32, 40, 43,(Ultra 50, 55, 60, HD) or 4K 65, 70, 75, &/or >80 8K 7680 4320 1:1 16:932, 40, 43, 50, 55, 60, 65, 70, 75, &/or >80 HD and 1280->=7680720->=4320 1:1, 2:3,  2:3 50, 55, 60, above etc. 65, 70, 75, &/or >80

The display 83 is one of a variety of types of displays that is operableto render frames of data into visible images. For example, the displayis one or more of: a light emitting diode (LED) display, anelectroluminescent display (ELD), a plasma display panel (PDP), a liquidcrystal display (LCD), an LCD high performance addressing (HPA) display,an LCD thin film transistor (TFT) display, an organic light emittingdiode (OLED) display, a digital light processing (DLP) display, asurface conductive electron emitter (SED) display, a field emissiondisplay (FED), a laser TV display, a carbon nanotubes display, a quantumdot display, an interferometric modulator display (IMOD), and a digitalmicroshutter display (DMS). The display is active in a full display modeor a multiplexed display mode (i.e., only part of the display is activeat a time).

The display 83 further includes integrated electrodes 85 that providethe sensors for the touch sense part of the touchscreen display. Theelectrodes 85 are distributed throughout the display area or wheretouchscreen functionality is desired. For example, a first group of theelectrodes are arranged in rows and a second group of electrodes arearranged in columns. As will be discussed in greater detail withreference to one or more of FIGS. 18, 19, 20, and 21 , the rowelectrodes are separated from the column electrodes by a dielectricmaterial.

The electrodes 85 are comprised of a transparent conductive material andare in-cell or on-cell with respect to layers of the display. Forexample, a conductive trace is placed in-cell or on-cell of a layer ofthe touchscreen display. The transparent conductive material, which issubstantially transparent and has negligible effect on video quality ofthe display with respect to the human eye. For instance, an electrode isconstructed from one or more of: Indium Tin Oxide, Graphene, CarbonNanotubes, Thin Metal Films, Silver Nanowires Hybrid Materials,Aluminum-doped Zinc Oxide (AZO), Amorphous Indium-Zinc Oxide,Gallium-doped Zinc Oxide (GZO), and poly polystyrene sulfonate (PEDOT).

In an example of operation, the processing module 42 is executing anoperating system application 89 and one or more user applications 91.The user applications 91 includes, but is not limited to, a videoplayback application, a spreadsheet application, a word processingapplication, a computer aided drawing application, a photo displayapplication, an image processing application, a database application,etc. While executing an application 91, the processing module generatesdata for display (e.g., video data, image data, text data, etc.). Theprocessing module 42 sends the data to the video graphics processingmodule 48, which converts the data into frames of video 87.

The video graphics processing module 48 sends the frames of video 87(e.g., frames of a video file, refresh rate for a word processingdocument, a series of images, etc.) to the display interface 93. Thedisplay interface 93 provides the frames of video to the display 83,which renders the frames of video into visible images.

In certain examples, one or more images are displayed so as tofacilitate communication of data from a first computing device to asecond computing device via a user. For example, one or more images aredisplayed on the touchscreen display with sensors 80, and when a user isin contact with the one or more images that are displayed on thetouchscreen display with sensors 80, one or more signals that areassociated with the one or more images are coupled via the user toanother computing device. In some examples, the touchscreen display withsensors 80 is implemented within a portable device, such as a cellphone, a smart phone, a tablet, and/or any other such device thatincludes a touching display with sensors 80. Also, in some examples,note that the computing device that is displaying one or more imagesthat are coupled via the user to another computing device does notinclude a touchscreen display with sensors 80, but merely a display thatis implemented to display one or more images. In accordance withoperation of the display, whether implemented as it display alone for atouchscreen display with sensors, as the one or more images aredisplayed, and when the user is in contact with the display (e.g., suchas touching the one or more images with a digit of a hand, such asfound, fingers, etc.) or is was within sufficient proximity tofacilitate coupling of one or more signals that are associated with alot of images, then the signals are coupled via the user to anothercomputing device.

When the display 83 is implemented as a touchscreen display with sensors80, while the display 83 is rendering the frames of video into visibleimages, the drive-sense circuits (DSC) provide sensor signals to theelectrodes 85. When the touchscreen (e.g., which may alternatively bereferred to as screen) is touched, capacitance of the electrodes 85proximal to the touch (i.e., directly or close by) is changed. The DSCsdetect the capacitance change for affected electrodes and provide thedetected change to the touchscreen processing module 82.

The touchscreen processing module 82 processes the capacitance change ofthe effected electrodes to determine one or more specific locations oftouch and provides this information to the processing module 42.Processing module 42 processes the one or more specific locations oftouch to determine if an operation of the application is to be altered.For example, the touch is indicative of a pause command, a fast forwardcommand, a reverse command, an increase volume command, a decreasevolume command, a stop command, a select command, a delete command, etc.

In addition, note that certain implementations of TSDs may be made toinclude many more row electrodes and many more column electrodes thanshown in this diagram as well as others included herein. In certainexamples, a TSD includes tens, hundreds, thousands, etc. or an evenlarger number of row electrodes and/or tens, hundreds, thousands, etc.or an even larger number of column electrodes. In general, a TSD may beimplemented to include one or more electrodes. In certain examples, suchone or more electrodes includes a first group of one or more electrodesimplemented in a first direction and a second group of one or moreelectrodes implemented in a second direction that is different than thefirst direction. In one implementation, the second direction is 90degrees different than the first direction. In another implementation,the second direction is offset from the first direction by some otheramount (e.g., a difference in alignment that is greater than 10 degreesand less than 90 degrees different than the first direction).

FIG. 15 is a schematic block diagram of another embodiment 1500 of a TSD1510 in accordance with the present invention. This diagram has certainsimilarities to the prior diagram and includes a schematic block diagramof another embodiment of a TSD 1510 that includes display functionality,e.g., a touchscreen display 80, and that also includes a plurality ofdrive-sense circuits (DSCs), the touchscreen processing module 82, theprocessing module 42, the video graphics processing module 48, a display83, and a plurality of electrodes 85. The processing module 42 isexecuting an operating system 89 and one or more user applications 91 toproduce data that is processed by the video graphics processing module48 to generate frames of data 87. The processing module 42 provides theframes of data 87 to the display interface 93.

This diagram is similar to the prior diagram with at least one differentbeing that the electrodes 85 are diagonally aligned. Generally speaking,the electrodes 85 may be implemented using any desired pattern,configuration, arrangement, etc. In addition, interfaces (I/Fs) 86provide interfacing between the DSCs and the electrodes 85 appropriatelysuch that a respective DSC services one or more electrodes 85 that arediagonally aligned in this implementation of a TSD 1510. For example,given the diagonally aligned electrodes 85, the DSCs as implemented in aparticular architecture may not align directly with the respectiveelectrodes that they service, and the I/Fs 86 provide for appropriatecoupling between the DSCs and the electrodes 85. The TSD 1510 operatessimilarly to the TSD 1410 of FIG. 14 with the above noted differences.

FIG. 16 is a schematic block diagram of various embodiments 1601 through1617 of electrode patterns that may be used on a TSD in accordance withthe present invention. These diagrams show portions of or cross-sectionsof various embodiments of electrode patterns that may be used inaccordance with any of the various TSDs described herein and/or theirequivalents.

Generally speaking, the various electrodes within a TSD may beimplemented in any desired configuration, pattern, arrangement, etc. Inaddition, note that alternative embodiments may include an electrodethat is a pad, a button, etc. that is not implemented in aconfiguration, pattern, arrangement, etc. that facilitate capacitivecoupling between a first electrode implemented in a first direction anda second electrode implemented in a second direction.

Reference 1601 corresponds to a pattern that includes uniformly spacedvertical electrodes. Reference numeral 1602 corresponds to a patternthat includes uniformly spaced horizontal electrodes. Generallyspeaking, note that the electrodes of such patterns may be aligned inany desired direction. Also, they may be uniformly spaced, non-uniformlyspaced, parallel, non-parallel, etc.

Reference numeral 1603 corresponds to a pattern that includesnon-uniformly spaced vertical electrodes. Reference numeral 1604corresponds to a pattern that includes non-uniformly spaced horizontalelectrodes. Note that the non-uniformity of spacing of the vertical orhorizontal electrodes may be based on any desired pattern, including arepetitive pattern, a random pattern, etc.

Reference numeral 1605 corresponds to a pattern that includes uniformlyspaced slanted/diagonal electrodes. Reference numeral 1606 correspondsto a pattern that includes nonuniformly spliced slanted electrodes.

Reference 1607 corresponds to a pattern that includes a uniformly spacedcheckerboard. Reference 1608 corresponds to a pattern that includesnon-uniformly spaced checkerboard. Note that the non-uniformity ofspacing of the vertical and horizontal electrodes within such anon-uniformly spaced checkerboard pattern may be based on any desiredpattern, including a repetitive pattern, a random pattern, etc. Inaddition, note that a pattern including electrodes extending in variousdirections such as checkerboard may include electrical isolation betweenthe electrodes aligned in one direction and the electrodes aligned inanother direction. For example, considering a checkerboard pattern suchas these, the vertical and horizontal aligned electrodes may beelectrically isolated such that there is not direct electricalconnection between the vertical and horizontal aligned electrodes yetare configured to facilitate capacitive coupling of signals between thevertical and horizontal aligned electrodes.

Reference 1609 corresponds to a pattern that includes curved verticalaligned electrodes. In this particular example, the electrodes are moreclosely aligned to one another near the middle of the pattern than atthe top or the bottom of the pattern. Reference 1610 corresponds to apattern that includes curved horizontal aligned electrodes. In thisparticular example, the electrodes are more closely aligned to oneanother near the middle of the pattern than at the left or the right ofthe pattern.

Reference 1611 corresponds to a pattern that includes a curvedcheckerboard that includes both curved vertical aligned electrodes andcurved horizontal aligned electrodes. Note also that the curved verticalaligned electrodes and curved horizontal aligned electrodes may beelectrically isolated from one another such that such that there is notdirect electrical connection between the vertical aligned electrodes andcurved horizontal aligned electrodes.

Reference 1612 corresponds to a pattern that includes s-shaped verticalaligned electrodes. Note that an alternative pattern may alternativelyinclude s-shaped horizontal aligned electrodes.

Reference 1613 corresponds to a pattern that includes a uniformly spacedslanted/diagonal checkerboard. Reference 1614 corresponds to a patternthat includes a non-uniformly spaced slanted/diagonal checkerboard. Inthis particular example, the electrodes are more closely aligned nearthe corners of this cross-section than in the middle/center of thiscross-section.

Reference 1615 corresponds to a pattern that includes an alternativecurved checkerboard such that some electrodes curve up and back downwhen traversing from left to right and other electrodes curve down andback up when traversing from left to right and other. Reference 1616corresponds to a pattern that includes an alternative curvedcheckerboard such that some electrodes curve to the right and back tothe left when traversing from top to bottom and other electrodes curveto the left and back to the right when traversing from top to bottom.Reference 1617 corresponds to a vertical and slanted/diagonal patternthat includes some electrodes aligned vertically and other electrodesaligned in a slanted/diagonal manner.

For example, considering the patterns shown by reference numerals 1613,1614, 1615, 1616, and 1617 that include electrodes aligned in at least 2different directions may be electrically isolated such that there is notdirect electrical connection between the electrodes aligned in at least2 different directions yet are configured to facilitate capacitivecoupling of signals between the electrodes aligned in at least 2different directions.

Generally speaking, any desired pattern of electrodes may be used in aTSD and may be implemented on any surface, layer, component, etc. of theTSD. In some examples, note that one or more protective layers may beimplemented over electrodes to ensure that they are not damaged, etc.yet still are configured to facilitate capacitive coupling with theelectrodes and/or between electrodes through the one or more protectivelayers.

In addition, with respect to electrodes implemented in differentdirections (e.g., rows and columns, or some other pattern) within a TSD,a mutual capacitance is created between a first electrode implemented ina first direction in a first surface, layer, component, etc. of the TSDand a second electrode implemented in a second direction in a secondsurface, layer, component, etc. of the TSD. In addition, each electrodehas a self-capacitance, which corresponds to a parasitic capacitancecreated by the electrode with respect to other conductors in the TSD(e.g., ground, conductive layer(s), and/or one or more otherelectrodes). Also, a mutual capacitance exists between a first electrodeimplemented in a first direction in a first surface, layer, component,etc. of the TSD and a second electrode implemented in a second directionin a second surface, layer, component, etc. of the TSD. When no touch(e.g., from a user, stylus, other device that may or may not include TSDfunctionality, another other TSD, etc. is present), theself-capacitances and mutual capacitances of the TSD are at a nominalstate. Depending on the length, width, and thickness of the electrodes,separation from the electrodes and other conductive surfaces, anddielectric properties of the layers, the self-capacitances and mutualcapacitances can range from a few pico-Farads to 10's of nano-Farads.

FIG. 17 is a schematic block diagram of another embodiment 1700 of a TSDthat is similar to FIG. 15 with the option of using any desiredelectrode pattern in accordance with the present invention. For example,the electrodes 85 of the TSD 1710 may be implemented using any of thevarious electrode patterns shown within FIG. 16 , or alternatively,using any other desired electrode pattern, configuration, etc. Similarto FIG. 15 , I/Fs 86 provide for appropriate coupling between the DSCsand the electrodes 85 to accommodate any desired electrode pattern andcoupling between the DSCs and the electrodes 85.

FIG. 18 is a schematic block diagram of another embodiment 1800 of atouchscreen display in accordance with the present invention. Thisdiagram includes a schematic block diagram of another embodiment of atouch sensor device (TSD) 1810 that includes display functionality,e.g., a touchscreen display 80, and that also includes a plurality ofdrive-sense circuits (DSCs), the processing module 42, a display 83, anda plurality of electrodes 85. The processing module 42 is executing anoperating system 89 and one or more user applications 91 to produceframes of data 87. The processing module 42 provides the frames of data87 to the display interface 93. The TSD 1810 operates similarly to theTSD 1410 of FIG. 14 with the above noted differences.

FIG. 19 is a schematic block diagram of an embodiment 1900 of a touchsensor device (TSD) in accordance with the present invention. Note thata touch sensor device may or may not include display functionality. Forexample, one example of a touch sensor device includes a touchscreendisplay (e.g., such as described with respect to FIG. 14 or FIG. 15 ).Alternatively, a touch sensor device may include touch sensorfunctionality without including display functionality. In this diagram,an alternative example of a touch sensor device, namely, touch sensordevice 1910, includes sensor 80 but with no display functionality.Generally speaking, any reference to a touch sensor device herein may beused to refer to a touch sensor device that may or may not includedisplay functionality (e.g., a touchscreen display or a touch sensordevice such as touch sensor device 1910 that does not include displayfunctionality). This diagram is similar to FIG. 17 with at least somedifferences being that this diagram includes a touch sensor device 1910with sensors 80. The touch sensor device 1910 of this diagram includes apanel 1912 (e.g., that includes embedded/integrated electrodes 85) thatfacilitates touch sensor functionality. However, the touch sensor device1910 of this diagram does not include display functionality and does notinclude a video graphics processing module 48 or a display interface 93as does FIG. 17 . In addition, the touchscreen processing module 82 ofFIG. 14 , which may include and/or be coupled to memory, is replaced inFIG. 19 by a touch sensor device processing module 1942, which mayinclude and/or be coupled to memory.

The touch sensor device processing module 1942 operates similarly to thetouchscreen processing module 82 of FIG. 17 with respect to touchrelated functionality yet with at least some differences being that thetouch sensor device processing module 1942 does not particularly operatein accordance with display related functionality. For example, the touchsensor device 1910 includes a panel 1912, a plurality of sensors (e.g.,shows as electrodes 85 in the diagram), a plurality of drive-sensecircuits (DSCs), and the touch sensor device processing module 1942. Thetouch sensor device 1910 includes a plurality of sensors (e.g.,electrodes 85, capacitor sensing cells, capacitor sensors, inductivesensor, etc.) to detect a proximal touch of the panel 1912. For example,when one or more fingers, styluses, other components, etc. touches thescreen, capacitance of sensors proximal to the touch(es) are affected(e.g., impedance changes). The drive-sense circuits (DSC) coupled to theaffected sensors detect the change and provide a representation of thechange to the touch sensor device processing module 1942, which may be aseparate processing module or integrated into the processing module 42.

The touch sensor device processing module 1942 processes therepresentative signals from the drive-sense circuits (DSC) to determinethe location of the touch(es). This information is inputted to theprocessing module 42 for processing as an input. For example, a touchrepresents a selection of a location on the panel 1912, a motion on thepanel 1912, a gesture of a user with respect to the panel 1912, etc.

In addition, with respect to this diagram and others herein, note thatthe panel 1912 may be implemented in a variety of ways including in arigid format such as is made when such electrodes are implemented in aTSD that includes display functionality. However, when the panel 1912that includes the electrodes 85, which may be implemented in any desiredpattern, may alternatively be implementation using other non-rigidmaterials that are flexible and allow for adaptability to a variety ofapplications. Such materials may be polymer, flexible plastic, any othermaterials that facilitates capacitive coupling to the electrodes of thepanel 1912 while also allowing flexibility of the panel 1912.

FIG. 20 is a schematic block diagram of another embodiment 2000 of atouch sensor device (TSD) in accordance with the present invention. Thisdiagram has some similarities to prior diagrams including FIG. 19 . Inthis diagram, the functionality from a touch sensor device processingmodule 1942, which may include or be coupled to memory, such as withrespect to FIG. 19 , is integrated into the processing module 42, whichmay include or be coupled to memory. The processing module 42facilitates touch related functionality without specifically supportingdisplay related functionality.

Note that while many of the examples of electrode alignment within apanel or touchscreen display show the electrodes as being aligned withrespect to rows and columns, any other desired configuration ofelectrodes may alternatively be made. For example, electrodes may bearranged angularly such as a first set of electrodes are implemented asextending from upper left to lower right of the panel or touch screendisplay and a second set of electrodes are implemented as extending fromupper right to lower left of the panel or touchscreen display. Generallyspeaking, any desired configuration and implementation of electrodearrangement within such a panel or touchscreen display, including anysuch pattern shown with respect to FIG. 16 , may be implemented withinany such device as described here including various aspects,embodiments, and/or examples of the invention (and/or theirequivalents).

FIG. 21 is a schematic block diagram of another embodiment 2100 of atouch sensor device (TSD) in accordance with the present invention. TheTSD includes one or more drive-sense circuits (DSCs) 28 and one or moreelectrodes 85 in accordance with the present invention. Within thisdiagram, as well as any other diagram described herein, or theirequivalents, the one or electrodes 85 that are in communication with oneor more DSC 28 (e.g., touch sensor electrodes such as may be implementedwithin a TSD configured to facilitate sensing of touch, proximity,gesture, etc.) may be of any of a variety of one or more types includingany one or more of a touch sensor element (e.g., including one or moretouch sensors with or without display functionality), a touchscreenincluding both touch sensor and display functionality, a button, anelectrode, an external controller, one or more rows of electrodes, oneor more columns of electrodes, a matrix of buttons, an array of buttons,a film that includes any desired implementation of components tofacilitate touch sensor operation, and/or any other configuration bywhich interaction with the touch sensor may be performed.

Note that the one or more electrodes 85 may be implemented within any ofa variety of devices including any one or more of a touchscreen, a paddevice, a laptop, a cell phone, a smartphone, a whiteboard, aninteractive display, a navigation system display, an in-vehicle display,a panel (e.g., implemented using rigid or flexible material), etc.,and/or any other device in which one or more touch electrodes 85 may beimplemented.

Note that such interaction of a user with an electrode 85 may correspondto the user touching the touch sensor, the user being in proximatedistance to the touch sensor (e.g., within a sufficient proximity to thetouch sensor that coupling from the user to the touch sensor may beperformed via capacitively coupling (CC), etc. and/or generally anymanner of interacting with the touch sensor that is detectable based onprocessing of signals transmitted to and/or sensed from the touch sensorincluding proximity detection, gesture detection, etc.). With respect tothe various embodiments, implementations, etc. of various respectiveelectrodes as described herein, note that they may also be of any suchvariety of one or more types. For example, electrodes may be implementedwithin any desired shape or style (e.g., lines, buttons, pads, etc.) orinclude any one or more of touch sensor electrodes, capacitive buttons,capacitive sensors, row and column implementations of touch sensorelectrodes such as in a touchscreen, etc.

One example of such user interaction with the one or more electrodes 85is via capacitive coupling between the user and the one or moreelectrodes 85. Such capacitive coupling (CC) may be achieved from auser, via a stylus, an active element such as an electronic pen (e-pen),and/or any other element such as an overlay, another TSD, etc.implemented to facilitate capacitive coupling between the user and theelectrode 85. In some examples, note that the one or more electrodes 85are also implemented to detect user interaction based on user touch(e.g., via capacitive coupling (CC) from a user, such as a user'sfinger, to the one or more electrodes 85).

Another example of such interaction with the one or more electrodes 85is via capacitive coupling between a non-user element and the one ormore electrodes 85. For example, consider a robotic arm, article ofmanufacture, etc. comes into proximity to the one or more electrodes 85,then capacitive coupling between the a robotic arm, article ofmanufacture, etc. may be detected via the one or more electrodes 85.Note that any example, embodiment, etc. described herein correspondingto user interaction with the TSD may analogously be performed based oninteraction of any other object other than a user when interacting withthe TSD.

At the bottom of this diagram, one or more processing modules 42 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 42 may include integrated memory and/or be coupled toother memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 42.

FIG. 22 is a schematic block diagram of another embodiment 2200 ofmultiple touch sensor devices (TSDs) in accordance with the presentinvention. At the bottom of this diagram, a first TSD/1^(st) deviceincludes one or more processing modules 42 includes a first subset ofthe one or more processing modules 42 that are in communication andoperative with a first subset of the one or more DSCs 28 (e.g., those incommunication with one or more row and/or column electrodes of the firstTSD/1^(st) device) and a second TSD/2^(nd) device includes a secondsubset of the one or more processing modules 42 that are incommunication and operative with a second subset of the one or more DSCs28 (e.g., those in communication with one or more row and/or columnelectrodes of the second TSD/2^(nd) device).

In even other examples, the one or more processing modules 42 shown inthe first TSD/1^(st) device or the second TSD/2^(nd) device includes afirst subset of the one or more processing modules 42 that are incommunication and operative with a first subset of the one or more DSCs28 (e.g., those in communication with one or more row and/or columnelectrodes of a TSD) and a second subset of the one or more processingmodules 42 that are in communication and operative with a second subsetof the one or more DSCs 28 (e.g., those in communication with electrodesof an e-pen or some other TSD).

In some examples, the first subset of the one or more processing modules42, a first subset of one or more DSCs 28, and a first subset of one ormore electrodes 85 are implemented within or associated with a firstTSD/1^(st) device, and the second subset of the one or more processingmodules 42, a second subset of one or more DSCs 28, and a second subsetof one or more electrodes 85 are implemented within or associated with asecond TSD/2^(nd) device. The different respective devices (e.g., firstand second) may be similar type devices or different devices. Forexample, they may both be devices that include touch sensors (e.g.,without display functionality). For example, they may both be devicesthat include touchscreens (e.g., with display functionality). Forexample, the first TSD/1^(st) device may be a device that include touchsensors (e.g., with or without display functionality), and the secondTSD/2^(nd) device is an e-pen device.

In an example of operation and implementation, with respect to the firstsubset of the one or more processing modules 42 that are incommunication and operative with a first subset of one or more DSCs 28,a signal #1 is coupled from a first electrode 85 that is incommunication to a first DSC 28 of the first subset of one or more DSCs28 that is in communication and operative with the first subset of theone or more processing modules 42 to a second electrode 85 that is incommunication to a first DSC 28 of the second subset of one or more DSCs28 that is in communication and operative with the second subset of theone or more processing modules 42.

When more than one DSC 28 is included within the first subset of one ormore DSCs 28, the signal #1 may also be coupled from the first electrode85 that is in communication to a first DSC 28 of the first subset of oneor more DSCs 28 that is in communication and operative with the firstsubset of the one or more processing modules 42 to a third electrode 85that is in communication to a second DSC 28 of the second subset of oneor more DSCs 28 that is in communication and operative with the secondsubset of the one or more processing modules 42.

Generally speaking, signals may be coupled between one or moreelectrodes 85 that are in communication and operative with the firstsubset of the one or more DSCs 28 associated with the first subset ofthe one or more processing modules 42 and the one or more electrodes 85that are in communication and operative with the second subset of theone or more DSCs 28 (e.g., signal #1, signal #2). In certain examples,such signals are coupled from one electrode 85 (e.g., such as associatedwith the first TSD/1^(st) device) to one or more other electrodes 85(e.g., such as associated with the second TSD/2^(nd) device).

In some examples, these two different subsets of the one or moreprocessing modules 42 are also in communication with one another (e.g.,via communication effectuated via capacitive coupling between a firstsubset of electrodes 85 serviced by the first subset of the one or moreprocessing modules 42 and a second subset of electrodes 85 serviced bythe first subset of the one or more processing modules 42, via one ormore alternative communication means such as a backplane, a bus, awireless communication path, etc., and/or other means). In someparticular examples, these two different subsets of the one or moreprocessing modules 42 are not in communication with one another directlyother than via the signal coupling between the one or more electrodes 85themselves.

A first group of one or more DSCs 28 is/are implemented simultaneouslyto drive and to sense respective one or more signals provided to a firstof the one or more electrodes 85. In addition, a second group of one ormore DSCs 28 is/are implemented simultaneously to drive and to senserespective one or more other signals provided to a second of the one ormore electrodes 85.

For example, a first DSC 28 is implemented simultaneously to drive andto sense a first signal via a first sensor electrode 85. A second DSC 28is implemented simultaneously to drive and to sense a second signal viaa second sensor electrode 85. Note that any number of additional DSCsimplemented simultaneously to drive and to sense additional signals toadditional electrodes 85 as may be appropriate in certain embodiments.Note also that the respective DSCs 28 may be implemented in a variety ofways. For example, they may be implemented within a device that includesthe one or more electrodes 85, they may be implemented within a TSD suchas a touchscreen that includes display functionality, they may bedistributed among a TSD that includes the one or more electrodes 85 thatdoes not include display functionality, etc.

In this diagram as well as any other diagram herein, note that thedifferent respective signals that are driven and simultaneously sensedvia the electrodes 85 may be differentiated from one another. Forexample, appropriate filtering and processing can identify the varioussignals given their differentiation, orthogonality to one another,difference in frequency, etc. Note that the differentiation among thedifferent respective signals that are driven and simultaneously sensedby the various DSCs 28 may be differentiated based on any one or morecharacteristics such as frequency, amplitude, modulation, modulation &coding set/rate (MCS), forward error correction (FEC) and/or errorchecking and correction (ECC), type, etc.

Other examples described herein and their equivalents operate using anyof a number of different characteristics other than or in addition tofrequency. Differentiation between the signals based on frequencycorresponds to a first signal has a first frequency and a second signalhas a second frequency different than the first frequency.Differentiation between the signals based on amplitude corresponds to athat if first signal has a first amplitude and a second signal has asecond amplitude different than the first amplitude. Note that theamplitude may be a fixed amplitude for a DC signal or the oscillatingamplitude component for a signal having both a DC offset and anoscillating component. Differentiation between the signals based on DCoffset corresponds to a that if first signal has a first DC offset and asecond signal has a second DC offset different than the first DC offset.

Differentiation between the signals based on modulation and/ormodulation & coding set/rate (MCS) corresponds to a first signal has afirst modulation and/or MCS and a second signal has a second modulationand/or MCS different than the first modulation and/or MCS. Examples ofmodulation and/or MCS may include binary phase shift keying (BPSK),quadrature phase shift keying (QPSK) or quadrature amplitude modulation(QAM), 8-phase shift keying (PSK), 16 quadrature amplitude modulation(QAM), 32 amplitude and phase shift keying (APSK), 64-QAM, etc., uncodedmodulation, and/or any other desired types of modulation includinghigher ordered modulations that may include even greater number ofconstellation points (e.g., 1024 QAM, etc.). For example, a first signalmay be of a QAM modulation, and the second signal may be of a 32 APSKmodulation. In an alternative example, a first signal may be of a firstQAM modulation such that the constellation points there and have a firstlabeling/mapping, and the second signal may be of a second QAMmodulation such that the constellation points there and have a secondlabeling/mapping.

Differentiation between the signals based on FEC/ECC corresponds to afirst signal being generated, coded, and/or based on a first FEC/ECC anda second signal being generated, coded, and/or based on a second FEC/ECCthat is different than the first modulation and/or first FEC/ECC.Examples of FEC and/or ECC may include turbo code, convolutional code,turbo trellis coded modulation (TTCM), low density parity check (LDPC)code, Reed-Solomon (RS) code, BCH (Bose and Ray-Chaudhuri, andHocquenghem) code, binary convolutional code (BCC), Cyclic RedundancyCheck (CRC), and/or any other type of ECC and/or FEC code and/orcombination thereof, etc. Note that more than one type of ECC and/or FECcode may be used in any of various implementations includingconcatenation (e.g., first ECC and/or FEC code followed by second ECCand/or FEC code, etc. such as based on an inner code/outer codearchitecture, etc.), parallel architecture (e.g., such that first ECCand/or FEC code operates on first bits while second ECC and/or FEC codeoperates on second bits, etc.), and/or any combination thereof. Forexample, a first signal may be generated, coded, and/or based on a firstLDPC code, and the second signal may be generated, coded, and/or basedon a second LDPC code. In an alternative example, a first signal may begenerated, coded, and/or based on a BCH code, and the second signal maybe generated, coded, and/or based on a turbo code. Differentiationbetween the different respective signals may be made based on a similartype of FEC/ECC, using different characteristics of the FEC/ECC (e.g.,codeword length, redundancy, matrix size, etc. as may be appropriatewith respect to the particular type of FEC/ECC). Alternatively,differentiation between the different respective signals may be madebased on using different types of FEC/ECC for the different respectivesignals.

Differentiation between the signals based on type corresponds to a firstsignal being or a first type and a second signal being of a secondgenerated, coded, and/or based on a second type that is different thanthe first type. Examples of different types of signals include asinusoidal signal, a square wave signal, a triangular wave signal, amultiple level signal, a polygonal signal, a DC signal, etc. Forexample, a first signal may be of a sinusoidal signal type, and thesecond signal may be of a DC signal type. In an alternative example, afirst signal may be of a first sinusoidal signal type having firstsinusoidal characteristics (e.g., first frequency, first amplitude,first DC offset, first phase, etc.), and the second signal may be ofsecond sinusoidal signal type having second sinusoidal characteristics(e.g., second frequency, second amplitude, second DC offset, secondphase, etc.) that is different than the first sinusoidal signal type.

Note that any implementation that differentiates the signals based onone or more characteristics may be used in this and other embodiments,examples, and their equivalents.

FIG. 23A is a logic diagram of an embodiment of a method for sensing atouch on a touch sensor device (TSD)(with or without displayfunctionality) in accordance with the present invention. This diagramincludes a logic diagram of an embodiment of a method 2301 for executionby one or more computing devices for sensing a touch on a TSD that isexecuted by one or more processing modules of one or various types(e.g., 42, 82, 1942 and/or 48 of other figures included herein). Themethod 2301 begins at step 2300 where the processing module generate acontrol signal (e.g., power enable, operation enable, etc.) to enable adrive-sense circuit to monitor the sensor signal on the electrode. Theprocessing module generates additional control signals to enable otherdrive-sense circuits to monitor their respective sensor signals. In anexample, the processing module enables all of the drive-sense circuitsfor continuous sensing for touches of the screen. In another example,the processing module enables a first group of drive-sense circuitscoupled to a first group of row electrodes and enables a second group ofdrive-sense circuits coupled to a second group of column electrodes.

The method 2301 continues at step 2302 where the processing modulereceives a representation of the impedance on the electrode from adrive-sense circuit. In general, the drive-sense circuit provides adrive signal to the electrode. The impedance of the electrode affectsthe drive signal. The effect on the drive signal is interpreted by thedrive-sense circuit to produce the representation of the impedance ofthe electrode. The processing module does this with each activateddrive-sense circuit in serial, in parallel, or in a serial-parallelmanner.

The method 2301 continues at step 2304 where the processing moduleinterprets the representation of the impedance on the electrode todetect a change in the impedance of the electrode. A change in theimpedance is indicative of a touch. For example, an increase inself-capacitance (e.g., the capacitance of the electrode with respect toa reference (e.g., ground, etc.)) is indicative of a touch on theelectrode of a user or other element. As another example, a decrease inmutual capacitance (e.g., the capacitance between a row electrode and acolumn electrode) is also indicative of a touch and/or presence of auser or other element near the electrodes. The processing module doesthis for each representation of the impedance of the electrode itreceives. Note that the representation of the impedance is a digitalvalue, an analog signal, an impedance value, and/or any other analog ordigital way of representing a sensor's impedance.

The method 2301 continues at step 2306 where the processing moduleinterprets the change in the impedance to indicate a touch and/orpresence of a user or other element of the TSD in an area correspondingto the electrode. For each change in impedance detected, the processingmodule indicates a touch and/or presence of a user or other element.Further processing may be done to determine if the touch is a desiredtouch or an undesired touch.

FIG. 23B is a schematic block diagram of an embodiment 2302 of a drivesense circuit in accordance with the present invention. this diagramincludes a schematic block diagram of an embodiment of a drive sensecircuit 28-18 that includes a first conversion circuit 2310 and a secondconversion circuit 2312. The first conversion circuit 2310 converts anelectrode signal 2316 (alternatively a sensor signal, such as when theelectrode 85 includes a sensor, etc.) into a signal 2320 that isrepresentative of the electrode signal and/or change thereof (e.g., notethat such a signal may alternatively be referred to as a sensor signal,a signal representative of a sensor signal and/or change thereof, etc.such as when the electrode 85 includes a sensor, etc.). The secondconversion circuit 2312 generates the drive signal component 2314 fromthe sensed signal 2312. As an example, the first conversion circuit 2310functions to keep the electrode signal 2316 substantially constant(e.g., substantially matching a reference signal) by creating the signal2320 to correspond to changes in a receive signal component 2318 of thesensor signal. The second conversion circuit 2312 functions to generatea drive signal component 2314 of the sensor signal based on the signal2320 substantially to compensate for changes in the receive signalcomponent 2318 such that the electrode signal 2316 remains substantiallyconstant.

In an example, the electrode signal 2316 (e.g., which may be viewed as apower signal, a drive signal, a sensor signal, etc. such as inaccordance with other examples, embodiments, diagrams, etc. herein) isprovided to the electrode 85 as a regulated current signal. Theregulated current (I) signal in combination with the impedance (Z) ofthe electrode creates an electrode voltage (V), where V=I*Z. As theimpedance (Z) of electrode changes, the regulated current (I) signal isadjusted to keep the electrode voltage (V) substantially unchanged. Toregulate the current signal, the first conversion circuit 2310 adjuststhe signal 2320 based on the receive signal component 2318, which isindicative of the impedance of the electrode and change thereof. Thesecond conversion circuit 2312 adjusts the regulated current based onthe changes to the signal 2320.

As another example, the electrode signal 2316 is provided to theelectrode 85 as a regulated voltage signal. The regulated voltage (V)signal in combination with the impedance (Z) of the electrode creates anelectrode current (I), where I=V/Z. As the impedance (Z) of electrodechanges, the regulated voltage (V) signal is adjusted to keep theelectrode current (I) substantially unchanged. To regulate the voltagesignal, the first conversion circuit 2310 adjusts the signal 2320 basedon the receive signal component 2318, which is indicative of theimpedance of the electrode and change thereof. The second conversioncircuit 2312 adjusts the regulated voltage based on the changes to thesignal 2320.

FIG. 24 is a schematic block diagram of another embodiment 2400 of adrive sense circuit in accordance with the present invention. thisdiagram includes a schematic block diagram of another embodiment of adrive sense circuit 28 that includes a first conversion circuit 2310 anda second conversion circuit 2312. The first conversion circuit 2310includes a comparator (comp) and an analog to digital converter 2430.The second conversion circuit 2312 includes a digital to analogconverter 2432, a signal source circuit 2433, and a driver.

In an example of operation, the comparator compares the electrode signal2316 (alternatively, a sensor signal, etc.) to an analog referencesignal 2422 to produce an analog comparison signal 2424. The analogreference signal 2424 includes a DC component and/or an oscillatingcomponent. As such, the electrode signal 2316 will have a substantiallymatching DC component and/or oscillating component. An example of ananalog reference signal 2422 is also described in greater detail withreference to FIG. 7 such as with respect to a power signal graph.

The analog to digital converter 2430 converts the analog comparisonsignal 2424 into the signal 2320. The analog to digital converter (ADC)2430 may be implemented in a variety of ways. For example, the (ADC)2430 is one of: a flash ADC, a successive approximation ADC, aramp-compare ADC, a Wilkinson ADC, an integrating ADC, a delta encodedADC, and/or a sigma-delta ADC. The digital to analog converter (DAC)2432 may be a sigma-delta DAC, a pulse width modulator DAC, a binaryweighted DAC, a successive approximation DAC, and/or a thermometer-codedDAC.

The digital to analog converter (DAC) 2432 converts the signal 2320 intoan analog feedback signal 2426. The signal source circuit 2433 (e.g., adependent current source, a linear regulator, a DC-DC power supply,etc.) generates a regulated source signal 2435 (e.g., a regulatedcurrent signal or a regulated voltage signal) based on the analogfeedback signal 2426. The driver increases power of the regulated sourcesignal 2435 to produce the drive signal component 2314.

FIG. 25 is a schematic block diagram of an embodiment 2500 of a DSC thatis interactive with an electrode in accordance with the presentinvention. Similar to other diagrams, examples, embodiments, etc.herein, the DSC 28-a 2 of this diagram is in communication with one ormore processing modules 42. The DSC 28-a 2 is configured to provide asignal (e.g., a power signal, an electrode signal, transmit signal, amonitoring signal, etc.) to the electrode 85 via a single line andsimultaneously to sense that signal via the single line. In someexamples, sensing the signal includes detection of an electricalcharacteristic of the electrode that is based on a response of theelectrode 85 to that signal. Examples of such an electricalcharacteristic may include detection of an impedance of the electrode 85such as a change of capacitance of the electrode 85, detection of one ormore signals coupled into the electrode 85 such as from one or moreother electrodes, and/or other electrical characteristics.

This embodiment of a DSC 28-a 2 includes a current source 110-1 and apower signal change detection circuit 112-a 1. The power signal changedetection circuit 112-a 1 includes a power source reference circuit 130and a comparator 132. The current source 110-1 may be an independentcurrent source, a dependent current source, a current mirror circuit,etc.

In an example of operation, the power source reference circuit 130provides a current reference 134 with DC and oscillating components tothe current source 110-1. The current source generates a current as thepower signal 116 based on the current reference 134. An electricalcharacteristic of the electrode 85 has an effect on the current powersignal 116. For example, if the impedance of the electrode 85 decreasesand the current power signal 116 remains substantially unchanged, thevoltage across the electrode 85 is decreased.

The comparator 132 compares the current reference 134 with the affectedpower signal 118 to produce the signal 120 that is representative of thechange to the power signal. For example, the current reference signal134 corresponds to a given current (I) times a given impedance (Z). Thecurrent reference generates the power signal to produce the givencurrent (I). If the impedance of the electrode 85 substantially matchesthe given impedance (Z), then the comparator's output is reflective ofthe impedances substantially matching. If the impedance of the electrode85 is greater than the given impedance (Z), then the comparator's outputis indicative of how much greater the impedance of the electrode 85 isthan that of the given impedance (Z). If the impedance of the electrode85 is less than the given impedance (Z), then the comparator's output isindicative of how much less the impedance of the electrode 85 is thanthat of the given impedance (Z).

FIG. 26 is a schematic block diagram of another embodiment 2600 of a DSCthat is interactive with an electrode in accordance with the presentinvention. Similar to other diagrams, examples, embodiments, etc.herein, the DSC 28-a 3 of this diagram is in communication with one ormore processing modules 42. Similar to the previous diagram, althoughproviding a different embodiment of the DSC, the DSC 28-a 3 isconfigured to provide a signal to the electrode 85 via a single line andsimultaneously to sense that signal via the single line. In someexamples, sensing the signal includes detection of an electricalcharacteristic of the electrode 85 that is based on a response of theelectrode 85 to that signal. Examples of such an electricalcharacteristic may include detection of an impedance of the electrode 85such as a change of capacitance of the electrode 85, detection of one ormore signals coupled into the electrode 85 such as from one or moreother electrodes, and/or other electrical characteristics.

This embodiment of a DSC 28-a 3 includes a voltage source 110-2 and apower signal change detection circuit 112-a 2. The power signal changedetection circuit 112-a 2 includes a power source reference circuit130-2 and a comparator 132-2. The voltage source 110-2 may be a battery,a linear regulator, a DC-DC converter, etc.

In an example of operation, the power source reference circuit 130-2provides a voltage reference 136 with DC and oscillating components tothe voltage source 110-2. The voltage source generates a voltage as thepower signal 116 based on the voltage reference 136. An electricalcharacteristic of the electrode 85 has an effect on the voltage powersignal 116. For example, if the impedance of the electrode 85 decreasesand the voltage power signal 116 remains substantially unchanged, thecurrent through the electrode 85 is increased.

The comparator 132 compares the voltage reference 136 with the affectedpower signal 118 to produce the signal 120 that is representative of thechange to the power signal. For example, the voltage reference signal134 corresponds to a given voltage (V) divided by a given impedance (Z).The voltage reference generates the power signal to produce the givenvoltage (V). If the impedance of the electrode 85 substantially matchesthe given impedance (Z), then the comparator's output is reflective ofthe impedances substantially matching. If the impedance of the electrode85 is greater than the given impedance (Z), then the comparator's outputis indicative of how much greater the impedance of the electrode 85 isthan that of the given impedance (Z). If the impedance of the electrode85 is less than the given impedance (Z), then the comparator's output isindicative of how much less the impedance of the electrode 85 is thanthat of the given impedance (Z).

With respect to many of the following diagrams, one or more processingmodules 42, which includes and/or is coupled to memory, is configured tocommunicate and interact with one or more DSCs 28 the coupled to one ormore electrodes of the panel or a touchscreen display such as may beimplemented within a touch sensor device (TSD)(with or without displayfunctionality). In many of the diagrams, the DSCs 28 are shown asinterfacing with electrodes of the panel or touchscreen display (e.g.,via interface 86 that couples to row electrodes and another interface 86that couples to column electrodes). Note that the number of lines thatcoupled the one or more processing modules 42 to the respective one ormore DSCs 28, and from the one or more DSCs 28 to the respectiveinterfaces 86 may be varied (e.g., such as may be described by n and m,which are positive integers greater than or equal to 1). Note that therespective values may be the same or different within differentrespective embodiments and/or examples herein.

Note that the same and/or different respective signals may be drivensimultaneously sensed by the respective one or more DSCs 28 that coupleto electrodes 85 within any of the various embodiments and/or examplesherein. In some examples, a common signal (e.g., having common one ormore characteristics) is implemented in accordance with self signaling,and different respective signals (e.g., different respective signalshaving one or more different characteristics) are implemented inaccordance with mutual signaling as described below. Again, as mentionedabove, note that the different respective signals that are driven andsimultaneously sensed via the electrodes 85 may be differentiated fromone another.

FIG. 27 is a schematic block diagram of various embodiments 2701 through2707 of touch sensor devices (TSDs), which may or may not includedisplay functionality via a touchscreen display, an liquid crystaldisplay (LCD) operable display, a light emitting diode (LED) operabledisplay, and/or other visual output component, in accordance with thepresent invention. For example, one or more means of providing visualoutput that may be observed by a user may be implemented within a TSD.Such a means may be an LED that is eliminated when the TSD isoperational. Such a means may alternatively be a display, such as inaccordance with a touchscreen display associated with at least a portionof the TSD. Such a means may alternatively be a display such asimplemented on a pager type device such as including one or more linesconfigured to display textual information. Note that such a TSD may beimplemented with or without such visual output functionality.

One or more touch sensors are implemented on one or more surfaces of aTSD. For example, a TSD may be implemented to have any desired shape,and one or more touch sensors are implemented on one or more surfaces ofthat particular shape. In certain examples, one or more touch sensorsare implemented on all of surfaces of that particular shape. Forexample, one or more electrodes are implemented on one or more surfacesof the TSD to facilitate capacitive coupling in accordance withdetecting user interaction with the TSD (e.g., such as based on afinger, hand, or other part of a user, from a stylus associated with auser, and/or from active element such as an e-pen, another TSD, etc.associated with a user) and/or in accordance with detecting one or moresignals being coupled into the one or more electrodes of the TSD (e.g.,such as from active element such as an e-pen, another TSD, etc.associated with a user). Also, note that the one or more electrodes maybe implemented underneath a protective layer on the surface of the TSDthrough which capacitive coupling may still be made to the one or moreelectrodes through the protective layer.

Note that the one or more electrodes are coupled to one or more DSCsthat are in communication with one or more processing modules, asdescribed with respect to other diagrams herein (e.g., including FIG.21, 22 , etc.).

Referring to the diagram, TSD 2701 has a flat surface that is generallysquare in shape and has a particular thickness. In addition, in certainexamples, the TSD 2701 one or more holes or voids. Such vacancies caninclude touch sensor functionality (e.g., the surface inside of the holeor void includes electrodes). Also, such vacancies also provide forother components to be implemented therein. For example, one or moreother devices (e.g., such as a camera, a speaker, a mounting screw, acredit card reader, etc.) may be implemented within the one or moreholes or voids. Note that the TSD functionality as described herein(e.g., using one or more DSCs coupled to one or more processing modulesand electrodes) enables full TSD functionality right up to the edge ofthe holes or voids.

TSD 2702 is similar to TSD 2701 with at least one difference being thatit generally has a rectangular shape and a particular thickness. Inaddition, in certain examples, the TSD 2702 one or more holes or voids.TSD 2703 includes multiple sections that facilitate changing of theconfiguration of the TSD based on how those particular sections arearranged next to one another. TSD 2704 a has a flat surface that isgenerally circular or oval and has a particular thickness. TSD 2704 balso has a flat surface that is generally circular or oval and has aparticular thickness and includes a hole or void therein. For example, avariant of the TSD 2704 b may be in the shape of a steering wheel, anavigational wheel, an aircraft control wheel, etc.

TSD 2705 and TSD 2706 include non-flat/curved surfaces. For example,note that a TSD may be implemented to have any desired shape, and one ormore electrodes may be implemented on any of the one or more surfaces ofthe TSD including any non-flat/curved surfaces. For example, TSD 2705and 2706 may be viewed as having a shape similar to various styles andoptions of a computer mouse.

TSD 2707 includes multiple portions such that one portion corresponds toa touch sensor region, such as may be implemented using a touchscreen,and also includes a casing/bezel that may or may not include touchsensors. For example, the TSD 2707 may be implemented such that touchsensor functionality is included only within the touch sensor region andnot within the casing/bezel thereof. T

FIG. 28A is a schematic block diagram of other various embodiments 2801through 2809 of TSDs which may or may not include display functionalityvia a touchscreen display, an liquid crystal display (LCD) operabledisplay, a light emitting diode (LED) operable display, and/or othervisual output component, as well as 3-D geometric objects, which may ormay not include TSD functionality, in accordance with the presentinvention.

With respect to those TSDs, such as 3-D geometric objects that includeTSD functionality, data communication signaling may be made between twodevices (e.g., such as with respect to FIG. 22 ) to provide informationbeyond merely positional, gesture, movement, proximity, etc. relatedinformation such that data is included within the signals coupledbetween electrodes of the two devices. In addition, in certain examples,user interaction that is detected by a first device may be communicatedto the second device via such data communication signals.

In addition, consider a 3-D geometric object that does not include TSDfunctionality. In certain examples, such a 3-D geometric object isconstructed so as to improve coupling from a user to a TSD through the3-D geometric object. For example, the 3-D geometric object includesmaterial that is a dielectric loaded material with a very highdielectric strength. In certain examples, the 3-D geometric objectincludes material such as small particles, e.g., spheres or some othershapes, that are not conductive but provide serve as a high dielectricwith a very high dielectric strength.

In another example, the 3-D geometric object includes one moreconductors extending from one surface to another (e.g., through the 3-Dgeometric object, from top to bottom) so as to improve coupling from auser to a TSD through the 3-D geometric object.

This diagram provides additional examples by which the TSD may beimplemented. TSD 2801 includes a cube, squared shape. TSD 2802 includesa triangular shape. TSD 2803 includes a pyramid shape. TSD 2804 includesa cone shape. TSD 2805 includes a game controller shape, such as may beused in accordance with the gaming system. The TSD 2805 having the gamecontroller shape may include one or more of a button, a lever, ajoystick, etc. Note that an active device, such as an e-pen 2806 mayalso be configured to interact with one or more TSDs.

Also, an overlay 2820, which may be implemented to have any particulardesired shape may be used in conjunction with a TSD. For example, theoverlay 2820 may be implemented to have any desired form or shape, suchas that of the keyboard, keypad, a number pad, a mouse pad, a touch pad,a gaming board such as a chess or checkerboard, etc. Generally speaking,such an overlay may have any desired form. For example, when the overlay2020 is placed on the TSD, a user can then interact with the overlaythat is placed on the TSD to provide user input. Consider an example inwhich the overlay 2820 is that of a keyboard, then as the overlay 2820is placed on the TSD, the user can interact with the overlay 2820 thatis the keyboard to effectuate keyboard functionality via TSD. Forexample, the one or more processing modules of the TSD interprets userinteraction with the TSD based on the portion of the TSD that isassociated with the overlay 2820 as corresponding to user input providedvia a keyboard.

Note that the overlay 2820 may be implemented using any of a variety oftypes of materials. Considering an example, the overlay 2820 may beimplemented using a rigid material to provide tactile feedback andsensation to the user similar to how an actual keyboard provides touser. The overlay 2820 may include plastic buttons/keys similar to anactual keyboard such that, when the plastic buttons/keys are depressedby the user, they react similar to a keyboard as physically movingdownward when selected by the user and returning to their originalposition when the user ceases contacting them. Considering anotherexample, the overlay 2820 is implemented to include one or moreactuators to provide feedback in the form of physical sensation to auser of the overlay 2820, such as providing a desired degree of movementof one or more portions of the overlay 2820 that may be felt by a userwhen interacting with the overlay 2820.

In even other examples, the overlay 2820 may include buttons/keys thatimplemented based on dome switches. In even other examples, the overlay2820 may include buttons/keys that implemented based on scissor-switchmechanisms. For example, any of a number of means may be used toimplement buttons/keys of the overlay 2820 such as to provide audiooutput, such as a clicking sound, when the keys are depressed, in amanner that certain keywords do. For example, the overlay 2820 may beimplemented using appropriate means to provide a desired amount oftactile, audio, etc. feedback to the user in accordance with providing auser experience when interacting with the overlay 2820 that is similarto that of an actual keyboard. In some examples, the overlay 2820 is apassive device that is configured to facilitate user interaction withthe TSD in a particular manner corresponding to the form of the overlay2820. For example, the overlay 2820 may be implemented using polymermaterial, plastic material, some type of dielectric material, etc. sothat capacitive coupling from a user interacting with the overlay 2820is detected by the TSD.

In certain examples, a TSD is implemented to detect location, position,placement, etc. of the overlay 2820, such as based on one or more markerelectrodes, other conductive elements, conductive material includedwithin a particular colored pigment used to form and/or print at leastsome portions of the overlay 2820 such as Titanium Oxide or otherconductive material, etc. included within the overlay 2820. For example,consider an overlay 2820 that is formed and/or printed using a siliconmaterial of the first color, such as white or clear color, compared toanother overlay 2820 that is formed and/or printed using a siliconmaterial of a second color, such as black. Such an overlay 2820 that isformed using one of the colors may include better conductive propertiesthan an overlay 2820 that is formed using another one of the colors. Insome examples, it may be preferable to use a particular color to formand/or print such an overlay 2820 facilitate better identification ofthe overlay 2820, including its location, position, placement, etc. bythe TSD. For example, the perimeter of the overlay 2820 and/or theperimeters of respective keys of the overlay 2820 may be printed with aparticular colored pigment to facilitate better conductivity anddetection by the TSD. In some instances, the respective keys themselvesare printed using one particular colored pigment that has a conductivitythat is greater than portions of the overlay 2820 that do not correspondto keys. In such an instance, the TSD is configured to detect thearrangement of the respective keys of the overlay 2020.

As shown on the upper right-hand side of the diagram, with respect toreference numeral 2807, a TSD may be implemented as a lap desk that maybe placed on a lap of the user who is sitting. Also, in certainalternative examples, one or more of an overlay, 3-D geometric objects,another TSD, etc. may be configured to facilitate user interaction withthe TSD 2807 that is implemented as a lap desk.

The bottom of the diagram shows tables 2808 and 2809 that include one ormore TSDs. For example, the surface of the table 2808 is implemented toinclude TSD functionality. For example, one or more electrodes of theTSD are implemented on the surface of the table. The table 2809 isimplemented using multiple elements/sections, and one or more of thesemultiple elements/sections may include TSD functionality. In oneexample, each of the respective elements/sections of the top of thetable 2809 includes TSD functionality. In another example, fewer thanall of the elements/sections of the top of the table 2809 includes TSDfunctionality (e.g., the section implemented as a backing or rearbarrier of the surface of the table 2809 may be implemented not toinclude TSD functionality).

Generally speaking, note that such TSD functionality may be includedwithin any number of devices having any number of various shapes, forms,configurations, etc. These examples are representative and notexhaustive of all possible shapes, forms, configurations, etc. ofdevices that may be implemented to include TSD functionality. Generallyspeaking, one or more electrodes may be included within any desiredobject, element, etc. to provide TSD functionality for that object,elements, etc.

FIG. 28B is a schematic block diagram of other various embodiments ofTSDs which may or may not include display functionality via atouchscreen display, an liquid crystal display (LCD) operable display, alight emitting diode (LED) operable display, and/or other visual outputcomponent in accordance with the present invention.

For example, table 2901 includes a curved surface such that it bendsupwards at one end. Note that such a table may alternatively beimplemented to include any number of non-flat shapes or surfaces such asa pyramid shaped portion extending upward, a dome portion extendingupward, etc. such as in the middle or another location on the surface ofthe table. Alternatively, the surface of the table may include a wavysurface that flows up and down across the surface of the table. Table2902 includes a wavy surface. Table 2903 includes multiple elements orsections and at least one has one or more 3-D geometric objects, whichmay or may not include TSD functionality, placed thereon. In someexample, one or more of these 3-D geometric objects is made of glass orsome other transparent material that may be illuminated by the tablesurface (e.g., when the table is implemented as a TSD that includesdisplay functionality such as a touchscreen or with some other displayor output functionality such as LEDs, etc.). In some examples, the oneor more of these 3-D geometric objects is an active device includes anaction figure type shape (e.g., in the form or a Disney character, acartoon character, etc.) such that it receives data signal communicationfrom the table (e.g., via capacitive coupling from electrodes in thetable to electrodes in the action figure type shape, and the actionfigure type shape is may be interactive with a user of the table (e.g.,include a speaker to provide audio output, include one or more actuatorsto effectuate mouth, hand, head, etc. movement, etc.).

In addition, note that the one or more 3-D geometric objects may beimplemented to includes light pipes such it includes is configured todisplay information thereon such as based on light signals provided upfrom the table (e.g., when the table is implemented as a TSD thatincludes display functionality such as a touchscreen or with some otherdisplay or output functionality such as LEDs, etc.).

FIG. 29 is a schematic block diagram of various embodiments 2901 through2904 of a 3-D geometric objects, which may or may not include TSDfunctionality, that is operative with a TSD in accordance with thepresent invention.

Embodiment 2901 includes a touch sensor device (TSD) 2910 that isconfigured to facilitate user interaction with a 3-D geometric object,shown in this example as a cone. The 3-D geometric object may or may notinclude TSD functionality. For example, consider embodiment 2904 in theupper right portion of the diagram as including a 3-D geometric objectthat does include TSD functionality, then a transmit identification (TXID) signal may be transmitted from the 3-D geometric object, such as viaone or more electrodes included within the 3-D geometric object, toconvey one or more characteristics associated with the 3-D geometricobject to the TSD 2910. For example, such one or more characteristicsmay include the identity, type, shape, form, functionality, function,capabilities, etc. of the 3-D geometric object to the TSD 2910. Such aTX ID signal may be implemented in any number of ways, such as includinga particular frequency, signal pattern, packet content, and/or any otherone or more characteristics that may be used to inform the TSD 2910 ofthe one or more characteristics associated with the 3-D geometricobject.

Considering embodiment 2901 in the upper left portion of the diagram, asa user is interacting with the 3-D geometric object, the position and/orany motion of the 3-D geometric object may be detected by the TSD 2910.For example, as the user is interacting with the 3-D geometric object,such as placing it in a particular location, moving it in a particularmanner, etc., the TSD 2910 is configured to detect the portion of theuser's body, such as hand and/or fingers, in accordance with such userinteraction. In some examples, the TSD 2910 is configured to detecttouch, proximity, etc. of the portion of the user's body based oncapacitive coupling of that portion of the user's body to one or moreelectrodes included within the TSD 2910. In other examples, the TSD 2910is configured to detect location, movement, etc. of the 3-D geometricobject itself, such as based on one or more marker electrodes, otherconductive elements, conductive material included within pigment used toform and/or print at least some portions of the 3-D geometric objectsuch as Titanium Oxide or other conductive material, etc. includedwithin the 3-D geometric object. In even other examples, the TSD 2910 isconfigured to detect location, movement, etc. of the 3-D geometricobject based on the 3-D geometric object including TSD functionality,such as with reference to embodiment 2904, where the 3-D geometricobject is capable to transmit one or more signals to the TSD 2910.

Considering embodiment 2902 in the lower left portion of the diagram,the location, movement, etc. of an e-pen (e.g., based on beinguser-controlled) may be determined based on one or more signals beingcapacitively coupled from the e-pen to the TSD 2910 and/or one or moresignals being capacitively coupled from the TSD 2910 to the e-pen. Anyof a number of user-controlled effects may be detected by the e-penand/or the TSD 2910. Examples of such effects may include motion, tilt,pressure, barrel rotation, etc. In addition, as a user controlsposition, location, movement, etc. of the e-pen, inking may be displayedon one or more display devices based on such user control of the e-pen.In some examples, the TSD 2910 self includes display functionality, andinking is displayed on the display of the TSD 2910 based on user controlof the e-pen and interaction of the e-pen with the TSD 2910. In otherexamples, a display that is a separate element from the TSD 2910displays inking there on based on communications from the TSD 2910 tothe display that is a separate element from the TSD 2910 based on suchuser control of the e-pen.

Considering embodiment 2903 in the lower right portion of the diagram,multiple 3-D geometric objects are configured to facilitate userinteraction with the TSD 2910 simultaneously, concurrently, etc. that isto say, more than one 3-D geometric object, whether the 3-D geometricobject includes TSD functionality or not, may be interactive with theTSD 2910 simultaneously, concurrently, etc. such that user interactionwith multiple 3-D geometric objects and the TSD 2910 can all bemonitored and detected at the same time. For example, consider a userinteracting with an e-pen using a left-hand and interacting with a 3-Dgeometric object in the shape of a cone using a right-hand. Such userinteraction with both of the objects may be detected by the TSD 2910 atthe same time.

FIG. 30 is a schematic block diagram of an embodiment 3000 of an overlaythat is operative with a TSD in accordance with the present invention.In this diagram, and overlay 3020, which may be of any desired form,such as a keyboard, keypad, number pad, etc. and/or any other form, etc.is configured to be placed on a TSD 3010, as shown at the top of thediagram. As can be seen at the bottom of the diagram, consider thesurface of the TSD 3010 prior to and after the overlay 3020 being placedthereon. After the overlay 3020 is placed on the surface of the TSD3010, a first portion of the TSD 3010 is operative for an provision foruser interaction with the TSD 3010 based on the overlay 3020. When theoverlay 3020 is placed on the surface of the TSD 3010, the touch sensingfunctionality of that particular portion of the TSD 3010 is thenprovisioned to operate in accordance with the function associated withthe overlay 3020. For example, consider that the overlay 3020corresponds to that of the keyboard, then the touch sensingfunctionality of the TSD 3010 that is located under the overlay 3020 isthen provisioned to detect user interaction with the TSD 3010 inaccordance with operation of the keyboard that corresponds to thephysical layout of the overlay 3020.

Any remaining portion of the TSD 3010 that does not include or is notassociated with the overlay 3020 may be used for any one or more otherpurposes. For example, the remaining portion of the TSD 3010 may beoperative for non-overlay functionality. For example, touch, proximity,etc. detection of user interaction may be performed using the remainingportion of the TSD 3010. In some examples, the sensitivity of theremaining portion of the TSD 3010 is unchanged after the overlay 3020 isplaced on the first portion of the TSD 3010. In other examples, thesensitivity of the remaining portion of the TSD 3010 is modified (e.g.,reduced sensitivity, increased sensitivity, disabled, etc.) after theoverlay 3020 is placed on the first portion of the TSD 3010. In evenother examples, the remaining portion of the TSD 3010 is disabled afterthe overlay 3020 is placed on the first portion of the TSD 3010.

FIG. 31 is a schematic block diagram of another embodiment 3100 of anoverlay that is operative with a TSD in accordance with the presentinvention. This diagram has some similarities to the previous diagramwith at least one difference being that more than one overlay is placedon a TSD 3110. For example, consider two separate overlays 3120 and3122, which may be of any desired form, such as keyboards, keypads,number pads, etc. and/or any other forms, etc. are configured to beplaced on a TSD 3110, as shown at the top of the diagram. Note that theoverlays may be of different size, shape, form, function, etc. When theoverlays 3120 and 3122 are placed on the surface of the TSD 3110, thetouch sensing functionality of those particular portions of the TSD 3110are then provisioned to operate in accordance with the functionassociated with the overlays 3120 and 3122. For example, the overlay3120 may correspond to that of a keyboard, and the overlay 3122 maycorrespond to that of a number pad. Then, the touch sensingfunctionality of the TSD 3110 that is located under the overlay 3120 isthen provisioned to detect user interaction with the TSD 3110 inaccordance with operation of the keyboard that corresponds to thephysical layout of the overlay 3120, and the touch sensing functionalityof the TSD 3110 that is located under the overlay 3122 is thenprovisioned to detect user interaction with the TSD 3110 in accordancewith operation of the number pad that corresponds to the physical layoutof the overlay 3122.

As also described with respect to the previous diagram, any remainingportion of the TSD 3110 that does not include boys not associated withthe overlays 3120 and 3122 may be used for one or more other purposes(e.g., non-overlay functionality, changed or unchanged sensitivity,disabled, etc.).

FIG. 32 is a schematic block diagram of an embodiment of 3200 an overlayand a 3-D geometric object, which may or may not include TSDfunctionality, that are both operative with a TSD in accordance with thepresent invention. This diagram has some similarities to the previousdiagram with at least one difference being that an overlay 3220 as wellas a 2^(nd) TSD/3-D geometric object 3212 are configured to facilitateuser interaction with a TSD 3210. Again, the overlay 3220 may be of anydesired form, such as the keyboard, keypad, number pad, etc.

The 2^(nd) TSD/3-D geometric object 3212, which may or may not includeTSD functionality, is configured to facilitate user interaction with theTSD 3210. In one example, the 2^(nd) TSD/3-D geometric object 3212 is anactive device that includes one or more electrodes that are coupled toone or more DSCs that service them, and the DSC are coupled to one ormore processing modules. Based on user interaction with the 2^(nd)TSD/3-D geometric object 3212, the TSD 3210 is configured to detectlocation, movement, etc. of the 2^(nd) TSD/3-D geometric object 3212based on that user interaction with it based on one or both of one ormore signals being coupled and detected between the 2^(nd) TSD/3-Dgeometric object 3212 is an active device and the TSD 3210 and detectionof one or more portions of the users body associated with the 2^(nd)TSD/3-D geometric object 3212 is an active device.

In another example, the 2nd TSD/3-D geometric object 3212 is not anactive device (e.g., a passive device), the TSD 3210 is configured todetermine location, movement, etc. of the 2^(nd) TSD/3-D geometricobject 3212 based on detection of one or more portions of the users bodyassociated with the 2^(nd) TSD/3-D geometric object 3212.

In addition, the overlay 3220 is configured to facilitate userinteraction with the TSD 3220 based on the characteristics of theoverlay 3220, such as the type of the overlay 3220, the physical layoutof the overlay 3220, the prescribed function of the overlay 3220 inaccordance with user interaction therewith, etc.

In an example of operation and implementation, a TSD (e.g., TSD 3210 orany other TSD described herein or their equivalents) includes aplurality of TSD electrodes associated with a surface of the TSD. Also,an overlay that includes one or more marker electrodes also beingassociated with at least a portion of the surface of the TSD. The TSDalso includes a plurality of drive-sense circuits (DSCs) operablycoupled to the plurality of TSD electrodes. A DSC of the plurality ofDSCs is operably coupled to receive a reference signal and to generate aTSD electrode signal based on the reference signal. For example, whenenabled, the DSC operably coupled and configured to provide the TSDelectrode signal to a TSD electrode of the plurality of TSD electrodesand simultaneously to sense a change of the TSD electrode signal basedon a change of impedance of the TSD electrode caused by capacitivecoupling between the TSD electrode and the one or more marker electrodesbased on the overlay being associated with the at least a portion of thesurface of the TSD. The DSC is also operably coupled and configured togenerate a digital signal that is representative of the change ofimpedance of the TSD electrode.

The TSD also includes and/or is coupled to memory that storesoperational instructions. The TSD also includes one or more processingmodules operably coupled to the plurality of DSCs and the memory. Forexample, when enabled, the one or more processing modules is configuredto execute the operational instructions to generate the reference signaland to process the digital signal to determine one or morecharacteristics of the overlay that is associated with the at least aportion of the surface of the TSD.

In certain examples, another DSC of the plurality of DSCs is operablycoupled to receive another reference signal and to generate another TSDelectrode signal based on the other reference signal. When enabled, theother DSC operably coupled and configured to provide the other TSDelectrode signal to another TSD electrode of the plurality of TSDelectrodes that is implemented within the at least a portion of thesurface of the TSD with which the overlay is associated andsimultaneously to sense a change of the other TSD electrode signal basedon a change of impedance of the other TSD electrode caused by a proximaltouch to the at least a portion of the surface of the TSD with which theoverlay is associated. The DSC is also operably coupled and configuredgenerate another digital signal that is representative of the change ofimpedance of the other TSD electrode.

The one or more processing modules, when enabled, is further configuredto execute the operational instructions to generate the other referencesignal and to process the other digital signal to determine location ofthe proximal touch to the at least a portion of the surface of the TSDwith which the overlay is associated.

In certain examples, the one or more processing modules, when enabled,is further configured to execute the operational instructions todetermine user interaction with a portion of the overlay based on thelocation of the proximal touch to the at least a portion of the surfaceof the TSD with which the overlay is associated. Also, the one or moreprocessing modules is further configured to generate an output signalthat is representative of the user interaction with the portion of theoverlay and transmit the output signal to a computing device to beinterpreted by the computing device as user input.

Examples of the one or more characteristics of the overlay may includeany one or more of an outline of the overlay, locations of keys of theoverlay, a location of the overlay on the surface of the TSD, locationof the one or more marker electrodes within the at least a portion ofthe surface of the TSD, a pattern of the one or more marker electrodes,a function of the overlay, a type of the overlay, and/or an orientationof the overlay.

Also, in certain examples, the TSD is a portable device that includes aninternal power source (e.g., such as with respect to FIG. 36 ).

Also, in some implementations of the TSD, note that the plurality of TSDelectrodes includes a first subset of the plurality of TSD electrodesaligned in a first direction and a second subset of the plurality of TSDelectrodes that are separated from the first subset of the plurality ofTSD electrodes by a dielectric material and are aligned in a seconddirection.

In addition, in some examples, the TSD includes multiple sections (e.g.,such as certain TSDs including depicted in FIGS. 27, 28, 34, 40 , amongothers). The TSD has a first shape when the multiple sections areimplemented within a first configuration, and the TSD has a second shapewhen the multiple sections are implemented within a secondconfiguration. Also, note that certain implementations of the TSDinclude a non-flat surface and/or curved surface (e.g., such as certainTSDs including depicted in FIG. 27 , among others).

In addition, note that the DSC of the plurality of DSCs may beimplemented in a variety of ways. In certain examples, the DSC includesa power source circuit operably coupled via a single line to the TSDelectrode. When enabled, the power source circuit is configured toprovide an analog signal via the single line coupling to the TSDelectrode. Note that the analog signal includes at least one of a DC(direct current) component or an oscillating component. The DSC alsoincludes a power source change detection circuit operably coupled to thepower source circuit. When enabled, the power source change detectioncircuit is configured to detect an effect on the analog signal that isbased on an electrical characteristic of the TSD electrode and togenerate the digital signal that is representative of the change ofimpedance of the TSD electrode.

Also, in certain particular examples, the power source circuit includesa power source to source at least one of a voltage or a current via thesingle line to the TSD electrode. Also, the power source changedetection circuit includes a power source reference circuit configuredto provide at least one of a voltage reference or a current reference,and a comparator configured to compare the at least one of the voltageand the current provided via the single line to the TSD electrode to theat least one of the voltage reference and the current reference toproduce the analog signal.

In another example of operation and implementation, a TSD (e.g., TSD3210 or any other TSD described herein or their equivalents) includes afirst plurality of TSD electrodes aligned in a first direction and asecond plurality of TSD electrodes aligned in a second direction. Notethat the first plurality of TSD electrodes and the second plurality ofTSD electrodes associated with a surface of the TSD, and an overlay thatincludes one or more marker electrodes is also associated with at leasta portion of the surface of the TSD.

The TSD includes a plurality of drive-sense circuits (DSCs) operablycoupled to the first plurality of TSD electrodes and the secondplurality of TSD electrodes. A first DSC of the plurality of DSCs isoperably coupled to receive a first reference signal and to generate afirst TSD electrode signal based on the first reference signal. Whenenabled, the first DSC operably coupled and configured to provide thefirst TSD electrode signal to a first TSD electrode of the firstplurality of TSD electrodes and simultaneously to sense a change of thefirst TSD electrode signal based on a change of impedance of the firstTSD electrode caused by capacitive coupling between the first TSDelectrode and the one or more marker electrodes based on the overlaybeing associated with the at least a portion of the surface of the TSD.The first DSC is also operably coupled and configured to generate afirst digital signal that is representative of the change of impedanceof the first TSD electrode.

A second DSC of the plurality of DSCs is operably coupled to receive asecond reference signal and to generate a second TSD electrode signalbased on the second reference signal. When enabled, the second DSCoperably coupled and configured to provide the second TSD electrodesignal to a second TSD electrode of the second plurality of TSDelectrodes and simultaneously to sense a change of the second TSDelectrode signal based on a change of impedance of the second TSDelectrode caused by capacitive coupling between the second TSD electrodeand the one or more marker electrodes based on the overlay beingassociated with the at least a portion of the surface of the TSD. Thesecond DSC is also operably coupled and configured to generate a seconddigital signal that is representative of the change of impedance of thesecond TSD electrode.

The TSD also includes and/or is coupled to memory that storesoperational instructions. The TSD includes one or more processingmodules operably coupled to the plurality of DSCs and the memory. Whenenabled, the one or more processing modules is configured to execute theoperational instructions to generate the first reference signal and thesecond reference signal, and process the first digital signal and thesecond digital signal to determine one or more characteristics of theoverlay that is associated with the at least a portion of the surface ofthe TSD.

In certain examples, a third DSC of the plurality of DSCs is operablycoupled to receive a third reference signal and to generate a third TSDelectrode signal based on the third reference signal. When enabled, thethird DSC operably coupled and configured to provide the third TSDelectrode signal to a third TSD electrode of the first plurality of TSDelectrodes and simultaneously to sense a change of the third TSDelectrode signal based on a change of impedance of the third TSDelectrode caused by a proximal touch to the at least a portion of thesurface of the TSD with which the overlay is associated. The third DSCis also operably coupled and configured to generate a third digitalsignal that is representative of the change of impedance of the thirdTSD electrode.

Also, a fourth DSC of the plurality of DSCs is operably coupled toreceive a fourth reference signal and to generate a fourth TSD electrodesignal based on the fourth reference signal. When enabled, the fourthDSC operably coupled and configured to provide the fourth TSD electrodesignal to a fourth TSD electrode of the second plurality of TSDelectrodes and simultaneously to sense a change of the fourth TSDelectrode signal based on a change of impedance of the fourth TSDelectrode caused by the proximal touch to at least a portion of thesurface of the TSD with which the overlay is associated. The fourth DSCoperably coupled and configured to generate a fourth digital signal thatis representative of the change of impedance of the fourth TSDelectrode.

The TSD also includes and/or is coupled to memory that storesoperational instructions. The TSD includes one or more processingmodules operably coupled to the plurality of DSCs and the memory. Whenenabled, the one or more processing modules is configured to execute theoperational instructions to generate the third reference signal and thefourth reference signal and to process the third digital signal and thefourth digital signal to determine location of the proximal touch to theat least a portion of the surface of the TSD with which the overlay isassociated.

FIG. 33 is a schematic block diagram of various embodiments 3301, 3302,3303, and 3304 of overlays and 3-D geometric objects, which may or maynot include TSD functionality, including marker electrodes thatfacilitate identification, location determination, and mapping of theoverlays by a TSD in accordance with the present invention.

Generally speaking, marker electrodes implemented in a non-symmetric orasymmetrical manner are preferred as to facilitate easier recognition ofthe marker electrodes themselves and a pattern that may bedifferentiated form other patterns, to determine orientation, position,etc.

Generally speaking, with respect to any overlay, 3-D geometric object,etc., one or more characteristics thereof may be used for identificationof the overlay, 3-D geometric object, etc. by a TSD. For example, suchan overlay, 3-D geometric object, etc. is implemented to include one ormore marker electrodes 3310 to be used in accordance with facilitatingidentification of one or more characteristics of the overlay, 3-Dgeometric object, etc. Examples of such one or more characteristics ofthe overlay, 3-D geometric object, etc. may include the identity, type,shape, form, location, position, alignment, functionality, function,capabilities, etc.

For example, based on capacitive coupling between one or more markerelectrodes 3310 of the overlay, 3-D geometric object, etc. and one ormore electrodes of a TSD, the TSD is configured to identify the locationof those one or more marker electrodes 3310 to determine one or morecharacteristics associated with the overlay, 3-D geometric object, etc.For example, one or more processing modules of the TSD is configured tointerpret information provided from one or more DSCs that are coupled tothe one or more electrodes of the TSD that experience capacitivecoupling with the one or more marker electrodes 3310 of the overlay, 3-Dgeometric object, etc. Different respective arrangements, patterns, etc.of marker electrodes 3310 may be used to differentiate differentrespective overlays, 3-D geometric objects, etc. For example, the markerelectrodes 3310 may be of any desired shape, length, thickness, etc. Insome examples, one of the marker electrodes is a rectangular shapedconductive material. In other examples, a marker electrode is a circularshaped conductive material. And yet another example, a marker electrodeis a straight conductor of a particular thickness.

For example, information corresponding to arrangement, pattern, etc. ofone or more marker electrodes 3310 associated with various overlays, 3-Dgeometric objects, etc. is stored within memory, a lookup table, aserver, etc., that is accessible by one or more processing modules of aTSD. Based on detection of the particular one or more marker electrodes3310 associated with the overlay, 3-D geometric object, etc. includingtheir arrangement, pattern, etc., the one or more processing modules ofthe TSD is operative to determine whether those one or more markerelectrodes 3310 compare favorably to the information. Based on favorablecomparison, the one or more processing modules of the TSD is configuredto determine which particular overlay, 3-D geometric object, etc. iswithin proximity to the TSD. Based on unfavorable comparison, one ormore processing modules the TSD is configured to determine that theoverlay, 3-D geometric object, etc. that is within proximity of the TSDmay not be properly determined or identified. In some examples, the TSDprovides some indication to a user of the TSD, such as via some form ofvisual output, audio output, error message, etc. that may be interpretedby a user of the TSD indicating that the overlay, 3-D geometric object,etc. has not been properly identified.

Reference numeral 3301 at the upper left-hand portion of the diagramincludes an overlay or a portion of a 3-D geometric object and includesmarker electrodes 3310. The marker electrodes are arranged at particularlocations in such that two of the marker electrodes 3310 are separatedby a distance W1, and rows of the marker electrodes 3310 are separatedby distances H1 and H2. Based on the particular locations, separations,etc. of these marker electrodes 3310 that are determined based onprocessing of signals provided from DSCs of the TSD that experiencecapacitive coupling with the marker electrodes 3310, one or moreprocessing modules of the TSD is configured to perform a number offunctions. The TSD is configured to identify the locations of therespective marker electrodes to determine the location of the overlay,3-D geometric object, etc. that includes the marker electrodes 3310. Inaddition, the TSD is configured to determine the one or morecharacteristics of the overlay, 3-D geometric object, etc. (e.g.,identity, type, shape, form, location, position, alignment,functionality, function, capabilities, etc.). In addition, in someexamples, the TSD is also configured to adapt operation of the TSDappropriately corresponding to the region or regions of the TSD that arewithin proximity of the overlay, 3-D geometric object, etc.

Generally speaking, note that the marker electrodes 3310 may beimplemented in any of a variety of ways. For example, consideringreference numeral 3302, marker electrodes 3310 have approximately asimilar spatial arrangement to those with respect to reference numeral3301, with at least one difference being that at least some of themarker electrodes 3310 are of larger size and different shape than otherof the marker electrodes 3310. For example, the upper right-hand andlower left-hand marker electrodes 3310 with respect to the referencenumeral 3302 are shown as being much larger and oblong in shape. Basedon the particular characteristics of the marker electrodes 3310 of thisembodiment 3302, the TSD is configured to determine the one or morecharacteristics of the overlay, 3-D geometric object, etc. (e.g.,identity, type, shape, form, location, position, alignment,functionality, function, capabilities, etc.). Note that the particularspatial arrangement of any one or more marker electrodes 3310 may beimplemented in any of a variety of ways, including marker electrodes3310 that form some type of pattern. In addition, note that theparticular arrangement of one or more marker electrodes 3310 may be usedto determine whether or not an overlay, 3-D geometric object, etc. isappropriately placed on or within appropriate proximity and alignment toa TSD. For example, an overlay, 3-D geometric object, etc. may beintended to have a particular upright position, and an appropriatelyselected arrangement of marker electrodes 3310 may be used to facilitatedetermination whether or not the overlay, 3-D geometric object, etc. itis in fact properly placed, align, etc.

For example, consider reference numeral 3303 at the bottom left-handportion of the diagram, marker electrodes 3310 are arranged forming anasymmetric shape formed by straight and curved conductors substantiallylocated within the middle of the overlay, 3-D geometric object, etc.Note that any desired shape may alternatively be used to facilitatedetermination of one or more characteristics of the overlay, 3-Dgeometric object, etc. Examples of alternative shapes may include astar, a circle, square, a FIG. 8 pattern, and/or any other particularshape. Again, generally speaking, marker electrodes implemented in anon-symmetric or asymmetrical manner are preferred as to facilitateeasier recognition of the marker electrodes themselves and a patternthat may be differentiated form other patterns, to determineorientation, position, etc. In addition, note that multiple respectiveshapes of similar word different size, characteristic, etc. made also beused to facilitate determination of the one or more characteristics ofthe overlay, 3-D geometric object, etc.

In addition, consider reference numeral 3304 at the bottom right-handportion of the diagram, marker electrodes 3310 may be implemented withrespect to any one or more portions of an overlay 3320, which may be ofany of a variety of types (e.g., keyboard, keypad, number pad, etc.).For example, one or more marker electrodes 3310 may be implementedcorresponding to any one or more of the keys of the overlay 3320. Inaddition, note that the respective one or more marker electrodes 3310may be of similar shape, different shape, etc. Also, marker electrodesimplemented in a non-symmetric or asymmetrical manner are preferred asto facilitate easier recognition of the marker electrodes themselves anda pattern that may be differentiated form other patterns, to determineorientation, position, etc.

Note that the material conductivity of the overlay 3320 may be selectedsuch that one or more processing modules of the TSD is operative todetermine the contour, shape, outline, etc., overlay 3320 that is withinproximity to the TSD. For example, certain conductive material may beincluded within the pigment that is used to color the overlay 3320. Forexample, titanium dioxide may be included within the pigment tofacilitate capacitive coupling of one or more portions of the overlay3322 one or more electrodes of a TSD. Generally speaking, when one ormore of the keys of the overlay 3320 includes one or more elementselement to facilitate capacitive coupling between the overlay 3320 andthe one or more electrodes of the TSD, the pattern of which particularone or more keys of the overlay 3320 includes one or more elements maytake on any desired form. For example, the corners of the overlay 3320may be used, every other key of the overlay 3320 may include suchelements, every third key of the overlay 3320 may include such elements,etc. In addition, as described above with respect to another overlay,the overlay 3320 may be implemented using appropriate means to provide adesired amount of tactile, audio, etc. feedback to the user inaccordance with providing a user experience when interacting with theoverlay 3320 that is similar to that of an actual keyboard.

Generally speaking, the use of marker electrodes 3310 within an overlay,3-D geometric object, etc. provides a means by which a TSD is configuredto detect the orientation, configuration, position, function, etc. ofthe overlay, 3-D geometric object, etc. Based on the conductivity of themarker electrodes 3310, including capacitive coupling between them andone or more electrodes of the TSD, a particular impedance (Z) signaturethat is based on the marker electrodes 3310 may be determined by one ormore processing models of the TSD. This Z signature may be used todetermine the one or more characteristics of the overlay, 3-D geometricobject, etc. (e.g., identity, type, shape, form, location, position,alignment, functionality, function, capabilities, etc.).

FIG. 34 is a schematic block diagram of various embodiments 3401, 3402,3403, and 3404 of 3-D geometric objects, which may or may not includeTSD functionality, including marker electrodes that facilitateidentification, location determination, and mapping of the overlays by aTSD in accordance with the present invention.

Reference numeral 3401 at the upper left hand portion of the diagramshows a 3-D geometric object in the shape of a cone that includes markerelectrodes 3310 that are aligned vertically along the length of the coneshape. This arrangement of marker electrodes 3310 in this particularmanner is a particular Z signature 3411 that may be determined by one ormore processing modules of a TSD based on capacitive coupling betweenthese marker electrodes 3310 and one or more electrodes of the TSD.

Reference numeral 3402 at the upper right hand portion of the diagramshows a 3-D geometric object also in the shape of a cone that includesmarker electrodes 3310, except the marker electrodes 3310 of thisembodiment 3402 are arranged horizontally around the length of the coneshape. This arrangement of marker electrodes 3310 in this particularmanner is a particular Z signature 3412 that is different than the Zsignature 3411 that may be determined by one or more processing modulesof a TSD based on capacitive coupling between these marker electrodes3310 and one or more electrodes of the TSD and may be used todifferentiate between the 3-D geometric objects in the shape of a conewithin the embodiments 3401 and 3402. For example, while the shape ofthe 3-D geometric objects in the embodiments 3401 and 3402 may be ofsimilar shape, they may have different identity, function, etc. Forexample, a TSD is configured to interpret user interaction with respectto the 3-D geometric objects in the embodiments 3401 and 3402differently. Consider an example in which the 3-D geometric object ofembodiments 3401 is intended to facilitate user interaction based as ajoystick, and the 3-D geometric object of embodiments 3402 is intendedto facilitate user interaction based as a game piece. Providing a meansby which different respective Z signatures can be provided even tosimilarly shaped 3-D geometric objects provides the ability for a TSD tointeract respect to similarly shaped 3-D geometric objects differentlyand for different functions, purposes, etc.

Reference numeral 3403 at the bottom left hand portion of the diagramshows a 3-D geometric shape including one surface that is substantiallysquare in shape and having a particular thickness. Marker electrodes3310 are implemented on this surface of the 3-D geometric shape.Depending on the arrangement of the marker electrodes 3310, this 3-Dgeometric shape has a particular Z signature 3413 a when upright, and adifferent Z signature 3413 b when upside down. As can be seen, the Zsignature of the 3-D geometric shape is based on the orientation of the3-D geometric shape based on the arrangement of the marker electrodes3310.

Reference numeral 3404 at the bottom right hand portion of the diagramshows a multi-section 3-D geometric object including multiple sections(e.g., 2 or more) of the 3-D geometric object shown with reference toreference numeral 3403 that are stacked one on top of each other. Notethat different respective marker electrodes 3310 may be included withinone or more of the sections of the 3-D geometric object, and they mayhave same or different arrangements within the different respectivesections. This multi-section 3-D geometric shape has a corresponding Zsignature 3414 based on the respective marker electrodes 3310 that areincluded within the multiple sections thereof, their respectivearrangement, etc. Note also that this multi-section 3-D geometric shapewill have different respective Z signatures based on the multi-section3-D geometric shape being in different orientations (e.g., upright,upside down, laying on one particular side versus another side, etc.).

FIGS. 35A and 35B are schematic block diagrams of other variousembodiments 3501, 3502, 3503, 3504, 3505, 3506, 3507, and 3508 ofoverlays including marker electrodes that facilitate identification,location determination, and mapping of the overlays by a TSD inaccordance with the present invention.

As mentioned above with respect to different embodiments, examples, ofoverlays, one or more of the keys of the overlay 3320 may be implementedto include one or more elements element to facilitate capacitivecoupling between the overlay and the one or more electrodes of the TSD.

These embodiments 3501, 3502, 3503, 3504, 3505, and 3506 illustratevarious ways by which such elements may be implemented within the keysof an overlay. Generally speaking, an overlay having a general form of akeyboard is used for illustration in these embodiments 3501, 3502, 3503,3504, 3505, and 3506. However, note that such an overlay may generallyhave any desired form including more or fewer keys in similar ordifferent arrangements as shown here.

Reference numeral 3501 at the upper left hand portion of the diagramshows marker electrodes 3310 included within every key of an overlay.Reference numeral 3502 at the upper right hand portion of the diagramshows marker electrodes 3310 being included only within the corner keysof an overlay.

Reference numeral 3503 at the bottom left hand portion of the diagramshows marker electrodes 3310 being included in accordance with acheckerboard pattern of the keys of an overlay. Reference numeral 3504at the bottom right hand portion of the diagram shows marker electrodes3310 being included in accordance with another pattern 1 thatsubstantially includes columns of marker electrodes 3310.

Within FIG. 35B, reference numeral 3505 at the upper left hand portionof the diagram shows marker electrodes 3310 being included in accordancewith another pattern 2 that includes four marker electrodes 3310 on theleft-hand side and the right hand side of the overlay, in the top andbottom rows of keys, and four other marker electrodes 3310 offset withrespect to columns of keys substantially located in the center of theoverlay. Reference numeral 3506 at the upper right hand portion of thediagram shows marker electrodes 3310 being included around the perimeterof the keys of the overlay.

Reference numeral 3507 at the lower left hand portion of the diagramshows marker electrodes 3310 being implemented using to curvedelectrodes of a particular thickness arranged as shown. Referencenumeral 3508 at the lower right hand portion of the diagram shows markerelectrodes 3310 being implemented as rectangular shapes arranged suchthat one is horizontal and the other is diagonal, each being ofdifferent respective thicknesses. These diagrams show examples thatinclude marker electrodes 3310 that are not implemented particularlywith respect to the keys of the overlay. Generally speaking, the markerelectrodes may be of any shape, style, size, etc. such as any desiredmixture of rectangular shape, square shaped, circular shape, triangularshape, etc., including circle-shaped electrodes that have a void in themiddle such as in the shape of the doughnut, etc.

In addition, note that if an overlay is implemented as an active device,such as including TSD functionality, the overlay is configured to beprogrammable such that it can provide signaling that is detected by theTSD on which such an active device overlay is placed. For example, anactive device overlay provides very low level voltage signals that aredetected by the TSD on which it is placed. In another example, an activedevice overlay energizes one or more marker electrodes 3310 therebychanging one or more electrical characteristics thereof to effectuateany desired pattern that may be detected by the TSD in which the activedevice overlay is placed.

In addition, different desired human interface device (HID) protocolsmay be used for different types of overlays. For example, a first HIDprotocol is used for keyboard, second HID protocol is used for atouchpad, etc.

In certain embodiments, note that a virtual overlay may be implementedby a TSD with display functionality, such as when the TSD is implementedas a touchscreen, such that a window opens on the touchscreen anddisplays the virtual overlay, whether it be a keyboard, a number pad, agameboard, etc., and the user is able to interact with the portion ofthe touchscreen that displays the virtual overlay. In an example ofoperation and implementation, when a user interacts with the TSD in acertain manner, such as spreading two fingers apart on the touchscreen,or when the user draws a particular shape on the touchscreen, such avirtual overlay is then displayed within that particular region of thetouchscreen.

In another example of operation and implementation, when a TSD isimplemented with display functionality, such as when the TSD isimplemented as a touchscreen, when an overlay is placed on the surfaceof the TSD, for certain types of overlays, such as a keyboard,touchscreen will display a virtual operational space at one or morelocations near the overlay. Examples of such a virtual operational spacemay be a virtual keyboard, a virtual touchpad, a virtual number pad,etc. that may be used in conjunction with the overlay. Consider theoverlay being configured to effectuate the function of a keyboard whenoperating with the TSD. Based on the overlay being placed on thetouchscreen, then a virtual operational space, number pad (e.g., a 10 or12-key number pad) is displayed to the right of the overlay (oralternatively to the left of the overlay if desired, such as toaccommodate a left-handed user). In addition, different respectivevirtual operational spaces, such as different dialog boxes or any of avariety of applications including audio control, brightness control,mute/un-mute, etc., windows for various software operating on the TSDand/or a computing device in communication with the TSD, media players,control bars, touchpad, sliders, function keys, calculators of anydesired functionality whether basic functionality or scientific highercapability functionality, etc. may be opened on the touchscreen andimplemented to operate cooperatively with such overlays. For example,one or more hotkeys, function keys, etc. could be opened at one or moredesired locations around or near the overlay.

Generally speaking, any desired pattern of marker electrodes 3310 may beimplemented with respect to one or more keys of the overlay tofacilitate identification of one or more characteristics of the overlayby one or more processing modules of a TSD that is within contact to orwithin proximity of the overlay. Note also that appropriate arrangementof one or more marker electrodes 3310 may be used to determine whetheror not the overlay is upright or upside down, based on the orientationand/or configuration of the overlay on or within proximity to the TSD.Also, note that any desired type of overlay may be implemented includingvarious types of keyboards (e.g., QWERTY, AWERTY, AT, Dvorak, and/or anyother mapping of keys on a keyboard, etc.), various types of number pads(e.g., numbers 7 8 9 top row, followed by numbers 4 5 6 next from toprow, etc.), etc.

Based on the particular pattern of marker electrodes 3310 within aparticular overlay, one or more processing modules of the TSD isconfigured to determine the one or more characteristics of the overlay(e.g., identity, type, shape, form, location, position, alignment,functionality, function, capabilities, etc.). In addition, the one ormore processing modules of the TSD is configured to adapt operation ofat least a portion of the TSD that is in contact with, in proximitywith, or associated with the overlay to facilitate user interaction withthe overlay and to interpret the user interaction with the overlay.

For example, when the TSD to determines the one or more characteristicsof the overlay (e.g., identity, type, shape, form, location, position,alignment, functionality, function, capabilities, etc.), the TSD is thenconfigured to interpret user interaction with the TSD within thelocation of the TSD that is associated with the overlay to interpret theuser interaction with the overlay. The TSD is configured to detect userinteraction with the TSD than the location of the TSD that is associatedwith the overlay, such as fingers of the user capacitively couplingthrough the overlay to the one or more electrodes of the TSD andinterpreting the locations, timing, sequence, etc. of the capacitivecoupling of the fingers of the user in the locations that correspondedto keys based on the physical layout of the overlay to determine whichletters, numbers, symbols, characters, functions, etc. are beingselected, and in which order, by the user. The one or more processingmodules of the TSD is configured to generate output corresponding to theuser interaction with the TSD in accordance with the overlay.

For example, considering the overlay to be a keyboard, the TSD isconfigured to detect capacitive coupling through the overlay to the oneor more electrodes of the TSD and interpreting the locations, timing,sequence, etc. of the capacitive coupling of the fingers of the user inthe locations that corresponded to keys based on the physical layout ofthe overlay to determine what particular information the user is typing,and to generate output corresponding to that particular information.Such output corresponding to that particular information may be providedto any one or more output devices such as a display, monitor,television, a smart phone, tablet, a text to audio converter outputdevice, a text to video converter output device, etc., and/ortransmitted via one or more communication systems to be stored withinmemory, a database, a server, etc., and/or provided to one or more othercomputing devices to undergo processing such as in accordance withnormal network processing, machine learning, etc.

FIG. 36 is a schematic block diagram of various embodiments 3501, 3602,3603, 3604, and 3605 of TSDs including communication functionality,power sourcing, and/or controller functionality in accordance with thepresent invention.

Reference numeral 3601 at the upper left hand portion of the diagramshows a touch sensor device (TSD) 3610, with or without displayfunctionality, that includes processing modules 42, which may includeand/or be coupled to memory that stores one or more operationalinstructions to be executed by the one or more processing modules 42.The one or more processing modules 42 are coupled to one or more DSCs28, as shown via a coupling which may have up to x pathways respectivelyconnecting to respective DSCs 28, where x is a positive integer greaterthan or equal to 1. The one or more DSCs 28 are coupled to one or moreelectrodes 85, as shown via a coupling which may have up to y pathwaysrespectively connecting to respective DSCs 28, where y is a positiveinteger greater than or equal to 1. In some examples, x=y, and in otherexamples, x and y have different values. For example, there may beinstances in which a DSC 28 is operative to service more than oneelectrode 85, such as in accordance with the time multipleximplementation such that a first electrode 85 is serviced by the DSC 28at a first time, a second electrode 85 the service by the DSC 28 at asecond time, and so on. The electrodes 85 of the TSD 3610 may beappointed in accordance with any desired pattern, which may includefirst electrodes 85 implemented in a first direction and secondelectrodes 85 implemented in a second direction such that capacitivecoupling may be effectuated between the first electrodes 85 in thesecond electrodes 85 in accordance with cross-point detection todetermine location of user interaction with respect to the electrodes85. For example, one or more DSCs 28 are implemented to mutual signalingsuch as signals being transmitted from the one or more DSCs 28 via thefirst electrodes 85 and, after being capacitively coupled into thesecond electrodes 85, that mutual signaling is detected by one or moreDSCs 85 coupled to via the second electrodes 85. In other examples, oneor more of the electrodes 85 of the TSD 3610 is implemented as a button,a pad, and/or any other feature that may be used to facilitateproximity, touch, user interaction, etc. of the user with the one ormore electrodes 85 based on them being serviced by one or more DSCs 28.

Reference numeral 3602 at the upper middle portion of the diagram showsthe TSD 3612 that includes an internal power source 2810, such as abattery. Such a TSD 3612 may be implemented in accordance with themobile device, such as a laptop computer, smart phone, but tablet, apersonal digital assistant (PDS), etc. and/or any other device thatincludes an internal power source.

Reference numeral 3603 at the upper right hand portion of the diagramshows a TSD 3614 that includes an external power source interface 2812.For example, external power source interface 2812 is implemented tointerface with AC power, such as via a wall charging device. In someexamples, the TSD 3614 also includes an internal power source 2810, suchas a battery. In certain implementations, the external power sourceinterface 2812 is operative to facilitate charging of the internal powersource 2810, which may be implemented as a rechargeable internal powersource (e.g., a lithium ion battery, some other type of rechargeablebattery, an energy storage capacitor, or some other rechargeableinternal power source, etc.).

Reference numeral 3604 at the middle right hand portion of the diagramshows a TSD 3616 that is configured to communicate with one or moretethered external controllers via tether(s). Reference numeral 3605 atthe bottom left hand portion of the diagram shows a TSD 3618 that isconfigured to communicate with one or more wireless external controllersvia wireless communications. In some examples, note that the one or moretethered external controllers and/or the one or more wireless externalcontrollers are configured to communicate with one or more othercomputing devices 12 and/or one or more other processing modules 42,such as may be implemented within the one or more computing devices 12(e.g., via wired, wireless, optical, etc. communication means).

Note that the external controllers, whether tethered or wireless, may beimplemented to include one or more DSCs integrated therein to facilitateuser interaction with one or more buttons, electrodes, etc. that may beincluded within the external controllers. In these embodiments 3604 and3605, the external controllers include communication capability tocommunicate with the one or more other computing devices 12 and/or theone or more other processing modules 42. However, in certainimplementations, note that the TSDs 3616 and 3618 may also includemitigation communication capability to communicate with the one or moreother computing devices 12 and/or the one or more other processingmodules 42. Examples of TSDs that includes such communication capabilityare described with respect to certain of the following certain of thefollowing diagrams.

FIG. 37A is a schematic block diagram of an embodiment 3701 of acommunication system including a TSD in accordance with the presentinvention. This diagram shows communication between computing device12-37 a and/or processing module(s) and a touch sensor device (TSD)(withor without display functionality) 3710. A TSD 3710 is in communicationwith computing device 12-37 a (and/or any number of other computingdevices) via one or more transmission media. The TSD 3710 includes acommunication interface 3760 configured to perform transmitting and/orreceiving of at least one signal, symbol, packet, frame, etc. (e.g.,using a transmitter (TX) 3762 and a receiver (RX) 3764).

Generally speaking, the communication interface 3760 is implemented toperform any such operations of an analog front end (AFE) and/or physicallayer (PHY) transmitter, receiver, and/or transceiver. Examples of suchoperations may include any one or more of various operations includingconversions between the frequency and analog or continuous time domains(e.g., such as the operations performed by a digital to analog converter(DAC) and/or an analog to digital converter (ADC)), gain adjustmentincluding scaling, filtering (e.g., in either the digital or analogdomains), frequency conversion (e.g., such as frequency upscaling and/orfrequency downscaling, such as to a baseband frequency at which one ormore of the components of the TSD 3710 operates), equalization,pre-equalization, metric generation, symbol mapping and/or de-mapping,automatic gain control (AGC) operations, and/or any other operationsthat may be performed by an AFE and/or PHY component within a wirelesscommunication device.

In some implementations, the TSD 3710 also includes one or moreprocessing module(s) 42 and either an associated memory that is includedwithin the TSD 3710 or is coupled to the one or more processingmodule(s) 42 of the TSD 3710, to execute various operations includinginterpreting at least one signal, symbol, packet, and/or frametransmitted to computing device 12-37 a and/or received from thecomputing device 12-37 a. The TSD 3710 and computing device 12-37 a maybe implemented using at least one integrated circuit in accordance withany desired configuration or combination of components, modules, etc.within at least one integrated circuit. In certain examples, note thatthe computing device 12-37 a includes one or more processing module(s)42 and included memory and/or that are coupled to memory. Also, incertain examples, the computing device 12-37 a also includes acommunication interface 3760 providing similar functionality to thecommunication interface 3760 included in the TSD 3710.

Also, in some examples, note that one or more of the processingmodule(s) 42, the communication interface 3760 (including the TX 3762and/or RX 3764 thereof), and/or the memory may be implemented in one ormore “processing modules,” “processing circuits,” “processingcircuitry,” “processors,” and/or “processing units” or theirequivalents. Considering one example, a system-on-a-chip (SOC) isimplemented to include the processing module(s) 42, the communicationinterface 3760 (including the TX 3762 and/or RX 3764 thereof), and thememory (e.g., a SOC being a multi-functional, multi-module integratedcircuit that includes multiple components therein). Considering anotherexample, a processing-memory circuitry may be implemented to includefunctionality similar to both the processing module(s) 42 and the memory(e.g., when the memory is included within the processing module(s) 42)yet the communication interface 3760 is a separate circuitry (e.g.,processing-memory circuitry is a single integrated circuit that performsfunctionality of processing circuitry and a memory and is coupled to andalso interacts with the communication interface 3760).

Considering even another example, two or more processing circuitries maybe implemented to include the processing module(s) 42, the communicationinterface 3760 (including the TX 3762 and/or RX 3764 thereof), and/orthe memory. In such examples, such a “processing circuitry” or“processing circuitries” (or “processor” or “processors”) is/areconfigured to perform various operations, functions, communications,etc. as described herein. In general, the various elements, components,etc. shown within the TSD 3710 may be implemented in any number of“processing modules,” “processing circuits,” “processing circuitry,”“processors,” and/or “processing units” (e.g., 1, 2, . . . , andgenerally using N such “processing modules,” “processing circuits,”“processors,” and/or “processing units”, where N is a positive integergreater than or equal to 1).

In some examples, the TSD 3710 includes both processing module(s) 42,the communication interface 3760 configured to perform variousoperations. In other examples, the TSD 3710 includes a SOC configured toperform various operations. In even other examples, the TSD 3710includes processing-memory circuitry (e.g., with memory included withinthe processing module(s) 42) configured to perform various operations.Generally, such operations include generating, transmitting, etc.signals intended for one or more other devices (e.g., computing device12-37 a and/or other processing module(s) 42) and receiving, processing,etc. other signals received for one or more other devices (e.g.,computing device 12-37 a and/or other processing module(s) 42).

In some examples, note that the communication interface 3760, which iscoupled to the processing module(s) 42, that is configured to supportcommunications within a satellite communication system, a wirelesscommunication system, a wired communication system, a fiber-opticcommunication system, and/or a mobile communication system (and/or anyother type of communication system implemented using any type ofcommunication medium or media). Any of the signals generated andtransmitted and/or received and processed by the TSD 3710 may becommunicated via any of these types of communication systems.

In addition, the processing module(s) 42 is coupled to one or moredrive-sense circuit (DSCs) 28 as described herein. For examples, theprocessing module(s) 42 is coupled to one or more DSCs 28 via one ormore lines, shown as x, where x is a positive integer greater than orequal to 1. The one or more DSCs 28 is implemented to interact with oneor more electrodes 85, shown as y, where y is a positive integer greaterthan or equal to 1. In certain examples, note that x=y. In otherexamples, x and y are different numbers, such that x and y are positiveintegers and may be the same or different valued positive integers. Insome examples, a single DSC 28 is implemented in a multiplexed fashionto service more than one DSC 28 (e.g., a first DSC 28 at a first time, asecond DSC 28 at a second time, etc.). Note that the DSC 28 isconfigured to perform simultaneous driving and sensing of signalsprovided to the one or more electrodes 85.

FIG. 37B is a schematic block diagram of another embodiment 3702 of acommunication system including a TSD in accordance with the presentinvention. This diagram is similar to the prior diagram with theexception that a TSD 3712 (that includes similar components as the TSD3710 of the prior diagram) is implemented to support wirelesscommunications with computing device 12-37 b and/or other processingmodule(s) 42 using a communication interface 3762 implemented to supportwireless communications. For example, this diagram shows communicationbetween computing device 12-37 b and/or other processing module(s) andTSD 3712 that are implemented as wireless communication devices. Also,the computing device 12-37 b and TSD 3712 may each include one or moreantennas for transmitting and/or receiving of at least one signal,symbol, packet, frame, etc. (e.g., computing device 12-37 b and mayinclude m antennas, and TSD 3712 may include n antennas, such that m andn are positive integers and may be the same or different valued positiveintegers).

FIG. 38 is a schematic block diagram of another embodiment 3800 of acommunication system including a TSD in accordance with the presentinvention. This diagram shows a touch sensor device (TSD) 3810, with orwithout display functionality, that is configured to supportcommunications with any of a number of different other devices viawireless and/or wired communication means. For example, the TSD 3810 isconfigured to support communications with a computing device 12 viawireless and/or wired communication means. For another example, the TSD3810 is configured to support communications with enterprise equipment3830 (e.g., a server) via wireless and/or wired communication means.

In addition, in some examples, the TSD 3810 is configured to supportwireless communications with a number of other wireless communicationdevices may include any one or more of a watch 3811, or some otherwearable elements that may be worn by a user, a game controller 3832, apersonal computer 3024, a laptop 3818, a cellular/smart phone 3828, apersonal digital assistant (PDA) 3830, and/or any other type of deviceconfigured to support wireless communications.

In an example of operation and implementation, the TSD 3810 isconfigured to interpret user interaction with the TSD 3810, which may bebased on a user interacting with the TSD 3810 in conjunction with anoverlay, 3-D geometric object, etc., and to provide that interpreteduser interaction to one or more other devices, such as the variouswireless communication devices depicted herein, and/or theirequivalents. For example, consider an overlay that is implemented tofacilitate keyboard interaction with the TSD 3810 based on userinteraction there with, the TSD 3810 is configured to interpret thatuser interaction with the TSD 3810, particularly based on the location,type, etc. of the overlay, it and to provide output corresponding to theuser interaction with that overlay and the TSD 3810 to one or more ofthe various devices, such as to the personal computer 3824. The personalcomputer 3824, instead of receiving input directly from a traditionalkeyboard that is connected to it, would then receive input from the TSD3810 that is interpreted to be and corresponding to be keyboard inputfrom the user that is provided via the TSD 38 and that is associatedwith the overlay that is implemented to facilitate keyboard interactionwith the TSD 3810 based on user interaction there with.

FIG. 39A is a schematic block diagram of another embodiment 3901 of acommunication system including a TSD in accordance with the presentinvention. A TSD 3910 is configured to support communications with acomputing device 12 via wireless and/or wired communication means.

One or more network segments 3916 provide communicationinter-connectivity for at least two computing devices 12 and 12-1 (e.g.,such computing devices may be implemented and operative to supportcommunications with other computing devices in certain examples, andsuch computing devices may alternatively be referred to as communicationdevices in such situations including both computing device andcommunication device functionality and capability). Generally speaking,any desired number of communication devices are included within one ormore communication systems (e.g., as shown by communication device12-2).

The various communication links within one or more network segments 3916may be implemented using any of a variety of communication mediaincluding communication links implemented as wireless, wired, optical,satellite, microwave, and/or any combination thereof, etc. communicationlinks. In general, the one or more network segments 3916 may beimplemented to support a wireless communication system, a wire linedcommunication system, a non-public intranet system, a public internetsystem, a local area network (LAN), a wireless local area network(WLAN), a wide area network (WAN), a satellite communication system, afiber-optic communication system, and/or a mobile communication system.Note that the one or more network segment 3916 may be implemented inaccordance with any one or more of a variety of environments, includingthe Internet, cellular system, cloud computing environment, etc. Also,in some instances, communication links of different types maycooperatively form a connection pathway between any two communicationdevices.

Considering one possible example, a communication pathway between theTSD 3910 and the computing device 12 includes some segments of wiredcommunication links, other segments of wireless communication links, andother segments of optical communication links, and/or othercommunication media. In addition, the various communication pathways ofthe one or more network segments 3916 may include some segments of wiredcommunication links, other segments of wireless communication links, andother segments of optical communication links, and/or othercommunication media. Note also that the computing devices 12, 12-1, and12-2 may be of a variety of types of devices including stationarydevices, mobile devices, portable devices, etc. and may supportcommunications for any of a number of services or service flowsincluding data, telephony, television, Internet, media, synchronization,etc.

In an example of operation and implementation, the TSD 3910 is incommunication with the computing device 12, and the computing device 12includes a communication interface to support communications with one ormore of the other devices 12-1 through 12-2. For example, the computingdevice 12 includes a communication interface configured to interface andcommunicate with a communication network (e.g., the one or more networksegments 3916), memory that stores operational instructions, andprocessing circuitry coupled to the communication interface and to thememory. For example, one or more processing modules of the computingdevice 12 is configured to execute the operational instructions toperform various functions, operations, etc. Note that the communicationsupported by the computing device 12 may be bidirectional/to and fromthe one or more of the other computing devices 12-1 through 12-2 orunidirectional (or primarily unidirectional) from the one or more of theother computing devices 12-1 through 12-2.

In one example, computing device 12 includes one or more processingmodules that generates, modulates, encodes, etc. and transmits signalsvia a communication interface of the computing device 12 and alsoreceives and processes, demodulates, decodes, etc. other signalsreceived via the communication interface of the computing device 12(e.g., received from other computing devices such as computing device12-1, computing device 12-2, etc.).

In some examples, note that the computing device 12 is configured tosupport receipt of user input (e.g., via a touchscreen, from the TSD3910 that is associated with an overlay 3920 implemented with the TSD3910 to facilitate operation of a keyboard, from the TSD 3910 that isassociated with another TSD, such as a 3-D geometric object configuredto facilitate user interaction with it and/or with the TSD 3910, etc.)to facilitate user interaction with one or more users of the TSD 3910and to communicate such information to one or more of the other devices12-1 through 12-2 via the computing device 12. In even other examples,note that the TSD 3910 itself is configured to communicate directly withthe one or more network segments 3916 to communicate such information toone or more of the other devices 12-1 through 12-2 (e.g., notnecessarily via the computing device 12).

In an example of operation and implementation, the TSD 3910 isconfigured to support communications with computing device 12 (e.g., viaat least one communication interface of the TSD 3910), and the computingdevice 12 is configured to support communications with a communicationsystem, such as including one or more network segments 3916, to supporttransmission of output to one or more of the other devices 12-1 through12-2. Note that the communication system may include any or anycombination of and/or any one or more of a satellite communicationsystem, a wireless communication system, a wired communication system, afiber-optic communication system, and/or a mobile communication system,etc. Note also that the TSD 3910 is configured to support communicationsdirectly with a communication system (e.g., one or more network segments3916) directly in some examples, such as via at least one communicationinterface of the TSD 3910.

FIG. 39B is a schematic block diagram of another embodiment 3902 of acommunication system including a TSD in accordance with the presentinvention. The TSD 3910 is configured to support communications with oneor more other devices via wireless and/or wired communication means.Examples of such other devices may include one or more wirelesscommunication devices 3960-3966.

The wireless communication system includes one or more base stationsand/or access points 3950, wireless communication devices 3960, 3964,3966 (e.g., wireless stations (STAs)), and a network hardware component1396. The wireless communication devices 3960-3966 may be laptopcomputers, or tablets, 3960, personal digital assistants (PDAs) 3962,personal computers 3964 and/or cellular telephones 3966 (and/or anyother type of wireless communication device). Other examples of suchwireless communication devices 3960-3966 could also or alternativelyinclude other types of devices that include wireless communicationcapability (and/or other types of communication functionality such aswired communication functionality, satellite communicationfunctionality, fiber-optic communication functionality, etc.). Examplesof wireless communication devices may include a wireless smart phone, acellular phone, a laptop, a personal digital assistant, a tablet, apersonal computers (PC), a work station, and/or a video game device.

Some examples of possible devices that may be implemented to operate inaccordance with any of the various examples, embodiments, options,and/or their equivalents, etc. described herein may include, but are notlimited by, appliances within homes, businesses, etc. such asrefrigerators, microwaves, heaters, heating systems, air conditioners,air conditioning systems, lighting control systems, and/or any othertypes of appliances, etc.; meters such as for natural gas service,electrical service, water service, Internet service, cable and/orsatellite television service, and/or any other types of meteringpurposes, etc.; devices wearable on a user or person including watches,monitors such as those that monitor activity level, bodily functionssuch as heartbeat, breathing, bodily activity, bodily motion or lackthereof, etc.; medical devices including intravenous (IV) medicinedelivery monitoring and/or controlling devices, blood monitoring devices(e.g., glucose monitoring devices) and/or any other types of medicaldevices, etc.; premises monitoring devices such as movementdetection/monitoring devices, door closed/ajar detection/monitoringdevices, security/alarm system monitoring devices, and/or any other typeof premises monitoring devices; multimedia devices includingtelevisions, computers, audio playback devices, video playback devices,and/or any other type of multimedia devices, etc.; and/or generally anyother type(s) of device(s) that include(s) wireless communicationcapability, functionality, circuitry, etc. In general, any device thatis implemented to support wireless communications may be implemented tooperate in accordance with any of the various examples, embodiments,options, and/or their equivalents, etc. described herein.

The one or more base stations (BSs) or access points (APs) 3950 areoperably coupled to the network hardware 3956 via local area networkconnection 3952. The network hardware 3956, which may be a router,switch, bridge, modem, system controller, etc., provides a wide areanetwork connection 3954 for the communication system. Each of the one ormore base stations or access points 3950 has an associated antenna orantenna array to communicate with the wireless communication devices inits area. Typically, the wireless communication devices register with aparticular base station or access point 3950 to receive services fromthe communication system. For direct connections (i.e., point-to-pointcommunications), wireless communication devices communicate directly viaan allocated channel.

Any of the various wireless communication devices (WDEVs) 3960-3966 andone or more BSs or APs 3950 may include a processing circuitry and/or acommunication interface to support communications with any other of thewireless communication devices 3960-3966 and one or more BSs or APs3950. In an example of operation, a processing circuitry and/or acommunication interface implemented within one of the devices (e.g., anyone of the WDEVs 3960-3966 and one or more BSs or APs 3950) is/areconfigured to process at least one signal received from and/or togenerate at least one signal to be transmitted to another one of thedevices (e.g., any other one of the one or more WDEVs 3960-3966 and oneor more BSs or APs 3950).

Note that general reference to a communication device, such as awireless communication device (e.g., WDEVs) 3960-3966 and one or moreBSs or APs 3950 in FIG. 39D, or any other communication devices and/orwireless communication devices may alternatively be made generallyherein using the term ‘device’ (e.g., “device” when referring to“wireless communication device” or “WDEV”). Generally, such generalreferences or designations of devices may be used interchangeably.

The processing circuitry and/or the communication interface of any oneof the various devices, WDEVs 3960-3966 and one or more BSs or APs 3950,may be configured to support communications with any other of thevarious devices, WDEVs 3960-3966 and one or more BSs or APs 3950. Suchcommunications may be uni-directional or bi-directional between devices.Also, such communications may be uni-directional between devices at onetime and bi-directional between those devices at another time.

In an example, a device (e.g., any one of the WDEVs 3960-3966 and one ormore BSs or APs 3950) includes a communication interface and/or aprocessing circuitry (and possibly other possible circuitries,components, elements, etc.) to support communications with otherdevice(s) and to generate and process signals for such communications.The communication interface and/or the processing circuitry operate toperform various operations and functions to effectuate suchcommunications (e.g., the communication interface and the processingcircuitry may be configured to perform certain operation(s) inconjunction with one another, cooperatively, dependently with oneanother, etc. and other operation(s) separately, independently from oneanother, etc.). In some examples, such a processing circuitry includesall capability, functionality, and/or circuitry, etc. to perform suchoperations as described herein. In some other examples, such acommunication interface includes all capability, functionality, and/orcircuitry, etc. to perform such operations as described herein. In evenother examples, such a processing circuitry and a communicationinterface include all capability, functionality, and/or circuitry, etc.to perform such operations as described herein, at least in part,cooperatively with one another.

In an example of implementation and operation, a wireless communicationdevice (e.g., any one of the WDEVs 3960-3966 and one or more BSs or APs3950) includes a processing circuitry to support communications with oneor more of the other wireless communication devices (e.g., any other ofthe WDEVs 3960-3966 and one or more BSs or APs 3950). For example, sucha processing circuitry is configured to perform both processingoperations as well as communication interface related functionality.Such a processing circuitry may be implemented as a single integratedcircuit, a system on a chip, etc.

In another example of implementation and operation, a wirelesscommunication device (e.g., any one of the WDEVs 3960-3966 and one ormore BSs or APs 3950) includes a processing circuitry, a communicationinterface, and a memory configured to support communications with one ormore of the other wireless communication devices (e.g., any other of theWDEVs 3960-3966 and one or more BSs or APs 3950).

In an example of operation and implementation, the TSD 3910 is incommunication with one or more of the one of the WDEVs 3960-3966, andthe one of the WDEVs 3960-3966 includes a communication interface tosupport communications with one or more other devices via the one ormore BSs or APs 3950, the local area network connection 3952, thenetwork hardware 3956, and/or the wide area network connection 3954.This diagram shows yet another implementation of the communicationsystem in which user interaction with the TSD 3910, such as may be inaccordance with an overlay, a 3-D geometric object, etc. that isassociated with the TSD 3910, may be communicated to one or more otherdevices via one or more communication means, pathways, communicationmedia, systems, etc. such user interaction with the TSD 3910 may beprovided to any one or more other devices for processing thereby, forstorage therein, for analysis thereby such as in accordance withartificial intelligence, pattern recognition, etc. for machine learning,and/or for any other purposes. Also, note that the TSD 3910 isconfigured to support communications directly with the one or more BSsor APs 3950 directly in some examples, such as via at least one wirelesscommunication interface of the TSD 3910.

FIG. 40 is a schematic block diagram of various embodiments 4001, 4002,4003, and 4004 of TSDs that are configurable in accordance with thepresent invention. In this diagram, a 3-D geometric object or TSD 4010includes multiple sections. Note that such 3-D geometric objects may ormay not include TSD functionality such as 3-D geometric object may be apassive device, such as including one or more electrodes, which mayinclude one or more marker electrodes. In other examples, such as 3-Dgeometric object is an active device that is operative to support theTSD functionality, such as including one or more electrodes, one or moreDSCs servicing those one or more electrodes, and one or more processingmodules in communication with the one or more DSCs that are configuredto operate cooperatively to support TSD functionality.

For example, the 3-D geometric object or TSD 4010, shown in the upperleft-hand portion of the diagram, includes three sections. As shown byembodiment 4001, the respective sections are capable to be folded withrespect to one another, as shown by section 1, section 2, and section 3.Traversing to the right at the top of the diagram, the 3-D geometricobject or TSD 4010 is transformed from a first configuration to a secondconfiguration based on the folding of the respective sections. Forexample, as section 3 is folded towards section 2, and as section 1 isfolded towards section 2, as shown in the diagram, the 3-D geometricobject or TSD 4010 is transformed from a first configuration to a secondconfiguration.

With respect to this diagram and any others herein that include one ormore TSDs, note that one or more marker electrodes may be includedwithin any one or more portions of a 3-D geometric object or TSD,including the different respective sections of the multiple section 3-Dgeometric object or TSD. Note also that the marker electrodes may havethe same or different patterns within the different respective sections,as may be desired in various examples.

Considering another example, the 3-D geometric object or TSD 4020, asshown in the middle left of the diagram, includes four respectivesections. As can be seen by the embodiment 4002, based on folding ofsection 4 toward section 3, section 3 toward section 2, and section 1toward second 2, the 3-D geometric object or TSD 4020 is transformedfrom a first configuration to a second configuration.

Considering yet another example with respect to the 3-D geometric objector TSD 4020, as can be seen by the embodiment 4003, based on folding ofsection 3 toward section 2, the 3-D geometric object or TSD 4020 istransformed from a first configuration to a third configuration that isdifferent from the second configuration. As can be seen, with respect toa 3-D geometric object or TSD, such as 3-D geometric object or TSD 4020,having multiple sections, that same 3-D geometric object or TSD may betransformed into different respective configurations based on thecapability by which the 3-D geometric object or TSD may be modified. Inthis example, the 3-D geometric object or TSD 4020 includes differentrespective sections that may be folded onto one another thereby formingdifferent respective configurations based on the same 3-D geometricobject or TSD 4020.

Considering another example, consider embodiment 4004 that includes avariant of the TSD 3-D geometric object or 4020, which is similar informat but includes differently sized sections, such as sections 2 and 4are larger than shown with respect to 3-D geometric object or TSD 4020.Consider similar folding within embodiment 4004 as is performed withrespect to them by about 4002, then the variant of the 3-D geometricobject or TSD 4020 is transformed from a first configuration to a fourthconfiguration such that a void is included within the center of the 3-Dgeometric object or TSD after being transformed into the fourthconfiguration.

Generally speaking, different respective 3-D geometric objects or TSDsmay be implemented in any of a variety of ways having capability to betransformed into any of a variety of configurations; the embodiments ofthis diagram show 3-D geometric objects or TSDs having multiplerespective sections of 3-D geometric objects being substantiallyrectangular in shape having a particular thickness.

As can be seen, not only can a particular 3-D geometric object or TSD betransformed into different respective configurations such as fordifferent respective uses, but such a 3-D geometric object or TSD mayalso be configured to interact with another TSD differently based on theparticular configuration is then. For example, consider such a 3-Dgeometric object or TSD as including one or more marker electrodeswithin one or more of the sections of the 3-D geometric object or TSD.Based on the configuration in which the 3-D geometric object or TSD hasbeen transformed, the one or more marker electrodes will providedifferent respective Z signatures that may be detected by another TSD.For example, different respective 3-D geometric objects or TSDs willhave different respective Z signatures that facilitate another TSD toidentify and differentiate them one from another.

Also, based on any one or more other considerations, such asconfiguration, position, orientation, and/or other considerations of agiven 3-D geometric object or TSD may be used to provide differentrespective Z signatures that may be detected by another TSD and used toselect between different respective functions of the very same 3-Dgeometric object or TSD when interacting with the other TSD. Forexample, based on any one or more such considerations (e.g.,configuration, position, orientation, etc.) of the 3-D geometric objector TSD, that 3-D geometric object or TSD may be configured to supportdifferent functionality when interacting with the other TSD.

FIG. 41 is a schematic block diagram of various embodiments 4101, 4102,4103, 4104, 4105, and 4106 of TSDs that are configurable and operativewith TSDs in accordance with the present invention. These variousembodiments 4101, 4102, 4103, 4104, 4105, and 4106 show different waysin which a 3-D geometric object or TSD is configured to interact withthe TSD 4110 based on one or more characteristics of the 3-D geometricobject or TSD.

Embodiment 4101 shows the 3-D geometric object or TSD 4112 that isimplemented in a first configuration and in contact with or proximity toTSD 4110. The TSD 4110 is configured to detect the 3-D geometric objector TSD 4112 based on a first Z signature corresponding to the 3-Dgeometric object or TSD 4112 being in the first configuration. The TSD4110 then interacts with the 3-D geometric object or TSD 4112 based on afirst function that corresponds to the 3-D geometric object or TSD 4112being in this first configuration.

Embodiment 4102 shows the 3-D geometric object or TSD 4112 that isimplemented in a second configuration and in contact with or proximityto TSD 4110. The TSD 4110 is configured to detect the 3-D geometricobject or TSD 4112 based on a second Z signature corresponding to the3-D geometric object or TSD 4112 being in the second configuration. TheTSD 4110 then interacts with the 3-D geometric object or TSD 4112 basedon a second function that corresponds to the 3-D geometric object or TSD4112 being in this second configuration.

Embodiments 4101 and 4102 operate such that the TSD 4110 interacts withthe 3-D geometric object or TSD 4112 differently based on the particularconfiguration in which the 3-D geometric object or TSD 4112 is currentlyimplemented.

Embodiment 4103 shows the 3-D geometric object or TSD 4114 that isimplemented in a first orientation and in contact with or proximity toTSD 4110. The TSD 4110 is configured to detect the 3-D geometric objector TSD 4114 based on a first Z signature corresponding to the 3-Dgeometric object or TSD 4114 being in the first orientation. The TSD4110 then interacts with the 3-D geometric object or TSD 4114 based on afirst function that corresponds to the 3-D geometric object or TSD 4114being in this first orientation.

Embodiment 4103 shows the 3-D geometric object or TSD 4114 that isimplemented in a second orientation and in contact with or proximity toTSD 4110. The TSD 4110 is configured to detect the 3-D geometric objector TSD 4114 based on a second Z signature corresponding to the 3-Dgeometric object or TSD 4114 being in the second orientation. The TSD4110 then interacts with the 3-D geometric object or TSD 4114 based on asecond function that corresponds to the 3-D geometric object or TSD 4114being in this second orientation.

Embodiments 4103 and 4104 operate such that the TSD 4110 interacts withthe 3-D geometric object or TSD 4114 differently based on the particularorientation in which the 3-D geometric object or TSD 4114 is currentlyimplemented. In these embodiments for 103 and 4104, the interactionbetween the TSD 4110 and the 3-D geometric object or TSD 4114 isselected based on the orientation of the 3-D geometric object or TSD4114 with respect to the TSD 4110. In such examples, suchorientation-based function change is the same whether or not the 3-Dgeometric object or TSD 4114 is upright or upside down. That is to say,the TSD 4110 is configured to detect the a first corresponding Zsignature of the 3-D geometric object or TSD 4114 when upright and asecond corresponding Z signature of the 3-D geometric object or TSD 4114when upside down and is also configured to select the same function forboth of those instances. In other alternative examples, suchorientation-based function change is the different based on whether ornot the 3-D geometric object or TSD 4114 is upright or upside down. Thatis to say, the TSD 4110 is configured to detect the a firstcorresponding Z signature of the 3-D geometric object or TSD 4114 whenupright and a second corresponding Z signature of the 3-D geometricobject or TSD 4114 when upside down and is also configured respectivelyto select different respective functions, such as a first function and asecond function, for both of those instances.

Embodiment 4105 shows the 3-D geometric object or TSD 4116 that isimplemented in a first location and in contact with or proximity to TSD4110. The TSD 4110 is configured to detect the 3-D geometric object orTSD 4116 based on a first Z signature corresponding to the 3-D geometricobject or TSD 4116 being in the first location. The TSD 4110 theninteracts with the 3-D geometric object or TSD 4116 based on a firstfunction that corresponds to the 3-D geometric object or TSD 4116 beingin this first location.

Embodiment 4106 shows the 3-D geometric object or TSD 4116 that isimplemented in a second location and in contact with or proximity to TSD4110. The TSD 4110 is configured to detect the 3-D geometric object orTSD 4116 based on a second Z signature corresponding to the 3-Dgeometric object or TSD 4116 being in the second location. The TSD 4110then interacts with the 3-D geometric object or TSD 4116 based on asecond function that corresponds to the 3-D geometric object or TSD 4116being in this second location.

Embodiments 4105 and 4106 operate such that the TSD 4110 interacts withthe 3-D geometric object or TSD 4116 differently based on the particularlocation with respect to the TSD 4110 at which the 3-D geometric objector TSD 4116 is currently located.

These embodiments 4101, 4102, 4103, 4104, 4105, and 4106 showvariability and select ability of different respective functions of a3-D geometric object or TSD when interacting with the TSD 4110 based onconfiguration, orientation, and position. Note also that, and otherexamples, combinations of configuration, orientation, and position madebe used to select among an even larger number of different respectivefunctions of a 3-D geometric object or TSD when interacting with the TSD4110.

For example, consider a 3-D geometric object or TSD in a firstconfiguration and a first orientation may be to select a first functionwhen interacting with the TSD 4110. The 3-D geometric object or TSD inthe first configuration and a second orientation may be to select asecond function when interacting with the TSD 4110. The 3-D geometricobject or TSD in a second configuration and the first orientation may beto select a third function when interacting with the TSD 4110. The 3-Dgeometric object or TSD in the second configuration and the secondorientation may be to select a fourth function when interacting with theTSD 4110.

For yet another example, consider a 3-D geometric object or TSD in afirst configuration and a first location may be to select a firstfunction when interacting with the TSD 4110. The 3-D geometric object orTSD in the first configuration and a second location may be to select asecond function when interacting with the TSD 4110. The 3-D geometricobject or TSD in a second configuration and the first location may be toselect a third function when interacting with the TSD 4110. The 3-Dgeometric object or TSD in the second configuration and the secondlocation may be to select a fourth function when interacting with theTSD 4110.

For even yet another example, consider a 3-D geometric object or TSD ina first configuration, a first orientation, and a first location may beto select a first function when interacting with the TSD 4110. The 3-Dgeometric object or TSD in the first configuration, the firstorientation, and a second location may be to select a second functionwhen interacting with the TSD 4110. The 3-D geometric object or TSD inthe first configuration, a second orientation, and the first locationmay be to select a third function when interacting with the TSD 4110.The 3-D geometric object or TSD in the first configuration, the secondorientation, and the second location may be to select a fourth functionwhen interacting with the TSD 4110.

Similar variability in selection of different other functions may bemade based on the 3-D geometric object or TSD being in a secondconfiguration and having different respective orientations and/orlocations to select different respective functions when interacting withthe TSD 4110.

Examples of different respective functions corresponding to theinteraction of the TSD 4110 with different respective 3-D geometricobjects or TSDs may be performed in a variety of ways. Generallyspeaking, a respective 3-D geometric object or TSD may be implemented tooperate in accordance with different respective functionalities atdifferent times based on any one of configuration, orientation,position, and or other characteristics associated with the respective3-D geometric object or TSD when interacting with the TSD 4210.

For example, a first function may correspond to a 3-D geometric objector TSD operating as a remote control for the television. A secondfunction may correspond to the 3-D geometric object or TSD operating asa remote control for a digital video recorder (DVR). A second functionmay correspond to the 3-D geometric object or TSD operating as a garagedoor opener. The fourth function may correspond to the 3-D geometricobject or TSD operating as a heating, ventilation, air conditioning(HVAC) controller. The fifth function may correspond to the 3-Dgeometric object or TSD operating as an appliance controller interface(e.g., such as for an oven, microwave, etc.). Also, note that such a 3-Dgeometric object or TSD, when implemented as an active device, may beimplemented to include display functionality to provide indication ofwhich portions of the 3-D geometric object or TSD correspond to buttonsor touch sections that correspond to operation in accordance withvarious operations for various functions. In some examples, such displayfunctionality is implemented using one or more of touchscreen display,an liquid crystal display (LCD) operable display, a light emitting diode(LED) operable display, and/or other visual output component, that isconfigured to provide indication to the a user of where particularly totouch the 3-D geometric object or TSD.

In other examples, the 3-D geometric object or TSD includes no suchdisplay functionality, and user interaction in accordance with the 3-Dgeometric object or TSD with respect to different surfaces, portions,etc. of the 3-D geometric object or TSD effectuates the differentfunctions. The user then interacts with the 3-D geometric object or TSDbased on information known to the user regarding where and how tointeract with the 3-D geometric object or TSD to effectuate thedifferent respective functions.

In even other examples, the 3-D geometric object or TSD is implementedto include different respective patterns, colors, text, description,printing, etc. and/or other differentiating and indicating means on oneor more portions of one or more surfaces of the 3-D geometric object orTSD. The user then interacts with the 3-D geometric object or TSD basedon information known to the user regarding where and how to interactwith the 3-D geometric object or TSD with respect to the different oneor more portions of one or more surfaces of the 3-D geometric object orTSD to effectuate the different respective functions. For example, theuser interacts with a first portion of a first surface of the 3-Dgeometric object or TSD that is facing upwards to effectuate a firstfunction, with a second portion of the first surface of the 3-Dgeometric object or TSD that is facing upwards to effectuate a secondfunction, and so on. The different differentiating and indicating meansassociated with the first and second portions of the first surface ofthe 3-D geometric object or TSD provide indication to the user of whereto interact with the 3-D geometric object or TSD to effectuate thedifferent respective functions (e.g., first printing on the firstportion of the first surface of the 3-D geometric object or TSD toindicate that portion may be used to effectuate the first function,second printing on the second portion of the second surface of the 3-Dgeometric object or TSD to indicate that particular portion may be usedto effectuate the second function, and so on). The different respectiveportions of the first surface include different respective patterns,colors, text, description, printing, etc. and/or other differentiatingand indicating means.

For another example, the user interacts with a first surface of the 3-Dgeometric object or TSD when that first surface of the 3-D geometricobject or TSD is facing upwards to effectuate a first function, with asecond surface of the 3-D geometric object or TSD when that secondsurface of the 3-D geometric object or TSD is facing upwards toeffectuate a second function, and so on. The different respectivesurfaces include different respective patterns, colors, text,description, printing, etc. and/or other differentiating and indicatingmeans. For example, depending on the orientation of the 3-D geometricobject or TSD with respect to the TSD 4110, different respectivesurfaces will be facing upwards and are then available to facilitateuser interaction therewith.

Note that such different respective patterns, colors, text, description,printing, etc. and/or other differentiating and indicating means on oneor more portions of one or more surfaces of the 3-D geometric object orTSD may also be implemented with respect to different respectivesections of a multiple section 3-D geometric object or TSD so as toprovide information to a user regarding the what functionality isassociated with the 3-D geometric object or TSD depending on itsorientation, configuration, etc. For example, consider that a multiplesection 3-D geometric object or TSD is implemented in a firstorientation and/or configuration, then a first pattern, color, text,description, printing, etc. and/or other differentiating and indicatingmeans is visible to a user providing information to the user regarding afirst function associated with that first orientation and/orconfiguration. Then, when the multiple section 3-D geometric object orTSD is implemented in a second orientation and/or configuration, then asecond pattern, color, text, description, printing, etc. and/or otherdifferentiating and indicating means is visible to the user regarding asecond function associated with that second orientation and/orconfiguration.

In yet other examples, user interaction accordance with the 3-Dgeometric object or TSD with respect any of surfaces, portions, etc. ofthe 3-D geometric object or TSD effectuates a given function. Forexample, consider the 3-D geometric object or TSD configured to operateas a button that operates generally as a very simple, toggle switch(e.g., such as garage door opener such that a first touch of the buttonstarts the garage door to move, and a second touch of the button stopsthe garage door at its current position and/or reverses the direction ofmovement of the garage door), then any user interaction with the 3-Dgeometric object or TSD effectuates the operation of such the toggleswitch. In addition, depending on the orientation, configuration, etc.of the -D geometric object or TSD, different respective portions orsurfaces of the 3-D geometric object or TSD may be implemented toeffectuate different simple, toggle switches. In one example, the firstand second functions may be very simple/toggle type functions such thefirst function being that of a garage door opener, the second functionbeing that of door lock/unlock mechanism, etc.

In even other examples, the first and second functions are more complexfunctions such the first function being that of a TV and/or DVR remotecontrol, the second function being that of an HVAC control console toeffectuate heating and/or cooling operations of a building, etc.

Generally speaking, the number of different respective functionscorresponding to the interaction of the TSD 4110 with differentrespective 3-D geometric objects or TSDs are myriad. These are examplesand do not constitute an exhaustive list of the countless variety offunctions for that may be implemented corresponding to the interactionof the TSD 4110 with different respective 3-D geometric objects or TSDs.

FIG. 42 is a schematic block diagram of other various embodiments 4201,4202, 4203, and 4204 of 3-D geometric objects or TSDs that areconfigurable and operative with TSDs in accordance with the presentinvention. This diagram shows a 3-D geometric object or TSD 4220 asincluding four respective sections and is configurable based on thosefour respective sections. A 3-D geometric object or TSD 4220 isoperative to interact with the TSD 4210. Based on the configuration ofthese the 3-D geometric object or TSD 4220, the TSD 4210 is configuredto interact differently with the 3-D geometric object or TSD 4220.

As can be seen with respect to embodiment 4201, based on the 3-Dgeometric object or TSD 4220 being implemented within a firstconfiguration, the TSD 4210 interacts with the 3-D geometric object orTSD 4220 based on the first function. For example, the firstconfiguration corresponds to the four respective sections of the 3-Dgeometric object or TSD 4220 being aligned together in the same plane,or corresponding to a flat configuration.

In embodiment 4202, based on the 3-D geometric object or TSD 4220 beingimplemented within a second configuration, the TSD 4210 interacts withthe 3-D geometric object or TSD 4220 based on a second function. Thesecond configuration corresponds to the four sections of the 3-Dgeometric object or TSD 4220 being folded together, and also with the3-D geometric object or TSD 4220 being any particular orientation withrespect to the TSD 4210. For example, the two larger sections of thefour sections of the 3-D geometric object or TSD 4220 are located on thetop and bottom within this second configuration.

In embodiment 4203, based on the 3-D geometric object or TSD 4220 beingimplemented within a third configuration, the TSD 4210 interacts withthe 3-D geometric object or TSD 4220 based on a third function. Thethird configuration also corresponds to the four sections of the 3-Dgeometric object or TSD 4220 being folded together, and also with the3-D geometric object or TSD 4220 being any particular orientation withrespect to the TSD 4210 that is different than within the embodiment4202. For example, the two larger sections of the four sections of the3-D geometric object or TSD 4220 are located on the left and rightwithin this third configuration, such that the 3-D geometric object orTSD 4220 is oriented within the embodiment 4203 after having undergone a90° rotation relative to the embodiment 4202.

In embodiment 4204, based on the 3-D geometric object or TSD 4220 beingimplemented within a fourth configuration, the TSD 4210 interacts withthe 3-D geometric object or TSD 4220 based on a fourth function. Thefourth configuration also corresponds to the four sections of the 3-Dgeometric object or TSD 4220 being folded together, and also with the3-D geometric object or TSD 4220 being any particular orientation withrespect to the TSD 4210 that is different than within the embodiment4202 or embodiment 4203. For example, the two larger sections of thefour sections of the 3-D geometric object or TSD 4220 are located on thetop and bottom within this fourth configuration, such that the 3-Dgeometric object or TSD 4220 is oriented within the fourth 4203 afterhaving undergone a 90° rotation relative to the embodiment 4203 or afterhaving undergone a 180° rotation relative to the embodiment 4202.

As can be seen with respect to these embodiments, differentfunctionality of a 3-D geometric object or TSD 4220 may be performedbased on its interaction with a TSD 4210 based not only on theconfiguration and manner in which the 3-D geometric object or TSD 4220is particularly configured, but also based on its orientation withrespect to the TSD 4210.

FIG. 43A is a schematic block diagram of other various embodiments 4301,4302, 4303, and 4304 of 3-D geometric objects or TSDs that areconfigurable and operative with TSDs in accordance with the presentinvention. These embodiments show orientation-based function change withrespect to a 3-D geometric object or TSD 4314 when interacting with aTSD 4310. For example, embodiment 4301 shows a first orientation suchthat the 3-D geometric object or TSD 4314 is inverted relative to theorientation as is shown in the middle of the diagram.

In embodiment 4301, based on the 3-D geometric object or TSD 4314 beingimplemented within a first orientation, the TSD 4310 interacts with the3-D geometric object or TSD 4314 based on a first function.

Embodiment 4302 shows a second orientation such that the 3-D geometricobject or TSD 4314 is rotated clockwise 90° relative to the orientationas is shown in the middle of the diagram. In embodiment 4302, based onthe 3-D geometric object or TSD 4314 being implemented within a secondorientation, the TSD 4310 interacts with the 3-D geometric object or TSD4314 based on a second function.

Embodiment 4303 shows a third orientation such that the 3-D geometricobject or TSD 4314 is similarly oriented as is shown in the middle ofthe diagram. In embodiment 4303, based on the 3-D geometric object orTSD 4314 being implemented within a third orientation, the TSD 4310interacts with the 3-D geometric object or TSD 4314 based on a thirdfunction.

Embodiment 4304 shows a second orientation such that the 3-D geometricobject or TSD 4314 is rotated counter-clockwise 90° relative to theorientation as is shown in the middle of the diagram. In embodiment4302, based on the 3-D geometric object or TSD 4314 being implementedwithin a second orientation, the TSD 4310 interacts with the 3-Dgeometric object or TSD 4314 based on a second function.

In some examples, such selectivity between different respectivefunctions is made based on only the orientation of the 3-D geometricobject or TSD 4314 with respect to the TSD 4310. For example, one ormore processing modules of the TSD 4310 is implemented to interpretsignals provided from DSCs that are coupled to electrodes of the TSD4310 and to facilitate selectivity between different respectivefunctions based on only the orientation of the 3-D geometric object orTSD 4314 with respect to the TSD 4310.

FIG. 43B is a schematic block diagram of other various embodiments 4305and 4206 of 3-D geometric objects or TSDs that are configurable andoperative with TSDs in accordance with the present invention. Theseembodiments show position-based function change with respect to a 3-Dgeometric object or TSD 4314 when interacting with a TSD 4310.

Embodiment 4305 shows a first location of the 3-D geometric object orTSD 4314 with respect to the TSD 4310. For example, the first locationcorresponds to the 3-D geometric object or TSD 4314 being located to theleft of the top surface of with respect to the TSD 4310. In embodiment4305, based on the 3-D geometric object or TSD 4314 being located withinthis first location, the TSD 4310 interacts with the 3-D geometricobject or TSD 4314 based on a first function.

Embodiment 4306 shows a second location of the 3-D geometric object orTSD 4314 with respect to the TSD 4310. For example, the second locationcorresponds to the 3-D geometric object or TSD 4314 being located to theright of the top surface of with respect to the TSD 4310. In embodiment4305, based on the 3-D geometric object or TSD 4314 being located withinthis second location, the TSD 4310 interacts with the 3-D geometricobject or TSD 4314 based on a second function.

In some examples, such selectivity between different respectivefunctions is made based on only the location of the 3-D geometric objector TSD 4314 with respect to the TSD 4310. For example, one or moreprocessing modules of the TSD 4310 is implemented to interpret signalsprovided from DSCs that are coupled to electrodes of the TSD 4310 and tofacilitate selectivity between different respective functions based ononly the location of the 3-D geometric object or TSD 4314 with respectto the TSD 4310.

FIG. 44 is a schematic block diagram of other various embodiments 4401,4402, 4403, 4404, 4405, 4406, 4407, and 4408 of 3-D geometric objects orTSDs that are configurable and operative with TSDs in accordance withthe present invention. These embodiments show combined position-basedand orientation-based function change with respect to a 3-D geometricobject or TSD 4412 when interacting with a TSD 4410. Providingselectivity between different respective functions using more than oneconsideration or dimensions, in this case both position and orientation,and even greater number of different respective functions may besupported based on a 3-D geometric object or TSD 4412 interacting with aTSD 4410. Generally speaking, any of a number of differentconsiderations or dimensions such as configuration, position,orientation, and/or other considerations may be used to select betweendifferent respective functions.

Embodiment 4401 shows a first orientation such that the 3-D geometricobject or TSD 4412 is inverted relative to the orientation as is shownin the top middle of the diagram. In embodiment 4401, based on the 3-Dgeometric object or TSD 4314 being implemented within a firstorientation and also within a first location, such as corresponding tothe left hand portion of the top surface of the TSD 4410, the TSD 4410interacts with the 3-D geometric object or TSD 4412 based on a firstfunction.

Embodiment 4402 also shows the first orientation such that the 3-Dgeometric object or TSD 4412 is inverted relative to the orientation asis shown in the top middle of the diagram. In embodiment 4402, based onthe 3-D geometric object or TSD 4314 being implemented within the firstorientation yet within a second location, such as corresponding to theright hand portion of the top surface of the TSD 4410, the TSD 4410interacts with the 3-D geometric object or TSD 4412 based on a secondfunction.

Embodiment 4403 shows a second orientation such that the 3-D geometricobject or TSD 4412 is similarly oriented as is shown in the top middleof the diagram. In embodiment 4403, based on the 3-D geometric object orTSD 4314 being implemented within the second orientation yet within thefirst location, such as corresponding to the left hand portion of thetop surface of the TSD 4410, the TSD 4410 interacts with the 3-Dgeometric object or TSD 4412 based on a third function.

Embodiment 4404 shows the second orientation such that the 3-D geometricobject or TSD 4412 is similarly oriented as is shown in the top middleof the diagram. In embodiment 4404, based on the 3-D geometric object orTSD 4314 being implemented within the second orientation yet within asecond location, such as corresponding to the right hand portion of thetop surface of the TSD 4410, the TSD 4410 interacts with the 3-Dgeometric object or TSD 4412 based on a fourth function.

Embodiment 4405 shows a third orientation such that the 3-D geometricobject or TSD 4412 is rotated clockwise 90° compared to the orientationof the 3-D geometric object or TSD 4412 as is shown in the top middle ofthe diagram. In embodiment 4405, based on the 3-D geometric object orTSD 4314 being implemented within the third orientation yet within thefirst location, such as corresponding to the left hand portion of thetop surface of the TSD 4410, the TSD 4410 interacts with the 3-Dgeometric object or TSD 4412 based on a fifth function.

Embodiment 4406 also shows the third orientation such that the 3-Dgeometric object or TSD 4412 is rotated clockwise 90° compared to theorientation of the 3-D geometric object or TSD 4412 as is shown in thetop middle of the diagram. In embodiment 4406, based on the 3-Dgeometric object or TSD 4314 being implemented within the thirdorientation yet within the second location, such as corresponding to theright hand portion of the top surface of the TSD 4410, the TSD 4410interacts with the 3-D geometric object or TSD 4412 based on a sixthfunction.

Embodiment 4407 shows a fourth orientation such that the 3-D geometricobject or TSD 4412 is rotated counter-clockwise 90° compared to theorientation of the 3-D geometric object or TSD 4412 as is shown in thetop middle of the diagram. In embodiment 4407, based on the 3-Dgeometric object or TSD 4314 being implemented within the fourthorientation yet within the first location, such as corresponding to theleft hand portion of the top surface of the TSD 4410, the TSD 4410interacts with the 3-D geometric object or TSD 4412 based on a seventhfunction.

Embodiment 4408 also shows the fourth orientation such that the 3-Dgeometric object or TSD 4412 is rotated counter-clockwise 90° comparedto the orientation of the 3-D geometric object or TSD 4412 as is shownin the top middle of the diagram. In embodiment 4408, based on the 3-Dgeometric object or TSD 4314 being implemented within the fourthorientation yet within the second location, such as corresponding to theright hand portion of the top surface of the TSD 4410, the TSD 4410interacts with the 3-D geometric object or TSD 4412 based on an eighthfunction.

In some examples, such selectivity between different respectivefunctions is made based on both the location and the orientation of the3-D geometric object or TSD 4414 with respect to the TSD 4410. Forexample, one or more processing modules of the TSD 4410 is implementedto interpret signals provided from DSCs that are coupled to electrodesof the TSD 4410 and to facilitate selectivity between differentrespective functions based on both the location and the orientation ofthe 3-D geometric object or TSD 4414 with respect to the TSD 4410.

As described above with respect to various embodiments, examples, etc.,a TSD is configured to detect various characteristics including thepresence, location, orientation, and/or position, etc. of any anothercomponent or device, such as another TSD, a 3-D geometric object, anoverlay, a 3-D geometric object including TSD functionality, etc. and tooperate appropriately based on the presence, location, orientation,and/or position, etc. of the other component or device with respect tothe TSD. Various embodiments, examples, etc., are described below withrespect to operation of a TSD in accordance with region of interestprocessing (ROIP) with respect to one or more portions of the TSD. Incertain implementations, such ROIP is performed with respect to adaptingsensitivity of one or more portions of the TSD based on presence,location, orientation, and/or position, etc. of the other component ordevice with respect to the TSD. In even other alternativeimplementations, such ROIP is performed with respect to adaptingoperation entirely, such as enabling/disabling operation of one or moreportions of the TSD based on presence, location, orientation, and/orposition, etc. of the other component or device with respect to the TSD.

FIG. 45 is a schematic block diagram of an embodiment 4500 of an overlaythat is operative with a TSD that is configured to perform sensitivitybased region of interest processing (ROIP) in accordance with thepresent invention. In this diagram, and overlay 4520 is placed on afirst portion of a surface of a TSD 4510. The TSD 4510 is shown ashaving row and column electrodes, but with respective the TSD 4510 ofthis diagram as well as any other TSD in any other embodiment, example,diagram, etc., note that electrodes implemented therein may beimplemented in accordance with any desired pattern, arrangement,configuration, etc. In addition, note that the overlay 4520 of thisdiagram as well as any other overlay in any other embodiment, example,diagram, etc. may be implemented to include one or more electrodes inone or more keys thereof such as to facilitate improved capacitivecoupling with one or more electrodes of the TSD 4510.

The first portion of the service of the TSD 4510 is provision for theoverlay 4520. The remaining portion of the surface of the TSD 4510 isavailable for any of a number of other functions that may include anyone or more of non-overlay functionality, as having unchangedsensitivity, being disabled, etc.

As can be seen in the projection of the first portion of the surface ofthe TSD 4510 and the overlay 4520 there on in the middle left of thediagram, based on the TSD 4510 detecting the location, position,identity, etc. of the overlay 4520, the TSD 4510 is configured to adaptoperation of the first portion of the surface of the TSD 4510 that isassociated with the overlay 4520. Moving from left to right, as can beseen, a different level of sensitivity is operated with respect to theelectrodes associated with the first portion of the surface of the TSD4510 that is associated with the overlay 4520. For example, as can beseen at the bottom of the diagram, moving left right, the first portionof the TSD 4510 is shown without the overlay 4520 there on to providebetter illustration of adaptation of the sensitivity of the firstportion of the TSD 4510.

On the bottom left of the diagram, the first portion of the TSD 4510 isoperated based on a first sensitivity, such as may be associated withusing all the available electrodes within the first portion of the TSD4510. On the bottom right of the diagram, the first portion of the TSD4510 is operated based on the second sensitivity, which corresponds to adifferent sensitivity than the first sensitivity. For example, thesecond sensitivity is implemented using a subset of the electrodeswithin the first portion of the TSD 4510. In one implementation, thiscorresponds to using every other electrode in the first portion of theTSD 4510. In another implementations corresponds to using every thirdelectrode in the first portion of the TSD 4510. This may correspond tousing every other electrode, every third electrode, etc. correspondingto relevant column electrodes of the first portion of the TSD 4510 thatis associated with the overlay 4520.

Generally speaking, based on the TSD 4510 detecting the location,position, identity, etc. the overlay 4520, the TSD 4510 is configured toadapt operation of the first portion of the TSD 4510 that is associatedwith the overlay 4520. Consider the overlay 4520 having keys that are ofmuch greater size than the pitch, spacing, etc. of the electrodes of theTSD 4510. In such an instance, every electrode passing underneath thekeys of the overlay 4520 need not be used to detect user interactionwith the overlay 4520 that is associated with the TSD 4510. Consider anexample in which n (a positive integer greater than or equal to)electrodes pass underneath a key of the overlay 4520, yet based on thespacing of those electrodes being Y millimeters, where X is some numbersuch as 1, 1.5, 2, etc., and consider that the width of a key of theoverlay 40 is Y centimeters, where Y is some number such as 1, 1.5, 2,etc. Then also consider that X is much less than Y, then fewer than allof the n electrodes that pass underneath a key of the overlay 4520 maybe used and still detect user interaction with that key of the overlay4520 that is associated with the TSD 4510 while still detecting anddiscriminating with which particular key or keys of the overlay 4520that the user is interacting. In such instances, the TSD 4510 isconfigured to operate based on a sensitivity that is less than the fullsensitivity of the first portion of the TSD 4510.

FIG. 46 is a schematic block diagram of another embodiment 4600 of anoverlay that is operative with a TSD that is configured to performsensitivity based ROIP in accordance with the present invention. Thisdiagram is similar to the prior diagram with the difference being thatthe first portion of the TSD 4510 is operated using a third sensitivitythat is less than a second sensitivity used in the prior diagram. Forexample, the TSD 4510 is initially operated using every other electrodein the first portion of the TSD 4510. Based on acceptable operation andperformance in accordance with the second sensitivity, the TSD 4510 issubsequently operated using every third electrode of the first portionof the TSD 4510 in accordance with the third sensitivity that is lessthan the second sensitivity. As may be desired, the TSD 4510 is furtheradapted in terms of operation using fewer and fewer electrodes in thefirst portion of the TSD 4510 until the operation and performance failsto meet one or more performance criteria. When operation and performanceof the TSD 4510 in cooperation with the overlay 4520 comparesunfavorably with the one or more performance criteria, the TSD 4510 isconfigured to adapt operation to increase sensitivity within the firstportion of the TSD 4510. Then, based on this increasing sensitivitywithin the first portion of the TSD 4510, when operation and performanceof the TSD 4510 in cooperation with the overlay 4520 compares favorablywith the one or more performance criteria, the TSD 4510 is configured tocontinue operation within this acceptable level of sensitivity withinthe first portion of the TSD 4510.

Note that adapting the sensitivity of operation of the TSD 4510 canprovide for many improvements in the operation of the TSD 4510 wheninteracting with the overlay 4520 including sensitivity optimization,power management which may include power savings, reduced powerconsumption, optimize power consumption, etc., adaptive sensitivity forimproved detection of user interaction with the overlay 4520 that isassociated with the TSD 4510, etc., among other improvements.

FIG. 47 is a schematic block diagram of an embodiment 4700 of an overlayand a 3-D geometric object, which may or may not include TSDfunctionality, that are both operative with a TSD that is configured toperform sensitivity based ROIP in accordance with the present invention.This diagram has certain similarities to the previous two diagrams withat least one difference being that a second TSD or 3-D geometric object4712 is interactive with a TSD 4710 and allocation that is differentthan an overlay 4720. Similar to previous diagrams, the first portion ofthe surface of the TSD 4710 is provisioned for operation based on theoverlay 4720, however, the second TSD or 3-D geometric object 4712 isoperative within another location of the TSD 4710. The remaining portionof the surface of the TSD 4710 that is not included within the firstportion of the service of the TSD 4710 that is provisioned for theoverlay 4720, and particularly any portion of this remaining portion ofthe service of the TSD 4710 that is not associated with the second TSDor 3-D geometric object 4712 is available for any of a number of otherfunctions that may include any one or more of non-overlay functionality,as having unchanged sensitivity, being disabled, etc.

In this diagram, the TSD 4710 is configured to adapt the sensitivityassociated with the first portion of the surface of the TSD 4710 that isprovisioned for the overlay 4720 and/or that portion included within theremaining portion of the service of the TSD 4710 that is associated withthe second TSD or 3-D geometric object 4712. For example, thesensitivity within these portions of the surface of the TSD 4710 may beincreased, decreased, etc.

While certain embodiments, examples, diagrams, etc. described hereincorrespond to situations where sensitivity of different respectiveportions of a TSD may be adapted or modified based on the TSD beingimplemented and operative in accordance with any one or more of anotherTSD, and overlay, a 3-D geometric object, etc., Other embodiments,examples, diagrams, etc. are described below where sensitivity or touchsensing capability is enabled or disabled for different respectiveportions of a TSD so implemented.

In an example of operation and implementation, a TSD (e.g., TSD 4710 orany other TSD described herein or their equivalents) includes aplurality of TSD electrodes associated with a surface of the TSD. Also,an overlay that includes one or more marker electrodes also beingassociated with a region of the surface of the TSD.

The TSD also includes a plurality of drive-sense circuits (DSCs)operably coupled to the plurality of TSD electrodes. A DSC of theplurality of DSCs is operably coupled to receive a reference signal andto generate a TSD electrode signal based on the reference signal. Whenenabled, the DSC operably coupled and configured to provide the TSDelectrode signal to a TSD electrode of the plurality of TSD electrodesand simultaneously to sense a change of the TSD electrode signal basedon a change of impedance of the TSD electrode caused by capacitivecoupling between the TSD electrode and the one or more marker electrodesbased on the overlay being associated with the at least a portion of thesurface of the TSD. The DSC is also operably coupled and configured togenerate a digital signal that is representative of the change ofimpedance of the TSD electrode.

The TSD includes or is coupled to memory that stores operationalinstructions. The TSD also includes one or more processing modulesoperably coupled to the plurality of DSCs and the memory. When enabled,the one or more processing modules is configured to execute theoperational instructions to generate the reference signal and to processthe digital signal generated by the DSC of the plurality of DSCs and aplurality of other digital signals generated by other DSCs of theplurality of DSCs to determine the region of the surface of the TSD thatis associated with the overlay. Also, the one or more processing modulesis configured to execute the operational instructions to adaptsensitivity of the TSD within the region of the surface of the TSD thatis associated with the overlay including to change a number operationalelectrodes of the plurality of TSD electrodes that are implemented toservice the region of the surface of the TSD that is associated with theoverlay in accordance with detecting user interaction with the overlay.

In certain examples, when enabled, the one or more processing modules isconfigured to execute the operational instructions to adapt thesensitivity of the TSD within the region of the surface of the TSD thatis associated with the overlay including to operate fewer than all of asubset of the plurality of TSD electrodes that are implemented toservice the region of the surface of the TSD that is associated with theoverlay in accordance with detecting user interaction with the overlay.

In other examples, when enabled, the one or more processing modules isconfigured to execute the operational instructions to adapt thesensitivity of the TSD within the region of the surface of the TSD thatis associated with the overlay including to increase the numberoperational electrodes of the plurality of TSD electrodes that areimplemented to service the region of the surface of the TSD that isassociated with the overlay in accordance with detecting userinteraction with the overlay.

In even other examples, when enabled, the one or more processing modulesis configured to execute the operational instructions to process thedigital signal generated by the DSC of the plurality of DSCs todetermine one or more characteristics of the overlay that is associatedwith the region of the surface of the TSD.

Examples of the one or more characteristics of the overlay may includeany one or more of an outline of the overlay, locations of keys of theoverlay, a location of the overlay on the surface of the TSD, locationof the one or more marker electrodes within the at least a portion ofthe surface of the TSD, a pattern of the one or more marker electrodes,a function of the overlay, a type of the overlay, and/or an orientationof the overlay.

Also, in certain examples, the TSD is a portable device that includes aninternal power source (e.g., such as with respect to FIG. 36 ).

Also, in some implementations of the TSD, note that the plurality of TSDelectrodes includes a first subset of the plurality of TSD electrodesaligned in a first direction and a second subset of the plurality of TSDelectrodes that are separated from the first subset of the plurality ofTSD electrodes by a dielectric material and are aligned in a seconddirection.

In addition, in some examples, the TSD includes multiple sections (e.g.,such as certain TSDs including depicted in FIGS. 27, 28, 34, 40 , amongothers). The TSD has a first shape when the multiple sections areimplemented within a first configuration, and the TSD has a second shapewhen the multiple sections are implemented within a secondconfiguration. Also, note that certain implementations of the TSDinclude a non-flat surface and/or curved surface (e.g., such as certainTSDs including depicted in FIG. 27 , among others).

In addition, note that the DSC of the plurality of DSCs may beimplemented in a variety of ways. For example, in one implementation,the DSC of the plurality of DSCs includes a power source circuitoperably coupled via a single line to the TSD electrode. When enabled,the power source circuit is configured to provide an analog signal viathe single line coupling to the TSD electrode. Note that the analogsignal includes at least one of a DC (direct current) component or anoscillating component. The DSC also includes a power source changedetection circuit operably coupled to the power source circuit. Whenenabled, the power source change detection circuit is configured todetect an effect on the analog signal that is based on an electricalcharacteristic of the TSD electrode and to generate the digital signalthat is representative of the change of impedance of the TSD electrode.

In certain particular examples, the power source circuit includes apower source to source at least one of a voltage or a current via thesingle line to the TSD electrode. The power source change detectioncircuit also includes a power source reference circuit configured toprovide at least one of a voltage reference or a current reference, anda comparator configured to compare the at least one of the voltage andthe current provided via the single line to the TSD electrode to the atleast one of the voltage reference and the current reference to producethe analog signal.

In another example of operation and implementation, a TSD (e.g., TSD4710 or any other TSD described herein or their equivalents) includes aplurality of TSD electrodes associated with a surface of the TSD. Also,an overlay that includes one or more marker electrodes is alsoassociated with a region of the surface of the TSD. Note that theplurality of TSD electrodes includes a first subset of the plurality ofTSD electrodes aligned in a first direction and a second subset of theplurality of TSD electrodes that are separated from the first subset ofthe plurality of TSD electrodes by a dielectric material and are alignedin a second direction.

The TSD also includes a plurality of drive-sense circuits (DSCs)operably coupled to the plurality of TSD electrodes. A DSC of theplurality of DSCs is operably coupled to receive a reference signal andto generate a TSD electrode signal based on the reference signal. Whenenabled, the DSC is operably coupled and configured to provide the TSDelectrode signal to a TSD electrode of the plurality of TSD electrodesand simultaneously to sense a change of the TSD electrode signal basedon a change of impedance of the TSD electrode caused by capacitivecoupling between the TSD electrode and the one or more marker electrodesbased on the overlay being associated with the at least a portion of thesurface of the TSD. The DSC is also operably coupled and configured togenerate a digital signal that is representative of the change ofimpedance of the TSD electrode.

The TSD includes and/or is coupled to memory that stores operationalinstructions. The TSD also includes one or more processing modulesoperably coupled to the plurality of DSCs and the memory When enabled,the one or more processing modules is configured to execute theoperational instructions to generate the reference signal and to processthe digital signal generated by the DSC of the plurality of DSCs and aplurality of other digital signals generated by other DSCs of theplurality of DSCs to determine the region of the surface of the TSD thatis associated with the overlay to determine one or more characteristicsof the overlay that is associated with the region of the surface of theTSD. The one or more processing modules is also configured to executethe operational instructions to adapt sensitivity of the TSD within theregion of the surface of the TSD that is associated with the overlayincluding to change a number operational electrodes of the plurality ofTSD electrodes that are implemented to service the region of the surfaceof the TSD that is associated with the overlay in accordance withdetecting user interaction with the overlay.

In certain examples, when enabled, the one or more processing modules isconfigured to execute the operational instructions to adapt thesensitivity of the TSD within the region of the surface of the TSD thatis associated with the overlay including to operate fewer than all ofanother subset of the plurality of TSD electrodes that are implementedto service the region of the surface of the TSD that is associated withthe overlay in accordance with detecting user interaction with theoverlay.

In certain other examples, when enabled, the one or more processingmodules is configured to execute the operational instructions to adaptthe sensitivity of the TSD within the region of the surface of the TSDthat is associated with the overlay including to increase the numberoperational electrodes of the plurality of TSD electrodes that areimplemented to service the region of the surface of the TSD that isassociated with the overlay in accordance with detecting userinteraction with the overlay.

FIG. 48 is a schematic block diagram of an embodiment 4800 of an overlaythat is operative with a TSD that is configured to performenable/disable based ROIP in accordance with the present invention. Inthis diagram has some similarities to certain of the previous diagramsin that a first portion of the surface of a TSD 4810 that is provisionedfor an overlay 4820 that is placed thereon operates in accordance withuser interaction with the TSD 4810 in the location of the first portionof the surface of the TSD 4810 that includes the overlay 4020. However,in this embodiment 4800, touch sensing functionality within your regionsother than the overlay 4820 are disabled when the overlay 4820 isimplemented to facilitate user interaction in accordance with the TSD4810.

In this diagram, the sensitivity within the region of the overlay 4820operates based on knee based on the typical operational sensitivity ofthe TSD 4810. That is to say, the sensitivity within the region of theoverlay 4820 corresponding to the first portion of the surface of theTSD 4810 remains unchanged in this diagram.

FIG. 49 is a schematic block diagram of another embodiment 4900 of anoverlay that is operative with a TSD that is configured to performenable/disable based ROIP in accordance with the present invention. Thisdiagram includes some similarities to the previous diagram such thatsensitivity or touch sensing capability is disabled within regions ofthe remaining portion of the surface of the TSD 4810 other than wherethe overlay 4820 is located. However, in this diagram, sensitivity ortouch sensing capability within the region of the overlay 4820corresponding to the first portion of the surface of the TSD 4810 ismodified or adapted. The sensitivity within this first portion of thesurface of the TSD 4810 that is provisioned for the overlay 4820 may beincreased, decreased, etc.

For example, as described above with respect to other embodiments,examples, etc., fewer than all of the electrodes implemented within aTSD 4810 and specifically within the first portion of the surface of theTSD 4810 may be used while still facilitating user interaction with theoverlay 4820 and the TSD 4810. In general, the sensitivity within thefirst portion of the surface of the TSD 4810 may be modified differentlyat different times, such as increased at a first time, decreased at asecond time, etc.

FIG. 50 is a schematic block diagram of an embodiment 5000 of an overlayand a 3-D geometric object, which may or may not include TSDfunctionality, that are both operative with a TSD that is configured toperform enable/disable based ROIP in accordance with the presentinvention. This diagram has some similarities to the previous diagramswith at least one difference being that a second 3-D geometric object orTSD 5012 is also operative with the TSD 4810 as is the overlay 4820.

In this diagram, sensitivity or touch sensing capability is disabled inthe remaining regions of the surface of the TSD 4810 that are notassociated with the overlay 4824 the second 3-D geometric object or TSD5012.

FIG. 51 is a schematic block diagram of another embodiment 5100 of anoverlay and a 3-D geometric object, which may or may not include TSDfunctionality, that are both operative with a TSD that is configured toperform enable/disable based ROIP in accordance with the presentinvention. This diagram includes some similarities to the previousdiagram such that sensitivity or touch sensing capability is disabled inthe remaining regions of the surface of the TSD 4810 that are notassociated with the overlay 4824 the second 3-D geometric object or TSD5012. However, in this diagram, sensitivity or touch sensing capabilitywithin the region of the overlay 4820 corresponding to the first portionof the surface of the TSD 4810 and/or within the region corresponding tothe location of the second 3-D geometric object or TSD 5012 is modifiedor adapted. The sensitivity within this first portion of the surface ofthe TSD 4810 that is provisioned for the overlay 4820 and/or within theregion corresponding to the location of the second 3-D geometric objector TSD 5012 may be increased, decreased, etc.

Certain diagrams described below provide various embodiments, examples,etc. of interfaceable devices that include at least interfaceable TSDand one or more other devices. In some implementations, this includestwo or more fully independent and interfaceable TSDs. In otherimplementations, this includes one or more fully independent andinterfaceable TSDs and one or more fully dependent and interfaceabledevices. In yet other implementations, this includes one or more fullyindependent and interfaceable TSDs and one or more partially dependentand interfaceable devices. In even other implementations, this includesone or more fully independent and interfaceable TSDs, one or more fullydependent and interfaceable devices, and one or more partially dependentand interfaceable devices. Generally speaking, various implementationsmay be performed using interfaceable devices that include at leastinterfaceable TSD to operate in a variety of ways and to providescalability of the operational area that may be serviced by TSDfunctionality (e.g., by providing more than one device thereby extendingthe useful operational area of the system).

FIG. 52 is a schematic block diagram of various embodiments 5201, 5202,5203, and 5204 of TSDs that are configured to interface with one or moreother TSD and/or one or more other devices that include one or moreelectrodes in accordance with the present invention. In the upperleft-hand portion of the diagram, embodiment 5201 shows multiple DSCsthat couple via multiplexers to the respective row and column electrodesof a TSD. This provides MUX DSC servicing of the electrodes of the TSDsuch that a given DSC is configured to drive and simultaneously to senseone or more signals, including detecting any change(s) thereof, thatis/are provided to one or more electrodes based on the selection of theMUX (e.g., regarding to which electrodes the DSC is coupled to via theMUX at a given time).

In an example of operation and implementation, a first DSC is configuredto drive and simultaneously to sense a first one or more signals,including detecting any change(s) thereof, that is/are provided to afirst one or more electrodes at a first time, and that first DSC isconfigured to drive and simultaneously to sense a second one or moresignals provided to a second one or more electrodes at a second time.Also, a second DSC is configured to drive and simultaneously to sense athird one or more signals, including detecting any change(s) thereof,that is/are provided to a third one or more electrodes at a third time,and that second DSC is configured to drive and simultaneously to sense afourth one or more signals, including detecting any change(s) thereof,that is/are provided to a fourth one or more electrodes at a fourthtime. In some examples, the first time and the third time are the same,and the second time in the fourth time are the same. In other examples,the first time and the fourth time are the same, and the second time andthe third time are the same.

In another example of operation and implementation, a DSC that isconfigured coupled to certain electrodes via a MUX is operative suchthat the MUX is implemented to connect two or more electrodes togetherelectrically such that those two or more electrodes effectively operateas a single electrode. For example, in accordance with otherembodiments, examples, diagrams, etc. described herein, includingimplementations in which a TSD operates based on varying precision,sensitivity, etc., by electrically tying two or more electrodestogether, multiple electrodes may be driven and simultaneously sensetogether, such that they are not driven and simultaneously sensedindividually.

In some examples, a first DSC is configured to drive and simultaneouslyto sense a first signal provided to a first electrode at a first time,and that first DSC is configured to drive and simultaneously to sense asecond signal, including detecting any change thereof, that is providedto a second electrodes at a second time. Also, a second DSC isconfigured to drive and simultaneously to sense a third signal,including detecting any change thereof, that is provided to a thirdelectrode at a third time, and that second DSC is configured to driveand simultaneously to sense a fourth signal, including detecting anychange thereof, that is provided to a fourth electrode at a secondfourth time. In some examples, the first time and the third time are thesame, and the second time in the fourth time are the same. In otherexamples, the first time and the fourth time are the same, and thesecond time and the third time are the same.

In the upper right-hand portion of the diagram, embodiment 5202 showsmultiple DSCs that couple on a one-to-one basis to the respective rowand column electrodes of the TSD.

Also, with respect to the embodiment 5201 and/or the embodiment 5202,note that servicing of the respective electrodes of the TSD may beperformed from more than two sides of the TSD. For example, similarimplementations of DSCs with multiplexers may be implemented on theright hand side and/or bottom of the TSD of the embodiment 5201 inaddition to the DSCs with multiplexers that are implemented on theleft-hand side and top of the TSD of the embodiment 5201. That is tosay, any one or more electrodes of the TSD may be driven from bothdirections or both electrode ends as desired in certain alternativeembodiments.

For another example, similar implementations of DSCs implemented on aone-to-one basis may be implemented on the right hand side and/or bottomof the TSD of the embodiment 5202 in addition to the DSCs implemented ona one-to-one basis on the left-hand side and top of the TSD of theembodiment 5202. That is to say, any one or more electrodes of the TSDmay be driven from both directions or both electrode ends as desired incertain alternative embodiments.

Note that the use of DSCs that are coupled via multiplexers toelectrodes facilitates adaptive operation of the TSD, such as inaccordance with an implementation shown with respect to embodiment 5201.For example, any one or more of the electrodes that are coupled to theone or more DSCs via the multiplexers may be selected in accordance withenabling or disabling operation of a portion of the TSD, adapting thesensitivity of any portion of the TSD including increasing or decreasingthe sensitivity of any portion of the TSD, etc. With respect to animplementation in which DSCs are coupled to electrodes on a one-to-onebasis, such as in accordance with an implementation shown with respectto embodiment 5202, selectivity of which of those DSCs is functional andoperational may be performed in accordance with enabling or disablingoperation of a portion of the TSD, adapting the sensitivity of anyportion of the TSD including increasing or decreasing the sensitivity ofany portion of the TSD, etc. For example, those electrodes that are tobe enabled or disabled, turned on or turned off, etc., in accordancewith such operations, the desired one or more DSCs may be enabled ordisabled, etc.

In the lower left-hand portion of the diagram, embodiment 5203 shows avertical stack up or side view of DSCs that are coupled to row andcolumn electrodes. As can be seen, the DSCs are implemented below therow and column electrodes in this embodiment 5203. One or more DSCs arecoupled to one or more row electrodes, such as in accordance with theembodiment 5201 using multiplexers or embodiment 5202 on a one-to-onebasis, Also, one or more other DSCs are coupled to one or more columnelectrodes. such as in accordance with the embodiment 5201 usingmultiplexers or embodiment 5202 on a one-to-one basis. Note that one ormore dielectric layers may be implemented between the row and columnelectrodes to keep them from coming in direct contact with one another,yet facilitating capacitive coupling between them so that one or moresignals from the one or more row electrodes may be coupled into the oneor more column electrodes, and vice versa.

With respect to interface-ability of the various TSDs described withinthis diagram, in certain examples, the top and right-hand sides of theTSD are implemented to include male connector sides, and the left andbottom sides of the TSD are implemented to include female connectorsides. As such, different respective TSDs may be interfaced with oneanother based on the male/female connector interfaces (I/Fs) of thosedifferent respective TSDs, such that a male connector side interfaceswith female connector side. Alternatively, in other examples, the topand right-hand sides of the TSD are implemented to include femaleconnector sides, and the left and bottom sides of the TSD areimplemented to include male connector sides. Generally speaking, anydesired interface that facilitates connection, coupling, and/orcapacitive coupling between electrodes of different respective TSDs maybe used to interface-ability of TSDs to provide scalability of theoperational area that may be serviced by TSD functionality (e.g., byproviding more than one device thereby extending the useful operationalarea of the system).

As shown with respect embodiment 5204, note that the embodiments 5201,5202, and 5203, note that one or more respective electrodes are coupledrespectively to one or more DSCs, which may be on a one to one basissuch as with respect to embodiment 5202, or via a multiplexedimplementation such as with respect embodiment 5201. Also, the one ormore DSCs are coupled to one or more processing modules 42 that includesand/or is coupled to memory in accordance with other embodiments,examples, diagrams, etc. as described herein. A DSC is configured todrive and simultaneously to sense a signal, including detecting anychange thereof, that is provided to an electrode. The DSC is configuredto provide a signal to the one or more processing modules 42corresponding to at least one electrical characteristic of the electrodeand/or the signal that is provided to the electrode, including anychange of the signal. The one or more processing modules 42 isconfigured to process that signal received from the DSC to determine theat least one electrical characteristic of the electrode and/or thesignal.

FIG. 53A is a schematic block diagram of an embodiment 5301 of TSDs thatare interfaced in accordance with the present invention. In thisdiagram, two separate TSDs are interfaced together to form a touchsensor operative system that is larger than any one of the TSDs. In thisdiagram, the two separate TSDs are similar in size and shape, but notethat they may be of different size and shape in other embodiments,examples, etc.

Within this diagram, two respective TSDs are interfaced, such as basedon a male/female connector interface. Again, with respect to thisdiagram and any other diagram herein that shows two or more devicesinterfaced together, such interfacing may be implemented in any of avariety of ways including male/female connector interfaces (I/Fs) andgenerally any desired interface that facilitates connection, coupling,and/or capacitive coupling between electrodes of different respectivedevices.

With respect to the first TSD on the left-hand side, multiple DSCscouple via multiplexers to the respective column electrodes of the firstTSD, and other multiple DSCs couple via multiplexers to certain of therespective row electrodes of the first TSD. With respect to the secondTSD on the right-hand side, multiple DSCs couple via multiplexers to therespective column electrodes of the second TSD, and other multiple DSCscouple via multiplexers to certain of the respective row electrodes ofthe second TSD.

Being this diagram, the row electrodes of the first TSD and the secondTSD interface together, as can be seen by the red and blue colored rowelectrodes. The column electrodes of the first TSD and the second TSDare colored black. The column electrodes of the first TSD and the secondTSD did not interface together. They are serviced by the multiple DSCsthat are coupled via multiplexers to the column electrodes of the firstTSD in the second TSD, respectively.

In the implementation of this diagram, the row electrodes are shown asbeing serviced from both the DSCs on the left-hand side of the diagramcolored blue and the DSCs on the right-hand side of the diagram coloredred, both respectively coupled via multiplexers to the row electrodes ofthe first TSD and the second TSD, respectively. That is to say, the DSCson the left-hand side of the diagram and the right-hand side of thediagram, colored blue and red, respectively, both operate to drive andsimultaneously sense signals via the respective row electrodes from therespective ends of the row electrodes to the left of the first TSD andto the right of the second TSD, respectively.

In certain alternative implementations, note that the column electrodesmay be serviced from both ends of a device, such that one or moreadditional DSCs, such as coupled via multiplexers, may be implemented atthe bottom of the first TSD in the second TSD, respectively, such thatthe column electrodes of the first TSD and the second TSD are servicedfrom both ends.

Within this diagram and others that operate by servicing electrodes fromboth ends of a device, whether that is left and right, or top andbottom, note that different channels, frequencies, signals, etc. aredriven from the two ends of the device. For example, in this diagram,the signals provided from the blue colored DSCs on the left-hand side ofthe diagram operate using different channels, frequencies, signals, etc.then the red colored DSCs on the right-hand side of the diagram whenservicing the same electrodes.

FIG. 53B is a schematic block diagram of an embodiment 5302 of TSDs thatare interfaced in accordance with the present invention. This diagram issimilar to the previous diagram with at least one difference being thatDSCs on the left-hand side of the diagram that are colored blue onlyservice the blue colored row electrodes of the first TSD on theleft-hand side of the diagram, and the DSCs on the right-hand side ofthe diagram that are red colored only service the red colored rowelectrodes of the second TSD on the right-hand side of the diagram.Again, the respective row electrodes, both blue colored in red colored,are interfaced together such that the DSCs that are implemented toservice the blue or red colored row electrodes of one of the TSDs alsoservices those same colored row electrodes of the other TSD via theinterface between the first TSD and the second TSD.

For example, the blue colored DSCs on the left-hand side of the diagramthat service the blue colored row electrodes of the first TSD on theleft-hand side of the diagram also service the blue colored rowelectrodes of the second TSD on the right-hand side of the diagram viathe interface between the first TSD and the second TSD. Similarly, thered colored DSCs on the right-hand side of the diagram that serviced thered colored row electrodes of the second TSD on the right-hand side ofthe diagram also service the red colored row electrodes of the first TSDon the left-hand side of the diagram via the interface between the firstTSD and the second TSD.

FIG. 54A is a schematic block diagram of another embodiment 5401 of TSDsthat are interfaced in accordance with the present invention. In thisdiagram, four separate TSDs are interfaced together to form a touchsensor operative system that is larger than any one of the TSDs. In thisdiagram, a first two of the TSDs are similar in size and shape, and thetwo other of the TSDs are similar in size and shape yet of differentsize and shape than the first two of the TSDs.

In this diagram, the row and column electrodes of the interfaced TSDsare driven and simultaneously sensed from both ends such that a firstgroup of DSCs. For example, black colored DSCs are coupled viamultiplexers to the column electrodes of the top left and the top rightTSDs, and green colored DSCs are coupled via multiplexers to the columnelectrodes of the bottom left in the bottom right TSDs. Similarly, bluecolored DSCs are coupled via multiplexers to the row electrodes of thetop left and the bottom left TSDs, and red colored DSCs a couple viamultiplexers to the top right and bottom right TSDs.

Also, within this diagram and others that operate by servicingelectrodes from both ends of a device (e.g., FIG. 53A), whether that isleft and right, or top and bottom, note that different channels,frequencies, signals, etc. are driven from the two ends of the device.For example, in this diagram, the signals provided from the blue coloredDSCs on the left-hand side of the diagram operate using differentchannels, frequencies, signals, etc. then the red colored DSCs on theright-hand side of the diagram when servicing the same electrodes.Similarly, the signals provided from the black colored DSCs on the topof the diagram operate using different channels, frequencies, signals,etc. then the green colored DSCs on the bottom side of the diagram whenservicing the same electrodes.

FIG. 54B is a schematic block diagram of another embodiment 5402 of TSDsthat are interfaced in accordance with the present invention. Thisdiagram is similar to the previous diagram with at least one differencebeing that DSCs on the left-hand side of the diagram that are coloredblue only service the blue colored row electrodes of the top left TSDand the bottom left TSD, and the DSCs on the right-hand side of thediagram that are red colored only service the red colored row electrodesof the top right TSD and the bottom right TSD. Also, DSCs on the top ofthe diagram that are black blue only service the black colored columnelectrodes of the top left TSD and the top right TSD, and the DSCs onthe bottom of the diagram that are green colored only service the greencolored column electrodes of the bottom left TSD and the bottom rightTSD.

Again, the respective row electrodes, both blue colored in red colored,are interfaced together such that the DSCs that are implemented toservice the blue or red colored row electrodes of one of the TSDs (e.g.,top left and bottom left TSDs and top right and bottom right TSDs) alsoservices those same colored row electrodes of the other TSDs via theinterfaces between the TSDs. Similarly, the respective columnelectrodes, both black and green colored, are interfaced together suchthat the DSCs that are implemented to service the black or green coloredcolumn electrodes of one of the TSDs (e.g., top left and top right TSDsand bottom left and bottom right TSDs) also services those same coloredrow electrodes of the other TSDs via the interfaces between the TSDs.

For example, the blue colored DSCs on the left-hand side of the diagramthat serviced the blue colored row electrodes of the top left and bottomleft TSDs on the left-hand side of the diagram also service the bluecolored row electrodes of the top right and bottom right TSDs on theright-hand side of the diagram via the interfaces between the top leftTSD and the top right TSD as well as the bottom left TSD and the bottomright TSD, respectively. Similarly, the red colored DSCs on theright-hand side of the diagram that serviced the red colored rowelectrodes of the top right and bottom right TSDs on the right-hand sideof the diagram also service the red colored row electrodes of the topleft and bottom left TSDs on the left-hand side of the diagram via theinterfaces between the top left TSD and the top right TSD as well as thebottom left TSD and the bottom right TSD, respectively.

Similarly, the black colored DSCs on the top of the diagram and thegreen colored DSCs on the bottom of the diagram service respectively theblack colored column electrodes and the green colored column electrodesincluding the black colored column electrodes in the green coloredcolumn electrodes of the TSDs to which they are not particularly coupledvia the interfaces between the top left TSD and the bottom left TSD aswell as the top right TSD and the bottom right TSD, respectively.

FIG. 55 is a schematic block diagram of various embodiments 5501, 5502,5503, 5504, and 5505 of TSDs that are interfaced in accordance with thepresent invention. This diagram shows various ways in which TSDs may beinterfaced together to form a touch sensor operative system that islarger than any one of the TSDs. In this diagram, the differentrespective TSDs are shown as having a similar size and shape, yetdifferent respective TSDs, devices, etc. may be of different size andshape and other examples.

Embodiment 5501 shows two TSDs implemented side-by-side, on left andright. Alternatively, two TSDs could be implemented side-by-side, on topand bottom.

In addition, while many of the embodiments, examples, etc. herein showinterfacing of two or more TSDs such that they align with one anotheralong a particular edge, such as to TSDs having the same with and heightfor having the same width only, etc., note that an alternativeimplementation of interfacing two or more TSDs may be made such thatonly a portion of the TSDs are aligned with one another along aparticular edge. For example, less than a portion of a first TSD and thesecond TSD may be aligned along a given edge, such that only some, fewerthan all, of the row or column electrodes of the first TSD and thesecond TSD interface with one another and the other row or columnelectrodes do not interface with one another. For example, there may beinstances in which a non-symmetric touch sensor operative system isdesired. For example, consider embodiment 5502 in which fewer than allof the row electrodes of the first TSD in the second TSD interface withone another. This is one possible manner by which a non-symmetric touchsensor operative system may be implemented.

Embodiment 5503 shows four TSDs implemented in a 2×2 pattern formed atouch sensor operative system. Embodiment 5504 shows four TSDsimplemented in a cross pattern touch sensor operative system to form atouch sensor operative system. Embodiment 5505 shows two implementationsof touch sensor operative systems. For example, one implementationincludes three TSDs (TSD 1, 2, and 3) aligned in a row with respect toone another to form a first touch sensor operative system, and anotherimplementation includes six TSDs (TSD 1, 2, 3, 4, 5, and 6) aligned intwo rows and three columns with respect to one another to form a secondtouch sensor operative system. Generally speaking, any number of rowsand columns of TSDs may be implemented. Embodiment 5506 shows 8 TSDsimplemented in an alternative cross pattern to that of embodiment 5504to form a touch sensor operative system.

FIG. 56 is a schematic block diagram of other various embodiments 5601,5602, 5603, 5604, 5605, 5606, and 5607 of TSDs that are configured tointerface with one or more other TSD and/or one or more other devicesthat include one or more electrodes in accordance with the presentinvention.

In the upper left-hand portion of the diagram, embodiment 5601 showsDSCs that couple via multiplexers to the respective row and columnelectrodes, respectively, of a TSD. This provides MUX DSC servicing ofthe electrodes of the TSD such that a given DSC is configured to driveand simultaneously to sense one or more signals, including detecting anychange(s) thereof, that is/are provided to one or more electrodes basedon the selection of the MUX (e.g., regarding to which electrodes the DSCis coupled via the MUX at a given time). For example, this diagram showsa TSD with three row electrodes and four column electrodes servicerespectively by two DSCs that couple via multiplexers to the respectiverow and column electrodes, respectively, of a TSD.

In the upper right-hand portion of the diagram, embodiment 5602 showsmultiple DSCs that couple on a one-to-one basis to the respective rowand column electrodes of the TSD. For example, this diagram shows a TSDwith three row electrodes and four column electrodes servicedrespectively by seven DSCs.

Note that certain implementations of TSDs include more row electrodesand/or more column electrodes then shown in the embodiments 5601 and5602 as well as other diagrams included herein. These relatively smallnumber of row and column electrodes (e.g., three row electrodes and fourcolumn electrodes) implemented within TSDs are used for illustration. Incertain examples, a TSD includes tens, hundreds, thousands, etc. or aneven larger number of row electrodes and/or tens, hundreds, thousands,etc. or an even larger number of column electrodes.

In the bottom left-hand portion of the diagram, embodiment 5603 shows adevice that includes electrodes only. This is a fully dependent devicethat can be interfaced with one or more other devices such as a fullyindependent TSD, a partially dependent TSD, or another device thatincludes electrodes only. The device shown in the embodiment 5603provides yet another option for scalability of a touch sensor operativesystem including using components that are not individually active orindependent, yet when interfaced with an active device, either directlyor via an interface with one or more other devices, is operative toprovide a touch sensor operative system.

Embodiment 5604 shows a partially dependent TSD such that row electrodesare serviced by a DSC that is coupled via a multiplexer. The columnelectrodes of the partially dependent TSD of the embodiment 5604 aredependent and operative to facilitate scaling of a touch sensor capablework area when interfaced with an active device, either directly or viaan interface with one or more other devices.

Embodiment 5605 shows another partially dependent TSD such that the rowelectrodes are serviced by multiple DSCs that couple on a one-to-onebasis to the respective row electrodes of the partially dependent TSD.Similar to the embodiment 5604, the column electrodes of the partiallydependent TSD of the embodiment 5605 are dependent and operative tofacilitate scaling of a touch sensor capable work area when interfacedwith an active device, either directly or via an interface with one ormore other devices.

Embodiments 5606 and 5607 are similar to the embodiments 5604 and 5605,respectively, with the difference being that the column electrodes areserviced by one or more DSCs, and the row electrodes of these partiallydependent TSDs of the embodiments 5606 and 5607 are dependent andoperative to facilitate scaling of a touch sensor operative system wheninterfaced with an active device, either directly or via an interfacewith one or more other devices.

Generally speaking, a touch sensor operative system may be implementedin any of a variety of configurations using the various building blocksshown in this diagram of independent TSDs, dependent TSDs includingfully dependent or partially dependent TSDs. In an example of operationand implementation, at least one independent TSD is implemented withinthe system to facilitate active operation of a touch sensor operativesystem. That is to say, the at least one independent TSD is configuredto facilitate TSD operation and functionality for any one or moreelectrodes of a dependent or partially dependent TSD via coupling ofsignals from the at least one independent TSD to the one or moreelectrodes of the dependent or partially dependent TSD.

FIG. 57 is a schematic block diagram of various embodiments 5701, 5702,and 5703 of TSDs and/or one or more other devices that include one ormore electrodes that are interfaced in accordance with the presentinvention.

This diagram shows various possible ways in which the various buildingblocks shown in the previous diagram may be implemented to provide atouch sensor operative system of any desired size based on thescalability of their respective building blocks of the prior diagram.

For example, embodiment 5701 shows an implementation that includes a TSDselected from the embodiment 5601 or 5602 that is interfaced to the leftof a TSD that is selected from the embodiment 5606 or 5607. For example,the respective electrodes of the TSDs may be serviced by one or moreDSCs the coupled to the electrodes via one or more multiplexers or usingmultiple DSCs that couple on a one-to-one basis to the electrodes of theTSDs.

Embodiment 5702 shows an implementation that includes four respectiveTSDs. In the upper left hand corner of embodiment 5702 is a TSD selectedfrom the embodiment 5601 or 5602. In the upper right-hand corner of theembodiment 5702 is a TSD selected from the embodiment 5606 or 5607. Inthe lower left hand corner of the embodiment 5702 is a TSD selected fromthe embodiment 5604 or 5605. In the lower right-hand corner of theembodiment 5702 is a TSD selected from the embodiment 5603. Note thatthe TSD selected from the embodiment 5603 is a fully dependent devicethat includes electrodes only, yet is operational when interfaced withone or more of the other TSDs shown in the embodiment 5702.

Embodiment 5703 shows additional scalability of a touch sensor operativesystem using various building blocks as shown in the prior diagram. Inembodiment 5703, the upper left-hand corner includes a TSD selected fromthe embodiment 5601 or 5602. To the right of this TSD is another TSDselected from embodiment 5606 or 5607. Note that any number of one ormore additional TSDs selected from embodiment 5606 or 5607 may beimplemented to the right to extend the touch sensor operative system toany desired size. Extending down the left-hand most column of theembodiment 5703 or one or more TSDs selected from the embodiment 5604 or5605. Note that any number of one or more additional TSDs selected fromembodiment 5604 or 5605 may be implemented down the left-hand mostcolumn of the embodiment 5703 to extend the touch sensor operativesystem to any desired size. The lower right-hand portion of theembodiment 5703 includes any desired number of TSDs selected from theembodiment 5603. Again, note that the TSD selected from the embodiment5603 is a fully dependent device that includes electrodes only, yet isoperational when interfaced with one or more of the other TSDs shown inthe embodiment 5703.

Note that such embodiments, examples, etc. as shown herein with respectto the interfacing of different respective devices in accordance withgenerating a touch sensor operative system are not exhaustive of allpossible combinations, and the principles described herein a be used togenerate other tech sensor operative systems of any desired size,configuration, shape, etc.

It is noted that terminologies as may be used herein such as bit stream,stream, signal sequence, etc. (or their equivalents) have been usedinterchangeably to describe digital information whose contentcorresponds to any of a number of desired types (e.g., data, video,speech, text, graphics, audio, etc. any of which may generally bereferred to as ‘data’).

As may be used herein, the terms “substantially” and “approximately”provide an industry-accepted tolerance for its corresponding term and/orrelativity between items. For some industries, an industry-acceptedtolerance is less than one percent and, for other industries, theindustry-accepted tolerance is 10 percent or more. Other examples ofindustry-accepted tolerance range from less than one percent to fiftypercent. Industry-accepted tolerances correspond to, but are not limitedto, component values, integrated circuit process variations, temperaturevariations, rise and fall times, thermal noise, dimensions, signalingerrors, dropped packets, temperatures, pressures, material compositions,and/or performance metrics. Within an industry, tolerance variances ofaccepted tolerances may be more or less than a percentage level (e.g.,dimension tolerance of less than +/−1%). Some relativity between itemsmay range from a difference of less than a percentage level to a fewpercent. Other relativity between items may range from a difference of afew percent to magnitude of differences.

As may also be used herein, the term(s) “configured to”, “operablycoupled to”, “coupled to”, and/or “coupling” includes direct couplingbetween items and/or indirect coupling between items via an interveningitem (e.g., an item includes, but is not limited to, a component, anelement, a circuit, and/or a module) where, for an example of indirectcoupling, the intervening item does not modify the information of asignal but may adjust its current level, voltage level, and/or powerlevel. As may further be used herein, inferred coupling (i.e., where oneelement is coupled to another element by inference) includes direct andindirect coupling between two items in the same manner as “coupled to”.

As may even further be used herein, the term “configured to”, “operableto”, “coupled to”, or “operably coupled to” indicates that an itemincludes one or more of power connections, input(s), output(s), etc., toperform, when activated, one or more its corresponding functions and mayfurther include inferred coupling to one or more other items. As maystill further be used herein, the term “associated with”, includesdirect and/or indirect coupling of separate items and/or one item beingembedded within another item.

As may be used herein, the term “compares favorably”, indicates that acomparison between two or more items, signals, etc., provides a desiredrelationship. For example, when the desired relationship is that signal1 has a greater magnitude than signal 2, a favorable comparison may beachieved when the magnitude of signal 1 is greater than that of signal 2or when the magnitude of signal 2 is less than that of signal 1. As maybe used herein, the term “compares unfavorably”, indicates that acomparison between two or more items, signals, etc., fails to providethe desired relationship.

As may be used herein, one or more claims may include, in a specificform of this generic form, the phrase “at least one of a, b, and c” orof this generic form “at least one of a, b, or c”, with more or lesselements than “a”, “b”, and “c”. In either phrasing, the phrases are tobe interpreted identically. In particular, “at least one of a, b, and c”is equivalent to “at least one of a, b, or c” and shall mean a, b,and/or c. As an example, it means: “a” only, “b” only, “c” only, “a” and“b”, “a” and “c”, “b” and “c”, and/or “a”, “b”, and “c”.

As may also be used herein, the terms “processing module”, “processingcircuit”, “processor”, “processing circuitry”, and/or “processing unit”may be a single processing device or a plurality of processing devices.Such a processing device may be a microprocessor, micro-controller,digital signal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on hard coding of thecircuitry and/or operational instructions. The processing module,module, processing circuit, processing circuitry, and/or processing unitmay be, or further include, memory and/or an integrated memory element,which may be a single memory device, a plurality of memory devices,and/or embedded circuitry of another processing module, module,processing circuit, processing circuitry, and/or processing unit. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, cache memory, and/or any device that stores digital information.Note that if the processing module, module, processing circuit,processing circuitry, and/or processing unit includes more than oneprocessing device, the processing devices may be centrally located(e.g., directly coupled together via a wired and/or wireless busstructure) or may be distributedly located (e.g., cloud computing viaindirect coupling via a local area network and/or a wide area network).Further note that if the processing module, module, processing circuit,processing circuitry and/or processing unit implements one or more ofits functions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory and/or memory element storing thecorresponding operational instructions may be embedded within, orexternal to, the circuitry comprising the state machine, analogcircuitry, digital circuitry, and/or logic circuitry. Still further notethat, the memory element may store, and the processing module, module,processing circuit, processing circuitry and/or processing unitexecutes, hard coded and/or operational instructions corresponding to atleast some of the steps and/or functions illustrated in one or more ofthe Figures. Such a memory device or memory element can be included inan article of manufacture.

One or more embodiments have been described above with the aid of methodsteps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claims. Further, the boundariesof these functional building blocks have been arbitrarily defined forconvenience of description. Alternate boundaries could be defined aslong as the certain significant functions are appropriately performed.Similarly, flow diagram blocks may also have been arbitrarily definedherein to illustrate certain significant functionality.

To the extent used, the flow diagram block boundaries and sequence couldhave been defined otherwise and still perform the certain significantfunctionality. Such alternate definitions of both functional buildingblocks and flow diagram blocks and sequences are thus within the scopeand spirit of the claims. One of average skill in the art will alsorecognize that the functional building blocks, and other illustrativeblocks, modules and components herein, can be implemented as illustratedor by discrete components, application specific integrated circuits,processors executing appropriate software and the like or anycombination thereof.

In addition, a flow diagram may include a “start” and/or “continue”indication. The “start” and “continue” indications reflect that thesteps presented can optionally be incorporated in or otherwise used inconjunction with one or more other routines. In addition, a flow diagrammay include an “end” and/or “continue” indication. The “end” and/or“continue” indications reflect that the steps presented can end asdescribed and shown or optionally be incorporated in or otherwise usedin conjunction with one or more other routines. In this context, “start”indicates the beginning of the first step presented and may be precededby other activities not specifically shown. Further, the “continue”indication reflects that the steps presented may be performed multipletimes and/or may be succeeded by other activities not specificallyshown. Further, while a flow diagram indicates a particular ordering ofsteps, other orderings are likewise possible provided that theprinciples of causality are maintained.

The one or more embodiments are used herein to illustrate one or moreaspects, one or more features, one or more concepts, and/or one or moreexamples. A physical embodiment of an apparatus, an article ofmanufacture, a machine, and/or of a process may include one or more ofthe aspects, features, concepts, examples, etc. described with referenceto one or more of the embodiments discussed herein. Further, from figureto figure, the embodiments may incorporate the same or similarly namedfunctions, steps, modules, etc. that may use the same or differentreference numbers and, as such, the functions, steps, modules, etc. maybe the same or similar functions, steps, modules, etc. or differentones.

Unless specifically stated to the contra, signals to, from, and/orbetween elements in a figure of any of the figures presented herein maybe analog or digital, continuous time or discrete time, and single-endedor differential. For instance, if a signal path is shown as asingle-ended path, it also represents a differential signal path.Similarly, if a signal path is shown as a differential path, it alsorepresents a single-ended signal path. While one or more particulararchitectures are described herein, other architectures can likewise beimplemented that use one or more data buses not expressly shown, directconnectivity between elements, and/or indirect coupling between otherelements as recognized by one of average skill in the art.

The term “module” is used in the description of one or more of theembodiments. A module implements one or more functions via a device suchas a processor or other processing device or other hardware that mayinclude or operate in association with a memory that stores operationalinstructions. A module may operate independently and/or in conjunctionwith software and/or firmware. As also used herein, a module may containone or more sub-modules, each of which may be one or more modules.

As may further be used herein, a computer readable memory includes oneor more memory elements. A memory element may be a separate memorydevice, multiple memory devices, or a set of memory locations within amemory device. Such a memory device may be a read-only memory, randomaccess memory, volatile memory, non-volatile memory, static memory,dynamic memory, flash memory, cache memory, and/or any device thatstores digital information. The memory device may be in a form asolid-state memory, a hard drive memory, cloud memory, thumb drive,server memory, computing device memory, and/or other physical medium forstoring digital information.

While particular combinations of various functions and features of theone or more embodiments have been expressly described herein, othercombinations of these features and functions are likewise possible. Thepresent disclosure is not limited by the particular examples disclosedherein and expressly incorporates these other combinations.

What is claimed is:
 1. A touch sensor device (TSD) comprising: aplurality of TSD electrodes associated with a surface of the TSD,wherein at least one of an overlay that includes a first one or moremarker electrodes also being associated with a first region of thesurface of the TSD or a 3-D geometric object that includes a second oneor more marker electrodes also being associated with a second region ofthe surface of the TSD, or; a plurality of drive-sense circuits (DSCs)operably coupled to the plurality of TSD electrodes, wherein a DSC ofthe plurality of DSCs is operably coupled to receive a reference signaland to generate a TSD electrode signal based on the reference signal,wherein, when enabled, the DSC configured to: provide the TSD electrodesignal to a TSD electrode of the plurality of TSD electrodes andsimultaneously to sense a change of the TSD electrode signal based on achange of impedance of the TSD electrode caused by at least one ofcapacitive coupling between the TSD electrode and the first one or moremarker electrodes based on the overlay being associated with the firstregion of the surface of the TSD or capacitive coupling between the TSDelectrode and the second one or more marker electrodes based on the 3-Dgeometric object being associated with the second region of the surfaceof the TSD; and generate a digital signal that is representative of thechange of impedance of the TSD electrode; memory that stores operationalinstructions; one or more processing modules operably coupled to theplurality of DSCs and the memory, wherein, when enabled, the one or moreprocessing modules is configured to execute the operational instructionsto: process the digital signal to determine at least one of first one ormore characteristics of the overlay that is associated with the firstregion of the surface of the TSD, second one or more characteristics ofthe 3-D geometric object that is associated with the second region ofthe surface of the TSD, first user interaction with the overlay, andsecond user interaction with the 3-D geometric object; and generate adata signal that includes information corresponding to at least one ofthe first one or more characteristics of the overlay, the second one ormore characteristics of the 3-D geometric object, the first userinteraction with the overlay, and the second user interaction with the3-D geometric object; and a communication interface operably coupled tothe one or more processing modules, wherein, when enabled, thecommunication interface configured to support communications with acommunication device including to transmit a communication signal thatis based on the data signal to a computing device.
 2. The TSD of claim1, wherein, when enabled, the one or more processing modules isconfigured to execute the operational instructions to: generate thereference signal; and provide the reference signal to the DSC.
 3. TheTSD of claim 1, wherein the communication device further configured totransmit another communication signal that is based on the communicationsignal from the computing device to another computing device via one ormore network segments.
 4. The TSD of claim 3, wherein the one or morenetwork segments including at least one of a wireless communicationsystem, a wire lined communication system, a non-public intranet system,a public internet system, a local area network (LAN), a wireless localarea network (WLAN), a wide area network (WAN), a satellitecommunication system, a fiber-optic communication system, or a mobilecommunication system.
 5. The TSD of claim 1, wherein the communicationinterface configured to support at least one of wireless communicationsor wired communications with the computing device.
 6. The TSD of claim1, wherein the first one or more characteristics of the overlay includesone or more of: an outline of the overlay; locations of keys of theoverlay; a location of the overlay on the surface of the TSD; locationof the first one or more marker electrodes within the at least a portionof the surface of the TSD; a pattern of the first one or more markerelectrodes; a function of the overlay; a type of the overlay; or anorientation of the overlay.
 7. The TSD of claim 1, wherein the TSD is aportable device that includes an internal power source.
 8. The TSD ofclaim 1, wherein the plurality of TSD electrodes includes a first subsetof the plurality of TSD electrodes aligned in a first direction and asecond subset of the plurality of TSD electrodes that are separated fromthe first subset of the plurality of TSD electrodes by a dielectricmaterial and are aligned in a second direction.
 9. The TSD of claim 1,wherein: the TSD includes multiple sections; the TSD has a first shapewhen the multiple sections are implemented within a first configuration;and the TSD has a second shape when the multiple sections areimplemented within a second configuration.
 10. The TSD of claim 1,wherein the surface of the TSD includes at least one of a non-flatsurface or curved surface.
 11. The TSD of claim 1, wherein the DSC ofthe plurality of DSCs further comprises: a power source circuit operablycoupled via a single line to the TSD electrode, wherein, when enabled,the power source circuit is configured to provide an analog signal viathe single line coupling to the TSD electrode, and wherein the analogsignal includes at least one of a DC (direct current) component or anoscillating component; and a power source change detection circuitoperably coupled to the power source circuit, wherein, when enabled, thepower source change detection circuit is configured to: detect an effecton the analog signal that is based on an electrical characteristic ofthe TSD electrode; and generate the digital signal that isrepresentative of the change of impedance of the TSD electrode.
 12. TheTSD of claim 11 further comprising: the power source circuit including apower source to source at least one of a voltage or a current via thesingle line to the TSD electrode; and the power source change detectioncircuit including: a power source reference circuit configured toprovide at least one of a voltage reference or a current reference; anda comparator configured to compare the at least one of the voltage andthe current provided via the single line to the TSD electrode to the atleast one of the voltage reference and the current reference to producethe analog signal.
 13. A touch sensor device (TSD) comprising: aplurality of TSD electrodes associated with a surface of the TSD,wherein at least one of an overlay that includes a first one or moremarker electrodes also being associated with a first region of thesurface of the TSD or a 3-D geometric object that includes a second oneor more marker electrodes also being associated with a second region ofthe surface of the TSD, or; a plurality of drive-sense circuits (DSCs)operably coupled to the plurality of TSD electrodes, wherein a DSC ofthe plurality of DSCs is operably coupled to receive a reference signaland to generate a TSD electrode signal based on the reference signal,wherein, when enabled, the DSC configured to: provide the TSD electrodesignal to a TSD electrode of the plurality of TSD electrodes andsimultaneously to sense a change of the TSD electrode signal based on achange of impedance of the TSD electrode caused by at least one ofcapacitive coupling between the TSD electrode and the first one or moremarker electrodes based on the overlay being associated with the firstregion of the surface of the TSD or capacitive coupling between the TSDelectrode and the second one or more marker electrodes based on the 3-Dgeometric object being associated with the second region of the surfaceof the TSD; and generate a digital signal that is representative of thechange of impedance of the TSD electrode; memory that stores operationalinstructions; one or more processing modules operably coupled to theplurality of DSCs and the memory, wherein, when enabled, the one or moreprocessing modules is configured to execute the operational instructionsto: generate the reference signal; provide the reference signal to theDSC; process the digital signal to determine at least one of first oneor more characteristics of the overlay that is associated with the firstregion of the surface of the TSD, second one or more characteristics ofthe 3-D geometric object that is associated with the second region ofthe surface of the TSD, first user interaction with the overlay, andsecond user interaction with the 3-D geometric object; and generate adata signal that includes information corresponding to at least one ofthe first one or more characteristics of the overlay, the second one ormore characteristics of the 3-D geometric object, the first userinteraction with the overlay, and the second user interaction with the3-D geometric object; and a communication interface operably coupled tothe one or more processing modules, wherein, when enabled, thecommunication interface configured to support communications with acommunication device including to transmit a communication signal thatis based on the data signal to a computing device, wherein thecommunication device further configured to transmit anothercommunication signal that is based on the communication signal from thecomputing device to another computing device via one or more networksegments.
 14. The TSD of claim 13, wherein the one or more networksegments including at least one of a wireless communication system, awire lined communication system, a non-public intranet system, a publicinternet system, a local area network (LAN), a wireless local areanetwork (WLAN), a wide area network (WAN), a satellite communicationsystem, a fiber-optic communication system, or a mobile communicationsystem.
 15. The TSD of claim 13, wherein the communication interfaceconfigured to support at least one of wireless communications or wiredcommunications with the computing device.
 16. The TSD of claim 13,wherein the first one or more characteristics of the overlay includesone or more of: an outline of the overlay; locations of keys of theoverlay; a location of the overlay on the surface of the TSD; locationof the first one or more marker electrodes within the at least a portionof the surface of the TSD; a pattern of the first one or more markerelectrodes; a function of the overlay; a type of the overlay; or anorientation of the overlay.
 17. The TSD of claim 13, wherein: the TSDincludes multiple sections; the TSD has a first shape when the multiplesections are implemented within a first configuration; and the TSD has asecond shape when the multiple sections are implemented within a secondconfiguration.
 18. The TSD of claim 13, wherein the surface of the TSDincludes at least one of a non-flat surface or curved surface.
 19. TheTSD of claim 13, wherein the DSC of the plurality of DSCs furthercomprises: a power source circuit operably coupled via a single line tothe TSD electrode, wherein, when enabled, the power source circuit isconfigured to provide an analog signal via the single line coupling tothe TSD electrode, and wherein the analog signal includes at least oneof a DC (direct current) component or an oscillating component; and apower source change detection circuit operably coupled to the powersource circuit, wherein, when enabled, the power source change detectioncircuit is configured to: detect an effect on the analog signal that isbased on an electrical characteristic of the TSD electrode; and generatethe digital signal that is representative of the change of impedance ofthe TSD electrode.
 20. The TSD of claim 19 further comprising: the powersource circuit including a power source to source at least one of avoltage or a current via the single line to the TSD electrode; and thepower source change detection circuit including: a power sourcereference circuit configured to provide at least one of a voltagereference or a current reference; and a comparator configured to comparethe at least one of the voltage and the current provided via the singleline to the TSD electrode to the at least one of the voltage referenceand the current reference to produce the analog signal.